We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 563 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1711~1740 item / All 1907 items

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Circuit board design achievements

Numerous design experiences, including automotive boards, amusement development boards, transportation equipment boards, and IC evaluation boards!

We provide high-quality pattern design tailored to our customers' needs at a low cost. We have extensive experience in designing various types of boards, including automotive boards, video equipment boards, image processing boards, amusement development boards, LCD panel boards, transportation equipment boards, audio equipment boards, measurement equipment boards, computer peripheral boards, and IC evaluation boards. Please feel free to consult us when you need our services. 【Design Achievements】 ■ Automotive boards, video equipment boards, image processing boards, amusement development boards ■ LCD panel boards, transportation equipment boards, audio equipment boards, measurement equipment boards ■ Computer peripheral boards, IC evaluation boards, high-speed communication boards, medical device boards ■ Home appliance boards, power supply boards, lighting equipment boards, high-frequency boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Special substrate

We have various design achievements such as thick copper foil substrates, high aspect ratio substrates, and copper inlay substrates!

At Arcel Design, we also accommodate special substrates. We have design achievements in through resin-filled substrates, IVH substrates, thick copper foil substrates, high-frequency substrates, high-aspect substrates, back-drill substrates, copper-inlay substrates, and build-up substrates. Please feel free to consult us when you need assistance. 【Design Achievements (Partial)】 ■ Through resin-filled substrates ■ IVH substrates ■ Thick copper foil substrates ■ High-frequency substrates ■ High-aspect substrates *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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High-frequency substrate

High-frequency substrate

For high-frequency substrates (with proven results above 24GHz) and high-speed transmission substrates (with proven results above 40Gbps), we can accommodate proposals for layer composition and materials (MEG6) considering the components mounted on the substrate and their density.

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High-density substrate

High-density substrate

We will propose and accommodate ultra-high-density designs, such as setting the space between components like CR to 0.3mm, using through-hole substrates, build-up/IVH, and through resin filling specifications.

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Single-sided board

Single-sided circuit board

We have many achievements with single-sided boards in mass-produced substrates for people's livelihoods.

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Power supply board

Power supply board

We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.

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Flexible circuit board

Flexible circuit board

We can accommodate everything from single-sided flexible printed circuit boards to multi-layer flexible printed circuit boards, including assembly.

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BGA conversion board

BGA conversion board

In cases where you want to replace a BGA, it is possible to create a conversion board and design a BGA board that mounts a different BGA on the board.

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Through-hole resin-filled substrate

Through-hole resin-filled substrate

This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.

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Back drill substrate

Back drill substrate

To eliminate stubs in high-speed signals, we will remove the unnecessary plating of the VIA using back drilling.

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Copper-based substrate

Copper-based substrate

You can achieve an even greater heat dissipation effect. We can provide a quote including manufacturing as well.

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Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

We have a wealth of experience in designing narrow pitch BGA mounted boards. Regarding board manufacturing, we will select and propose manufacturers that are capable of production.

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Prototype and assembly achievements of printed circuit boards related to measuring devices.

We would like to introduce our achievements in the production of printed circuit boards related to measuring instruments. *For waterproof and dustproof measures for mounted boards!

Our company has a track record in the production of circuit boards for various measuring instruments and other LCD assembly. Tojo Manufacturing offers one-stop total solutions from prototype printed circuit boards to final assembly. If you are facing issues with delivery times or quality, please feel free to consult with us. [Achievements] ■ Production of circuit boards for various measuring instruments ■ Other LCD assembly, etc. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • substrate

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Prototype and assembly achievements of printed circuit boards related to industrial equipment.

We would like to introduce our achievements in the production of printed circuit boards related to industrial equipment. *For waterproof and dustproof measures for mounted boards!

We have manufactured control boards for resin processing machines and crimping machines. At Tojo Manufacturing, we offer one-stop total solutions from prototype printed circuit boards to final assembly. If you are facing issues with delivery times or quality, please feel free to consult us. 【Features】 ■ Manufactured control boards for resin processing machines and crimping machines *For more details, please visit the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • substrate

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What is black potting for waterproofing measures (equivalent to IP67) of the implementation substrate?

