[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.
We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!
In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction
- Company:プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price:Other