We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 563 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1771～1800 item / All 1907 items

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[Market Report] Global Market for Ceramic Balls

[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

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  • substrate

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[Market Report] Global Market for Ceramic Substrates

[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

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OKI Circuit Technology Implementation Services

OKI Circuit Technology Implementation Services

Combining OKI's technology and skills with your products to realize the development of new products! Please feel free to consult with us.

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • substrate

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Proposal for thermal management of electronic devices and solutions for heat dissipation.

Proposal for thermal management of electronic devices and solutions for heat dissipation.

Mass production of copper coin printed circuit boards is possible for high multilayer substrates that require heat dissipation and thermal management. High heat dissipation is achieved with a uniquely developed copper coin structure.

Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing
  • substrate

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【OMRON：C500-IA121】

【OMRON：C500-IA121】

【Support for Electronic Component Procurement】 We support the urgent procurement of discontinued products (EOL products) and hard-to-obtain electronic components and semiconductors! We have established a thorough inspection system.

Are you looking for this model number product? ■Manufacturer: OMRON ■Model number: C500-IA121 Owen Corporation swiftly procures electronic components that have become difficult to obtain due to production discontinuation or delivery issues from a global network. We will definitely issue a quotation, so you can confirm the details before placing an order, providing peace of mind. A veteran inspector who has monitored market distribution inventory for over 20 years conducts inspections, and only products that pass inspection are shipped. All delivered items include an inspection report. 【Our Inspection System】 ■X-ray Inspection Non-destructive testing to check internal structures and detect counterfeit or inferior products. ■Microscope Carefully checks for lead bending and any discrepancies in printed fonts. ■Digital Caliper Measures dimensions to the hundredth of a millimeter to detect cleverly crafted counterfeits. ■Curve Tracer Displays the voltage and current characteristic waveforms between terminals on the screen to detect defective products. ★Please visit our website from the link below. ★You can view our company brochure from the download button below. ▼For other model numbers you can inquire about, please refer to the lineup below.

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Linkstech YGA Corporation

Linkstech YGA Corporation

Manufacturing and sales of printed circuit boards and mold manufacturing.

Yamagishi AIC Co., Ltd. has been engaged in the manufacturing of distinctive printed circuit boards, such as metal base wiring boards, since its establishment in 1956, anticipating the demands of the times and providing products that meet customer needs, thereby advancing its business development. In line with the corporate vision of Hitachi Chemical Co., Ltd., which states, "With the courage and spirit of challenge to step into unknown territories, we create 'new value' ahead of the times, swiftly providing optimal solutions to various challenges faced by our customers and society," we operate under the slogan "Working On Wonders" and will continue to propose attractive new products to our customers. Furthermore, all employees of our company pledge to deeply recognize that the corporation is a member of society and to strive for the realization of a richer society through CSR (Corporate Social Responsibility), harmony with the environment, and proactive social contribution activities.

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Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)

Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)

Development Status and Market Outlook of 2008 Next-Generation COF (New Etching/Semi-Additive/Low CTE-PI)

LCD panels have grown the market due to high image quality and low prices. There is also a strong demand for these requirements in related components, and naturally, low cost and high functionality are also required for LDI and COF. To address these somewhat conflicting needs, next-generation COF technology is becoming essential.

  • Other semiconductors
  • LCD display
  • Printed Circuit Board
  • substrate

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"Cost reduction with minimal initial investment" capable of handling everything from prototype circuit boards to mass production.

"Cost reduction with minimal initial investment" capable of handling everything from prototype circuit boards to mass production.

"We want to keep costs down, but we don't want to compromise on the quality of the circuit board." We will respond to such requests! We will help reduce costs with minimal initial investment.

At PC Electronics, we cover the entire process of electronic components, from product development to rapid parts procurement, printed circuit board manufacturing, circuit design, assembly, production, and quality control. Moreover, we can assist in cost reduction with minimal initial investment. Please check as conditions may vary depending on quantity and specifications. Additionally, because we are not only responsible for a part of the process but also have a comprehensive understanding of all stages, we maintain a quality that you can trust. We provide flexible support from any stage while achieving high quality. If you have requests to reduce costs while maintaining the quality of the circuit boards, please feel free to consult with us! *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Plax Inc. Company Profile

Plax Inc. Company Profile

We respond to various customer needs with detailed services from development to manufacturing! We can accommodate requests from any stage of the process.

Plax provides consistent support from prototype development to mass production of electronic devices. We respond to various requests, including electronic device development, printed circuit board design, simulation, board manufacturing, component procurement, prototype assembly, and mass production assembly. Please feel free to contact us when you need our services. 【One-Stop Solution for Electronic Device Development】 1. Electronic device development 2. Printed circuit board design and simulation 3. Board manufacturing 4. Component procurement 5. Prototype assembly 6. Mass production assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Prototype Services
  • substrate

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Film for polyimide film substrate coverlay.

Film for polyimide film substrate coverlay.

Film for polyimide film substrate coverlay.

■It has excellent heat resistance to soldering and can sufficiently withstand the flow soldering process, making it suitable for a wide range of electronic components. ■It has excellent electrical properties. ■It has excellent flexibility. ■There is little resin flow during pressing.

  • Printed Circuit Board
  • substrate

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Materials for multilayer printed circuit boards

Materials for multilayer printed circuit boards

"Nickaplex" - Material for multilayer printed circuit boards of the short-time molding type.

