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substrate Product List and Ranking from 566 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.

  1. アイン 本社工場 Nagano//Electronic Components and Semiconductors
  2. 共栄電資 Tokyo//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
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substrate Product ranking

Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.

  1. ceramics substrate(DPC substrate) アイン 本社工場
  2. Thin film circuit board (under development) アイン 本社工場
  3. Busbar for Data Centers - High Current Board 共栄電資
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 [Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation) ステイ電子機器 本社

substrate Product List

1861～1890 item / All 1944 items

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LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

LED signal lamp circuit board unit 'MR1105-24CBG' 110φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-24CBG' that we handle. It has been a best-selling product for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■Supply Voltage: DC24V ■Dimensions: 135mm square ■Inner Diameter: 110φ ■Number of LEDs: 80 ■Emission Color: Blue-green *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • substrate

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Corrosion prevention of electronic circuit boards through moisture-proof coating treatment for industrial machinery.

Corrosion prevention of electronic circuit boards through moisture-proof coating treatment for industrial machinery.

Protects electronic circuit boards of industrial machinery from moisture and extends product lifespan.

In the industrial machinery industry, the durability of electronic devices capable of withstanding harsh environments is required. In particular, in environments susceptible to humidity and condensation, the corrosion of electronic circuit boards is a significant factor leading to product failure and performance degradation. Our moisture-proof coating treatment protects electronic circuit boards from moisture and suppresses the effects of corrosion, contributing to the reliability and longevity of industrial machinery. 【Usage Scenarios】 - Industrial machinery used outdoors - Industrial machinery used in environments with drastic temperature changes - Industrial machinery used in high-humidity environments 【Benefits of Implementation】 - Prevents corrosion of electronic circuit boards, extending product lifespan - Improves product reliability - Reduces maintenance costs

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  • Other contract services
  • Surface treatment contract service
  • Circuit board design and manufacturing
  • substrate

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Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • substrate

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[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

[Power Supply Design Proposal Example] Consistent Support up to Electrical Operation Testing

From substrate to the development of various testing devices, we provide comprehensive support! We can reduce the burden on our customers!

Traditionally, when the manufacturer we had been outsourcing the production of power boards to went out of business, we received a request for board production from them. Until now, we had only outsourced visual inspections, and no electrical operation tests were conducted. Although the request was for board production, we proposed the development and manufacturing of an automatic testing device, as well as conducting electrical operation tests in-house. By providing a comprehensive solution, we were able to reduce the burden on our customers. [Case Overview] ■ Issue: The manufacturer we had been outsourcing to went out of business. ■ Proposal: Development and manufacturing of an automatic testing device, and conducting electrical operation tests in-house. ■ Result: Reduced the burden on customers through a comprehensive solution. *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Power Supply Circuit Board Pattern Design Handbook for the Automotive Industry

Power Supply Circuit Board Pattern Design Handbook for the Automotive Industry

Explaining the circuit board layout design that maximizes the performance of power ICs!

In the automotive industry, the miniaturization and high performance of electronic control units (ECUs) are essential for improving fuel efficiency and safety. The design of power supply boards is a crucial factor that influences the performance of ECUs, requiring noise countermeasures and efficient power supply. Appropriate pattern design is essential to solve these challenges and enhance product reliability. This document explains the key points of power supply board design for automotive power supply design engineers. 【Usage Scenarios】 - ECU design - In-vehicle electronic device design - Power supply design 【Benefits of Implementation】 - Improved product reliability through noise countermeasures - Enhanced power efficiency - Reduced design time

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Power Supply Circuit Board Design Handbook for Industrial Robots

Power Supply Circuit Board Design Handbook for Industrial Robots

Explaining the know-how of power supply board design that supports the operation of high-precision industrial robots.

In the industrial robot industry, stable operation of the power supply board is essential to achieve high-precision movements. In particular, for precise operations such as positioning and force control, noise countermeasures and stable power supply are crucial. Inadequate board design can lead to malfunctions and performance degradation. Our document, "Key Points in Pattern Design for Power Supply Boards," is compiled for power design engineers, summarizing the key points in the design of power supply boards. We will explain based on specific examples, so please utilize it during the actual design of power supply boards. 【Usage Scenarios】 * High-precision positioning control * Tasks using force sensors * High-speed and high-frequency operations 【Benefits of Implementation】 * Improved operational accuracy of robots * Reduced risk of malfunctions * Enhanced product reliability

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Power Supply Circuit Board Design Handbook for Home Appliances

Power Supply Circuit Board Design Handbook for Home Appliances

Condensing know-how in power supply board design to support the realization of energy-saving home appliances.