Protects the circuit board from external humidity, rain, and wind! A black resin potting with a high hardness of 76 that does not stress the circuit board!

If waterproofing is necessary, if you want to protect the circuit board from vibrations, or if you are concerned about the reduced lifespan of the mounted circuit board due to dirt, resin potting is recommended. Among them, black potting has a high hardness of 76, but it is a processing method that contributes to waterproofing (equivalent to IP67), dustproofing, and explosion-proofing without putting stress on the circuit board. 【Features of Black Potting】 ■ High hardness of 76, but does not stress the circuit board ■ Excellent waterproofing (equivalent to IP67), dustproofing, explosion-proofing, and earthquake resistance ■ No limits on the work size for resin potting Regardless of the size of the circuit board, feel free to consult us, and prototype support is also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • substrate

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PuriKen Co., Ltd. Printed Circuit Board Resin Filling

After drilling, there is a process of resin filling and lid plating following copper plating!

Our company performs "resin filling" using process equipment. Conductive metal and non-conductive non-metal pastes are applied to the surface of the substrate, and after being embedded in the holes, they are printed using a screen plate. By overheating and curing the resin, and then performing lid plating after polishing, a flat surface is achieved. 【Process】 1. Drilling 2. Copper plating 3. Resin filling 4. Lid plating *For more details, please refer to the PDF document or feel free to contact us.

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Puriken Co., Ltd. Printed Circuit Board Cost

Appropriate layer structure and material selection! If it leads to mass production, consider the specifications of the mass production factory.

We would like to introduce "cost," which is a key point in our design. The number of boards is determined while satisfying physical conditions, considering efficient area and shape. We select appropriate layer composition and materials to avoid being over-spec. We aim to make the line and space as large as possible, while keeping the board thickness/hole diameter (aspect ratio) as small as possible. 【Features】 ■ Considers efficient area and shape while satisfying physical conditions ■ Takes into account usage and specifications ■ If it leads to mass production, considers the specifications of the mass production factory *For more details, please feel free to contact us.

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Puriken Co., Ltd. Printed Circuit Board EMC

Ensure that the plain has a secured return path, a large opening, and check for any gaps!

We would like to introduce "EMC," which is a key aspect of our design. Check the component placement to ensure that the crystal is not located at the edge of the board, that the filter circuit is near the external IF, and that the damping resistor is placed close to the output pin. Also, verify the position of the termination resistor and the placement of the bypass capacitor. For wiring, confirm that high-speed signal lines are not routed to the edge of the board, and route high-speed signals and bus lines as much as possible in the inner layers. 【Features】 ■ Plain ■ Component placement ■ Wiring *For more details, please feel free to contact us.

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Puriken Co., Ltd. Printed Circuit Board Design Department Structure

As a substrate manufacturer, we can design with manufacturing standards in mind!

We would like to introduce our design department structure. We can handle customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer). By using characteristic impedance calculation tools and feedback from the manufacturing department, we can achieve highly accurate impedance matching design. 【Features】 ■ Capable of handling customer projects in various fields such as high-speed digital, analog, power supply, and antennas (design provided by the customer) ■ As a circuit board manufacturer, we can design with manufacturing standards in mind ■ Capable of impedance matching design ■ For large-scale circuit boards or projects requiring simulation, we collaborate with partner companies *For more details, please feel free to contact us.

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Delivery in as short as 1 day. A production system that meets development needs.

Quickly respond to the needs of customers in the development department who demand an early release with a short turnaround time!

We would like to introduce the production system of Puriken Co., Ltd. The number of orders received in a month ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be made on the same day the order is received. What makes this possible is our one-stop system, which allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. 【Features】 ■ Accommodates a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from a single circuit board *For more details, please refer to the related links or feel free to contact us.

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New value in services such as tracking systems and factory tours.

We are utilizing it for technical training, new employee training, and social studies education in local schools!

At Puriken Co., Ltd., we are committed not only to product development and manufacturing but also to service development and provision. We have implemented our unique traceability system, "Shinchoku-kun," which allows us to track in real-time the stage of the ordered product within 10 to 20 different processes. Additionally, to provide information about our advanced equipment and manufacturing processes, we conduct factory tours both online and offline. 【Features】 ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please refer to the related links or feel free to contact us.