■ Due to its short-time molding type, productivity can be improved. ■ It can adapt to a wide range of molding conditions. ■ It can be supplied in roll shape.

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Melting point capillary

Melting point capillary

We will manufacture glass capillary tubes in the desired size for use with melting point testers and similar equipment.

Our company sells capillaries for melting point determination with an outer diameter of 1.5 mm, an inner diameter of 1.0 mm, and lengths of 120 mm and 80 mm, processed with one end sealed, but we can also manufacture other sizes. If you have any inquiries regarding glass capillaries, please contact us.

  • Glassware and containers
  • substrate

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Printed circuit board aluminum heat sink board

Printed circuit board aluminum heat sink board

Similar to metal base substrates, layer configurations such as 2-layer and 4-layer can also be produced.

The thickness, height, pitch, and shape of the fins can be ordered freely. Additionally, depending on the specifications of the parts, the type of insulation layer can be selected. 1.8W: 3W: 6.5W: 12W → Please select from four types. (FR-5 is also possible.) Both sides of the circuit section can be multilayered and support high current. (It is also possible to combine with high current boards using our patented method.) We also support mass production and component mounting.

  • Printed Circuit Board
  • substrate

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Electrostatic Visualization Monitor 【*Demo units available for loan!】

Electrostatic Visualization Monitor 【*Demo units available for loan!】

Real-time monitoring of charge amount! You can easily see the charging status and the effectiveness of static elimination!

The "Static Electricity Visualization Monitor" is a device that allows real-time monitoring of static electricity charge levels that cannot be seen with the naked eye. With multiple sensors, it can capture static electricity on a surface without moving the sensors, ensuring that charged areas are not overlooked and allowing for confirmation of charging states and the effectiveness of discharge. *Limited to Ipros users! Free demo units available for loan! For more details, please inquire using the form below. 【Features】 ■ Displays charge levels with variations in color intensity (red for +, blue for -)! ■ Visualizes static electricity charge levels using "color and numerical values"! ■ Easy to carry with one hand! *For more details, please contact us or download the catalog to view.

  • Other measurement, recording and measuring instruments
  • substrate

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Densitron WVGA LCD LED Backlight Power Supply Board

Densitron WVGA LCD LED Backlight Power Supply Board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-4(D3)" is an LED backlight power supply board for WVGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses a device with built-in overvoltage protection, so the device is protected even if the LED becomes disconnected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • substrate

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[Data] WTI Blog October 2021

[Data] WTI Blog October 2021

Introducing points to consider in cardboard box design - Line Pattern Edition!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from October 5, 2021, to October 26, 2021. It introduces topics such as "Points to Consider in High-Frequency Circuit Design Using Surface-Mount Devices" from October 5, 2021, "Studying Circuit Board Design! (In-House Antenna Course Edition)" from October 19, 2021, and "Leave Hardware and Software Embedded Development to Us" from October 26, 2021. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ October 5, 2021: Points to Consider in High-Frequency Circuit Design Using Surface-Mount Devices ■ October 12, 2021: Key Points to Consider in Cardboard Box Design – Line Drawing Edition ■ October 19, 2021: Studying Circuit Board Design! (In-House Antenna Course Edition) ■ October 26, 2021: Leave Hardware and Software Embedded Development to Us *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] Shirutoku Report No. 15 #Substrates and Applications

[Data] Shirutoku Report No. 15 #Substrates and Applications

Explanation of the types and uses of substrates! In particular, we will introduce the types of rigid substrates.

★★Shirutoku Report: Useful Information You Can Benefit From★★ The design values and finished values for wiring widths and layer spacing differ depending on the type of circuit board and manufacturing methods (such as subtractive methods, semi-additive methods, etc.). In this report, we will introduce the different types of circuit boards available. Additionally, WTI offers various types of circuit board design and prototyping services. Please feel free to reach out to us. 【Contents】 ■ Types of Circuit Boards and Their Applications *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Prototype Services
  • Printed Circuit Board
  • substrate

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[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

What criteria should be used for selecting components? Introducing the selection criteria for LNA!

★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Where are transparent substrates used?

Where are transparent substrates used?

They are widely adopted in automotive products, amusement products, digital home appliances, and more!

Transparent substrates are active in various products. However, the characteristics of transparent substrates make them inconspicuous, so they can be difficult to find unless you are aware of them. Specifically, they are used in wearable products, home appliances, and communication and office equipment. [Examples of Adoption] - Denso-made headlamp heater - Windshield heater *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Introduction to Fair Process] Parts Procurement/Implementation

[Introduction to Fair Process] Parts Procurement/Implementation

Resistors and capacitors are generally kept in stock! We are striving to improve manufacturing quality.

Our company conducts research that takes into account not only price but also availability. We explore various routes, including domestic authorized distributors and overseas market inventories, and propose appropriate procurement methods based on our customers' production plans. Additionally, we carry out special processing such as hand soldering by skilled technicians, pattern cutting, and adding jumper wires, as well as SMT component mounting using cream solder printers, automatic mounters, and reflow ovens. 【Other process examples (excerpt)】 ■ Product planning ■ Circuit design ■ CPU firmware design ■ FPGA design ■ Mechanical design *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
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Printed circuit board design: analog boards, power boards, single-sided boards.

Printed circuit board design: analog boards, power boards, single-sided boards.

We accept artwork design for various types of PCBs, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

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