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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

871～885 item / All 1843 items

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[Development Case] Customization of Open Source Hardware

[Development Case] Customization of Open Source Hardware

Add functions to a single circuit board in the right place for the right purpose! You can create a product that can be programmed freely!

By synthesizing circuits that worked well on a breadboard and connecting shield boards with sockets without using them in an unstable state, we can create a stable and practical specification on a single board. Our company has development examples where we created a composite board for Arduino MEGA and ESP32 (WROOM), various relays, and a prototype joystick control device, which were then housed in a case for use in the field. Using open-source hardware, we can design and manufacture boards that serve as cost-effective alternatives to control devices with just the right size and functionality. Please feel free to contact us when you need assistance. [Development Case Overview] ■ Composite board for Arduino MEGA, ESP32 (WROOM), and various relays ■ Prototype joystick control device converted to a board and housed for field use *For more details, please refer to the PDF materials or feel free to contact us.

  • Other embedded systems (software and hardware)

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Parallel plane substrate

Parallel plane substrate

We can accommodate all types of optical processing lenses.

Special processing: drilling, grooving, cutting, special free-form shapes. Precision grinding of optical lenses, prisms, cylindrical lenses, flat substrates, laser bases, optical mirror lenses, optical filter lenses, and other precision processing of laser optical systems, sensor systems, and medical/measurement optical systems.

  • others
  • Microscope
  • Glass

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Wedge substrate

Wedge substrate

We support all types of optical processing lenses.

Special processing: drilling, grooving, cutting, special free-form shapes. Precision grinding of optical lenses, prisms, cylindrical lenses, flat substrates, laser bases, optical mirror lenses, optical filter lenses, and other precision machining for laser optical systems, sensor systems, and medical/measurement optical systems.

  • others
  • Microscope
  • Glass

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Lead-free compatible long lead component soldering device 'LMFS-400'

Lead-free compatible long lead component soldering device 'LMFS-400'

Cost reduction of dedicated nozzles! The cast solder pot prevents corrosion from lead-free solder.

The "LMFS-400" is a soldering device that can handle processes from partial dip to full dip using a 4-axis peel-back mechanism. By adopting a high-performance (low pressure, fine particle) spray nozzle, it achieves a coating efficiency of over 70% and good through-hole fill. After soldering, cooling fans are placed in two locations: the descending lifter section and the bottom return conveyor section. 【Features】 ■ Spray Fracture ■ Preheating ■ Soldering ■ Cooling ■ Monitor *For more details, please refer to the PDF document or feel free to contact us.

  • LMFS1.PNG
  • LMFS2.PNG
  • LMFS3.PNG
  • Soldering Equipment

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New feature "IPH" added to Selective Flow (such as Tacrolimus).

New feature "IPH" added to Selective Flow (such as Tacrolimus).

Solve the long-awaited issue of insufficient through-hole ups! Effectively heat the necessary areas for soldering.

The "IPH (Induction Heating Preheat Function)" is based on proven heating nitrogen (N2) and point flow methods, and combined with induction heating (IH) preheating, it can efficiently heat and solder patterns and electrodes with large thermal capacities. With heated N2, through-hole ups that typically take time can be completed in a short period. It avoids insufficient heating, reduces solder temperature bath temperatures, and allows for transition to small-diameter nozzles. 【Features】 ■ Heats (generates heat) the patterns or electrode leads that need to be heated ■ IPH On/Off settings and On time can be configured for each step ■ Significantly reduces thermal stress on surrounding components *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment

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Recording and playing back soldering videos of defective substrates Soldering EYE

Recording and playing back soldering videos of defective substrates Soldering EYE

Data search with a barcode! Record and play back soldering videos of defective circuit boards.

We would like to introduce our product, "Soldering EYE." All soldering images are recorded and saved to a NAS. Production management data can be searched using barcodes, allowing for visual selection by clicking on the desired area. Please feel free to contact us when you need assistance. 【Features】 ■ Video recording of each step with a camera ■ Data searchable by barcode ■ Click on defective areas to play the video ■ Image data is saved to NAS *For more details, please download the PDF or feel free to contact us.

  • Other image-related equipment

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Large size printed circuit board manufacturing / Work size up to 1M x 1.2M

Large size printed circuit board manufacturing / Work size up to 1M x 1.2M

Are you having trouble with large-sized PCB manufacturing for small roads?

Our company specializes in the manufacturing of large-sized printed circuit boards.

  • Printed Circuit Board

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AC fan controller circuit board

AC fan controller circuit board

The fixed voltage is AC100V, AC200V! The variable range can also be set arbitrarily on the board using a VR for the AC fan controller board.

This product is an AC fan controller board that allows for easy stepless speed variation of AC fan motors. The rated voltage is AC100V and AC200V. The variable range can also be set arbitrarily using the VR on the board, enabling easy speed variation for the kumatori motor. Simply insert the terminal of the lead wire into the terminal block and connect the optional potentiometer to use it. 【Features】 ■ Easily vary the speed of kumatori motors ■ Rated voltage is AC100V and AC200V ■ Variable range can be set arbitrarily using the VR on the board ■ Easy connection of power input and output with terminal block installation *For more details, please refer to the PDF document or feel free to contact us.

  • controller
  • fan
  • others

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract

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Electronic circuit board

Electronic circuit board

Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

  • Printed Circuit Board
  • Organic Natural Materials
  • Ceramics

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Substrate, submount substrate

Substrate, submount substrate

Substrate, submount substrate

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

  • Other semiconductors
  • Printed Circuit Board
  • Ceramics

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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