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Technical Documentation for Solder Resist Formation for Medical Devices

We present materials on the technology for forming solder resist that enables miniaturization!

In the medical device industry, there is a demand for miniaturization of products and high-density mounting. In particular, optimizing circuit board design is crucial for packing many functions into limited space. Solder resist formation technology allows for precise control of terminal sizes and clearances, enabling high-density mounting. Our materials will assist in product selection to address these challenges. 【Usage Scenarios】 - Miniature medical devices - High-density mounting circuit boards - Precise component placement 【Benefits of Implementation】 - Reduction in circuit board size - Improvement in mounting density - Enhanced product reliability

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Technical Documentation for Solder Resist Formation for Home Appliances

We will provide materials that include specifications such as terminal size, clearance, and solder mask thickness!

In the home appliance industry, as products become smaller and more high-performance, reducing costs in circuit board design has become an important issue. Solder resist formation technology can contribute to improving yield and reducing defect rates in the circuit board manufacturing process, which can ultimately lead to cost reduction. Our materials on solder resist formation technology provide useful information for product selection. 【Application Scenarios】 - Cost reduction in circuit board design for home appliances - Improved yield in circuit board manufacturing - Reduction of defect rates 【Effects of Implementation】 - Increased efficiency in circuit board design - Reduction in manufacturing costs - Improvement in product quality

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【For Communication】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to the acceleration of communication devices.

In the telecommunications industry, with the spread of high-speed data communication, the densification and performance enhancement of circuit boards are progressing. As a result, the heat generation of circuit boards is increasing, making thermal management an important issue. If appropriate thermal measures are not implemented, it may lead to a decline in the performance or failure of communication devices. Our "circuit boards that dissipate heat faster" address this challenge. 【Usage Scenarios】 * High-speed communication routers * Base stations * Servers 【Benefits of Implementation】 * Stable operation of devices due to improved thermal conductivity * Extended product lifespan * Achievement of high performance

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【For LED Lighting】Understand in 3 Minutes! A Substrate that Dissipates Heat Faster

Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!

In the LED lighting industry, with the increase in brightness, the heat dissipation performance of substrates has become an important issue. To maintain high luminous flux, it is necessary to efficiently dissipate the heat generated by the LED elements. If the heat dissipation performance is low, it may lead to a decrease in the lifespan and degradation of the performance of the LEDs. Our "faster heat-dissipating substrate" addresses this issue. 【Usage Scenarios】 - High-brightness LED lighting - LED products requiring thermal management 【Benefits of Implementation】 - Extended lifespan of LEDs - Improved product reliability - Maintenance of performance

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Aerospace Electrical Characteristic Measurement Substrate Documentation

Supporting lightweight design in the aerospace field!

In the aerospace industry, reducing product weight is a critical challenge. The substrate for electrical characteristic measurement supports optimal material selection and design optimization through accurate measurements during the design phase, contributing to weight reduction. Thorough impedance management is a crucial factor that influences product performance in the aerospace field, where high-frequency characteristics are essential. Our materials related to the electrical characteristic measurement substrate will assist in solving these challenges. 【Usage Scenarios】 * Aircraft electronic equipment design * Substrate design for space exploration vehicles * Design of communication devices requiring weight reduction 【Benefits of Implementation】 * Accurate electrical characteristic measurement during the design phase * Achieving weight reduction through optimal material selection * Improved product reliability

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Board materials for electrical characteristic measurement for precision control of robots.

We present materials that are helpful for measuring the electrical characteristics of precision control robots!

In the field of precise control of robots, high accuracy and reliability are required. In particular, the electrical characteristics of sensors and actuators significantly impact the robot's operational performance. Measurement errors in electrical characteristics can lead to instability in control and malfunction. The materials we provide regarding the measurement boards for electrical characteristics offer useful information for consideration during implementation, such as error factors in impedance management and the differences between measurement boards and general boards. 【Usage Scenarios】 - Evaluation of robot sensors - Performance evaluation of actuators - Development of precision control systems 【Effects of Implementation】 - Improvement in the accuracy of electrical characteristic measurements - Enhancement of the operational stability of robots - Reduction in development time

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