In the home appliance industry, energy-saving performance is a crucial factor that influences product competitiveness. The design of power supply boards significantly affects the power consumption of home appliances, making it essential to achieve efficient power supply. Inadequate board design can increase power loss and potentially reduce the energy-saving performance of the product. Our document, "Key Points in Pattern Design for Power Supply Boards," summarizes important considerations for board design aimed at achieving energy-efficient appliances, specifically for power design engineers. 【Usage Scenarios】 * Development of home appliances requiring energy-saving performance * When looking to improve the design efficiency of power supply boards * Aiming for product miniaturization and high performance 【Benefits of Implementation】 * Realization of energy-saving performance through improved power efficiency * Enhanced product reliability * Shortened design period

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Railway Power Supply Circuit Board Design Handbook

Railway Power Supply Circuit Board Design Handbook

Condensing the know-how of power supply board design that supports the safety of railway systems.

In the railway industry, the reliability of power supply boards is extremely important for ensuring safety. Particularly in signal systems and control systems, which influence the stability of operations, design flaws in power supply boards can lead to serious accidents. This document explains the key points of board layout to maximize the performance of power ICs and contribute to safe railway operations. 【Usage Scenarios】 * Railway signal systems * Operation management systems * Emergency power supply systems 【Benefits of Implementation】 * Improved system reliability * Reduced accident risk * Realization of stable railway operations

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Power Supply Circuit Design Handbook for Wearable Devices

Power Supply Circuit Design Handbook for Wearable Devices

Free technical documentation to support the miniaturization and high performance of wearable devices!

In the wearable device industry, miniaturization and power efficiency are critical challenges. In particular, a circuit board layout that maximizes the performance of power ICs is required within limited space. Improper pattern design can lead to noise generation and reduced efficiency, potentially adversely affecting device performance and battery life. Our "Key Points of Pattern Design in Power Boards" provides specific know-how to address these challenges based on case studies specialized in the design of wearable devices. This material will assist power design engineers in achieving optimal circuit board layouts for wearable device design. 【Usage Scenarios】 * Small wearable devices * Battery-powered devices * High-density mounted circuit boards 【Benefits of Implementation】 * Improved device stability through noise countermeasures * Extended battery life through improved power efficiency * Achieving both miniaturization and high performance

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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[Concerns about Device Assembly] The circuit board is too thick and is warping.

[Concerns about Device Assembly] The circuit board is too thick and is warping.

Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum part ■ Dramatically improves the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Responding to large new orders! Strengthening the production system for transformer-reactor components and control boards.

We would like to introduce a case where Diamond Electric Holdings (Japan) expanded its business in the automotive and air conditioning markets by establishing a presence in the United States and Mexico. In 2021, the company expanded its subsidiary, Diamond Electric Manufacturing (WV) in the United States, and in 2023, it established a subsidiary in Mexico as a subsidiary of Diamond Electric Manufacturing in the U.S., strengthening the production system from transformer reactor components to control boards. The reason for the expansion is to respond to large new orders from several domestic automobile manufacturers in the U.S. [Case Overview (Partial)] ■ Location: Eleanor, WV ■ Area: 37,000 sqft. ■ Expansion Investment Amount: $3.74 million ■ New Equipment Investment Amount: $18.61 million *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts
  • substrate

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[Case Study] Request for substrate repair from a major chemical manufacturing plant.

[Case Study] Request for substrate repair from a major chemical manufacturing plant.

Leave all your substrate troubles to us! [On-site support available]

Here is a case study of our response to a circuit board repair request from a major chemical manufacturing plant! 【Situation at the time of request】 The production line was halted due to a malfunctioning circuit board. 【Inquiry details】 The customer had identified the location of the issue and requested a circuit board repair. 【Response】 Since the faulty circuit board was already known, it was sent to us for analysis. We conducted a failure diagnosis, repaired the circuit board, and then mailed it back to the customer for them to confirm its operation. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

We also support circuit board repairs for discontinued products (EOS/EOSL products)!

