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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null

substrate Product ranking

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

856~870 item / All 1843 items

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Ultra-compact step-down converter board

The adoption of a high-efficiency synchronous buck converter results in extremely low heat generation, making it ideal for onboard use.

The ultra-compact step-down converter board features a high-efficiency synchronous buck converter, resulting in minimal heat generation, making it ideal for onboard applications. Compared to similar products from other manufacturers, it is approximately half the size. Due to its low ripple noise, it can also be used for driving analog circuits. It can be used as is without external components such as heat sinks or capacitors. It includes an ON/OFF control function and has built-in overcurrent protection circuitry. For more details, please download the catalog.

  • Other electronic parts

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Printed Circuit Board Simulation Service

Eliminate design backtracking and support for shortening development time and reducing costs!

Transmission line analysis conducts pre-analysis and post-analysis to minimize rework. EMI analysis eliminates the causes of unwanted electromagnetic radiation (radiated noise and emissions), enabling significant reductions in time and costs for countermeasures after prototyping. Please feel free to contact us with any questions or inquiries regarding simulations.

  • simulator
  • Printed Circuit Board
  • Other services

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High cost-performance boards manufactured by a South Korean board manufacturer.

Elimination of initial manufacturing costs to reduce development costs during prototyping!

Since there are no initial manufacturing costs, it is possible to significantly reduce the costs during substrate creation. Of course, we guarantee the quality. From single-sided boards to 8-layer through-hole boards. Impedance control is also available. We will make proposals according to your requested delivery dates.

  • Printed Circuit Board
  • Contract manufacturing

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Comprehensive catalog presentation! Prototype development support.

One-stop support for the development and manufacturing of printed circuit boards! Free comprehensive catalog available now.

At Plax, our greatest strength lies in our ability to provide one-stop support from the development to manufacturing of printed circuit boards. We support development operations with meticulous service. Please feel free to consult us about anything related to hardware development, software development, printed circuit board design and manufacturing, material procurement, and board assembly! Currently, we are offering a comprehensive catalog that explains our services in detail as a gift. 【Features】 ■ Design that incorporates EMC and ESD measures from the circuit design stage ■ Transmission line analysis includes pre-analysis and post-analysis ■ Short delivery times ■ Support available from any stage of the process ■ Capable of handling both small lot and mass production assembly *For more details, please download the catalog or contact us.

  • Circuit board design and manufacturing

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[Series Volume 5] Column written by Naoki Kunimine, Thermal Design Consultant

<Free Offer> From my position of having been involved in thermal design for many years, I would like to share my thoughts on thermal design that I have on a daily basis.

Written by Mr. Naoki Kunimine, President of Thermal Design Lab, Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the fifth installment of the column. 【Contents (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the fifth installment, we will focus on the "printed circuit board," which has now become essential to thermal design, and discuss its background and challenges. ■ When heat generation density was mild ■ The effectiveness of printed circuit boards as a thermal pathway ■ Reasons why establishing thermal design methods for printed circuit boards is challenging *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Optimal for epitaxial growth: oxide substrates for thin film growth

Consistent production from crystal growth to processing in-house. High-quality crystal substrate surfaces without processing distortion.

【Optimal for Epitaxial Growth】 Oxide substrates for thin film growth have been contributing to advancements in science and technology since the 1980s, providing substrates such as SrTiO3 and sapphire for high-temperature superconducting thin films and GaN. For epitaxial growth substrates, the crystal quality, surface smoothness, flatness, and the presence or absence of crystal lattice strain at the very surface are crucial. Our company has achieved consistent in-house production from crystal growth to processing through years of technological accumulation. With our high-precision processing technology, we continue to provide high-quality crystal substrate surfaces. We always keep standard specifications in stock and deliver them within approximately 10 days after order placement. We also offer custom-made options for surface orientation, shape, and off-angle according to your needs, so we handle products with specifications not listed in our lineup. Please feel free to contact us. *For more details, please inquire or refer to our catalog.*

  • Company:信光社
  • Price:Less than 10,000 yen
  • Other metal materials

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Robot Automation Solution "Bread Shaping & Aligning Robot Device"

A robotic solution that automates the molding process after the bread baking process!

The "Bread Shaping & Alignment Robot Device" is an automated system that performs the task of cutting shapes from bread after the baking process. It recognizes the positions of irregularly shaped bread using a vision camera and continuously cuts out shapes with a parallel link robot. Additionally, the robot frame has been optimized through strength analysis. 【Features】 ■ Custom hands are manufactured to match the customer's products ■ Proposals for the optimal configuration and layout for the customer's factory ■ Compatible with any robot manufacturer *For more details, please refer to the catalog or feel free to contact us.

  • Transport and handling robots
  • Other industrial robots

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Robot Automation Solution "Electrical Component Assembly Inspection Robot Device"

A robotic solution to automate the assembly of electrical components and inspection after assembly!

The "Electric Component Assembly Inspection Robot Device" is a machine that performs the assembly and inspection of electrical components. It retrieves components from a tray using a horizontal scara robot and utilizes four vertical multi-joint robots to assemble parts, including riveting and screw tightening tasks. By correcting position variations and acquisition errors during assembly with a vision camera, stable assembly is achieved. Additionally, an automatic inspection is conducted after assembly using a vision camera. 【Features】 ■ Custom hands are manufactured to match the customer's products. ■ Proposals for the optimal configuration and layout for the customer's factory. ■ Compatible with robots from any manufacturer. *For more details, please refer to the catalog or feel free to contact us.

  • SCARA Robot
  • Assembly robot

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Substrate "APOLLO5C Series"

Proposal for Image and Communication Models Equipped with Cyclone V SoC

The APOLLO5C series is an ideal development platform for communication and image processing. It also offers design quality suitable for use in mass-produced products. In the artwork design of each board, PI/SI simulations are conducted in detail to implement the best design practices. 【Features】 ○ Supports various interfaces → ETHERNET, USB 3.0, SDCARD, DisplayPort For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Interface conversion board

A conversion board that converts sensor data into IP packets (UDP) and sends them to the server!

The "Interface Conversion Board" is a conversion unit that converts data from sensor devices into IP packets (UDP packets) and sends them to a server. It implements ITRON on Renesas' CPU (SH3). It supports hardware, firmware, and small-lot production. 【Features】 ■ Ethernet communication terminal ■ Firmware updates via FTP ■ PoE power supply from HUB ■ CPU: SH7619 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Ceramic substrate

We provide ceramic substrates that combine excellent smoothness, bending strength, and insulation properties!

Our company mainly handles "ceramic substrates" used for HIC substrates, thin-film circuit substrates, heat dissipation substrates, and LED mounting substrates. "Ceramic substrates" have fewer pores due to the use of fine particles, exhibiting excellent smoothness, high bending strength, and insulation even in high-temperature environments. We can accommodate requests for through-hole and scribe line processing, as well as electrode pattern formation (metallization) through printing and plating. 【Product Lineup】 ■ Thick film printing substrates ■ Alumina metallized substrates ■ Long-length substrates for thick film printing ■ Thin film printing substrates ■ Polished substrates for thin film printing, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Ceramics

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Optical window/substrate

Best fit proposal for grinding substrates

Glass substrates are used for various applications, from research and testing development to incorporation into mass-produced products. Daiko Seisakusho manufactures various substrates, primarily focusing on quartz glass substrates, in its own factory. By consistently handling everything from small-scale production for prototype development to mass production for products, we solve various challenges for our customers, such as cost reduction, performance improvement, and quality stability.

  • lens
  • Processing Contract
  • lens

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Experimental synthetic quartz glass substrate Labo-USQ

5 pieces or more available!! Ideal for those looking for a small quantity or high-quality items.

The "Labo-USQ," a high-purity experimental synthetic quartz glass substrate from Daikyo Manufacturing, boasts high transmittance from ultraviolet to infrared light and can be used as various experimental substrates due to its high purity. As standard products, we offer sizes of 10mm, 20mm, and 25mm, and we can ship within as little as three days (depending on stock availability). *We also accommodate sizes, thicknesses, and shapes other than standard products, so please feel free to inquire.

  • Glass

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Aluminum substrate suitable for small lot production.

A printed circuit board using a highly heat-dissipating aluminum base! We also accommodate small lot production.

"Aluminum substrate" is a printed circuit board that uses a high thermal conductivity aluminum base. The material accommodates board thicknesses from 0.6mm to 3.0mm, and it can support copper foil thicknesses from 35um to 105um. The maximum sizes are 600mm x 400mm and 1500mm x 250mm. Small lot production can reduce initial mold costs through router processing. Mass production can lower substrate costs with mold support. 【Features】 - Uses a high thermal conductivity aluminum base - Supports various types of data - Capable of panelization for mass production from individual piece data *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Manufacturing of substrates for LED lighting is also possible! 'Printed Circuit Board'

Printed circuit boards compatible with LED lighting manufacturing using CEM-3 and FR-4!

Our "printed circuit boards" can manufacture LED lighting boards using CEM-3 and FR-4 without the use of aluminum substrates, thanks to the high functionality of LEDs. We also accommodate specifications for Japanese materials (substrates, resist, silk). 【Features】 ■ No use of aluminum substrates ■ Capable of manufacturing LED lighting boards ■ Accommodates specifications for Japanese materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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