We would like to introduce a case where we handled a request for the duplication of a circuit board that could not receive manufacturer support due to bankruptcy! 【Inquiry Details】 We received a request for a spare circuit board for a production line circuit board from a manufacturer that has already gone bankrupt and can no longer provide support. 【Response】 The circuit board was sent to us, and we used PinPoint in-house to analyze and restore the circuit board. We completed this in approximately one month! If you have any concerns, please feel free to contact us first.

  • Printed Circuit Board
  • substrate

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Impedance control board

Impedance control board

Impedance control board

We will design to match the necessary impedance values and ensure compatibility during the circuit board manufacturing process.

  • others
  • substrate

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IVH substrate

IVH substrate

IVH substrate

In prototype boards, the IVH method may be cheaper and have shorter lead times than build boards. We can provide a proposal in the quotation materials.

  • others
  • substrate

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Electrode growth substrate

Electrode growth substrate

Electrode growth substrate

It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.

  • others
  • substrate

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Copper inlay substrate

Copper inlay substrate

Copper inlay substrate

By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.

  • others
  • substrate

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Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

We have a track record of various custom boards for semiconductor testers.

  • others
  • substrate

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Ultra-low transmission loss substrate (MEGTRON6)

Ultra-low transmission loss substrate (MEGTRON6)

Ultra-Low Transmission Loss Substrate (MEGTRON6)

Design will be conducted using high-frequency substrates and high-speed transmission substrates.

  • others
  • substrate

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Prototyping and implementation achievements of various charger-related printed circuit boards.

Prototyping and implementation achievements of various charger-related printed circuit boards.

We would like to introduce our achievements in the production of various charger-related printed circuit boards. *For waterproof and dustproof measures for mounted boards!

Our company has a wealth of experience in manufacturing handheld processing equipment, charger circuit boards, memory card charger circuit boards, EV charging device control circuit boards, and more. Tojo Manufacturing offers one-stop total support from prototype printed circuit boards to final assembly. Please feel free to consult us if you have any concerns regarding delivery times or quality. 【Manufacturing Achievements】 ■ Handheld processing equipment and charger circuit boards ■ Memory card charger circuit boards ■ EV charging device control circuit boards, etc. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • substrate

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Technical Document on Solder Resist Formation for Drones

Technical Document on Solder Resist Formation for Drones

Presenting technical documentation on solder resist technology that contributes to improving the environmental resistance of drones!

In the drone industry, high durability and reliability are required, making the environmental performance of circuit boards crucial. In particular, circuit boards that can withstand harsh environments such as temperature changes, vibrations, and humidity are essential. The proper selection and formation of solder resist contribute to solving these challenges. Our materials on solder resist formation technology are helpful in improving the reliability of drones. 【Usage Scenarios】 - Outdoor flight - Environments with significant temperature fluctuations - Environments with high vibrations 【Benefits of Implementation】 - Improved protection performance of circuit boards - Extended product lifespan - Reduced risk of failure

  • Printed Circuit Board
  • substrate

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[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction

  • Printed Circuit Board
  • substrate

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【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!

In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization

  • Printed Circuit Board
  • substrate

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【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction

  • Printed Circuit Board
  • substrate

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A substrate that dissipates heat faster for industrial robots.

A substrate that dissipates heat faster for industrial robots.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to high precision.

In the industrial robot industry, thermal management of circuit boards is crucial for achieving high-precision movements. In particular, densely mounted electronic components tend to generate heat, which poses risks of performance degradation and failure due to heat. If thermal management is insufficient, the accuracy of the robot's movements may decline, negatively impacting product quality and production efficiency. Our "faster heat-dissipating circuit board" provides materials explaining the structural comparison of thermal vias and copper pins, as well as the effects of changing TH fillers, supporting the high precision of industrial robots by offering high thermal conductivity circuit boards. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Welding robots needing precise control - Conveying robots requiring high-speed operation 【Benefits of Implementation】 - Solving thermal issues of circuit boards to achieve stable robot operation - Improving product quality and yield - Reducing maintenance costs

  • Printed Circuit Board
  • substrate

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A substrate that dissipates heat faster for power electronics.

A substrate that dissipates heat faster for power electronics.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Supporting high output.

In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity

  • Printed Circuit Board
  • substrate

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