Rigid flex circuit small lot
We also accept prototype and small lot production of rigid-flex PCBs from AW design.
By combining rigid substrates with bendable flexible substrates, various layouts become possible.
- Company：アレイ
- Price：Other
substrate Product List and Ranking from 563 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
substrate Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
- 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
- 山下マテリアル Kanagawa//Electronic Components and Semiconductors
- プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
- 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
- 5 共栄電資 Tokyo//Electronic Components and Semiconductors
substrate Product ranking
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
- [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
- 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
- [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
- 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
- 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
substrate Product List
1801～1830 item / All 1907 items
Displayed results
Flexible printed circuit board (FPC) short delivery time
Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.
We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.
- Company：アレイ
- Price：Other
Inverter LED power supply LED constant current circuit board
We can accommodate various types and brands of LEDs for our customers' diverse applications.
It is also possible to customize the products developed to meet customer requests according to customer specifications.
- Company：和光電研
- Price：Other
Tokai Shin-ei Electronic Industry Double-Sided Circuit Board
We offer a variety of products to meet the diverse needs of our customers.
It is a substrate with copper foil on both sides of a glass epoxy insulating board.
- Company：東海神栄電子工業
- Price：Other
Tōkai Shin'eidenshi Kōgyō FPV Circuit Board
It will be possible to design a board equipped with a BGA with a 0.65 pitch.
FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.
- Company：東海神栄電子工業
- Price：Other
Daichang Electronics Module Circuit Board
We aim to be a company where everyone can thrive and enjoy their work.
The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.
- Company：大昌電子
- Price：Other
Fujii Print Industry - High-Difficulty Circuit Board Manufacturing
We can respond at full speed.
The manufacturing of high-difficulty circuit boards, which is increasing due to the miniaturization and high density of electronic components, is one of the areas in which Fuji Print Industry excels the most.
- Company：富士プリント工業
- Price：Other
Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)
We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!
Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Thin film circuit board for high-speed transmission
High-precision thin-film circuit boards that support high-speed data communication.
In the telecommunications industry, especially in areas where high-speed data transmission is required, it is important to minimize signal delay and noise. Thin-film circuit boards address these challenges with high-density wiring and excellent thermal conductivity. Our thin-film circuit boards are ideal for laser diode (LD) mounting substrates and optical communication applications. 【Usage Scenarios】 * Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 * Stabilization of high-speed data transmission * Improvement in signal quality * Enhanced product reliability
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Thin film circuit board for automobiles
Thin film circuit board achieving high reliability
In the automotive industry, the reliability of electronic components is crucial for achieving both safety and durability. Particularly for electronic components used under temperature variations, vibrations, and harsh environments, the quality of the substrate significantly affects the product's performance and lifespan. Thin-film circuit substrates address these challenges with high-precision fine circuit patterns and excellent thermal conductivity, contributing to the high performance of vehicles. 【Application Scenarios】 - In-vehicle radar - In-vehicle LED - In-vehicle sensors 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Contributing to high performance
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Thin Film Circuit Board for IoT (Submount Carrier)
Thin film circuit boards that contribute to energy saving. Free technical documentation available!
In the IoT industry, miniaturization of devices and the extension of battery life have become important challenges. To achieve energy efficiency, efficient power utilization of components is essential. Our thin-film circuit boards support the development of energy-saving devices through high-precision fine circuit pattern formation technology. 【Usage Scenarios】 - Wearable devices - Smart sensors - IoT gateways 【Benefits of Implementation】 - Miniaturization of devices - Reduction of power consumption - Extension of battery life
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Thin Film Circuit Board for Robotics
Thin film circuit boards supporting high-precision robot control.
In the robotics industry, advanced motion control and precise sensor information processing are required. Particularly, as robots become smaller and more high-performance, high-density mounting of circuit boards and high reliability are crucial. Thin-film circuit boards have been developed to meet these demands. 【Usage Scenarios】 - Robot arms requiring high-precision positioning control - Robots processing fine sensor information - Mobile robots that require miniaturization and lightweight design 【Benefits of Implementation】 - Miniaturization and lightweight design through high-density mounting - Performance improvement through high-precision circuit patterns - Increased longevity due to high reliability
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Achieving thinness with thin-film circuit boards for displays.
Thin film circuit boards contribute to the slimming down of displays!
In the display industry, there is a constant demand for thinner and more functional products. In particular, space-saving and lightweight designs are crucial factors that influence product competitiveness. To achieve thinness, it is essential to reduce the thickness of the substrate while simultaneously ensuring high reliability and performance. Our thin-film circuit substrates utilize advanced thin-film processing technology to contribute to the thinning of displays. 【Usage Scenarios】 - Thin displays - High-density mounting substrates - High heat dissipation substrates 【Benefits of Implementation】 - Increased added value of products through thinning - Realization of high-precision circuit patterns - High reliability and durability
- Company：Citizen Finedevice Co.,Ltd
- Price：Other
Liquid Flow Sensor Evaluation Kit 'EK-SLI-2000'
The interface (connector) is RS485, I2C, USB, or analog (4-pin M8)!
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-2000'. The interfaces (connectors) are RS485, I2C, USB, or analog (4-pin M8), with a maximum flow rate of 5ml/min (aqueous) and 80ml/min (hydrocarbon). It has an IP65 rating for water and dust resistance. Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-2000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.
- Company：センシリオン
- Price：Other
Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-1300F'
Includes a conversion adapter cable for connecting from a 6-pin connector to an SCC1-USB sensor cable!
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-1300F'. The interface (connector) is I2C (6-pin Molex). The response speed is <20ms, and the maximum flow rate is 40ml/min (for both aqueous and hydrocarbon liquids). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-1300F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.
- Company：センシリオン
- Price：Other
Shinshu Koden Co., Ltd. Company Profile
In addition to the company overview, we publish our efforts towards the environment, a list of equipment and facilities, and our history!
At Shinshu Koden Co., Ltd., we offer circuit design, printed circuit board pattern design, chip mounting, assembly, wiring, enclosure assembly and wiring, and various inspections. On our company website, we introduce not only our company profile but also our efforts towards the environment, a list of equipment, and our history. Please feel free to consult us when you need our services. 【Our Company Website - Company Information】 ■Greetings ■Company Profile ■History ■Environmental Initiatives ■List of Equipment ■Access Map *For more details, please refer to the related links or feel free to contact us.
- Company：信州光電
- Price：Other
![[Development Case] - Inkjet Printer Ejection Control Board [EOL Support]](https://image.mono.ipros.com/public/product/image/112/2001516339/IPROS9769566036077824129.jpeg?w=280&h=280)
[Development Case] - Inkjet Printer Ejection Control Board [EOL Support]
Replacement design for embedded systems - a new design solution fully addressing end-of-life IC measures and specification changes.
The customer faced a situation where the ICs and semiconductors in use became obsolete, making it urgent to consider alternatives. Additionally, due to changes in equipment specifications, the number of modifications needed on the circuit board increased. Furthermore, due to constraints of the equipment casing, it was not possible to change the existing board size, shape, or connector positions, necessitating a redesign that could accommodate all requirements while maintaining the conventional design. Our company carefully selected alternative components with equivalent basic functions, pin configurations, and sizes, and conducted a redesign of the circuit board patterns as needed. We eliminated unnecessary circuits and minimized changes to component placement and wiring patterns, allowing us to conduct integration verification into the equipment while maintaining the existing specifications. This ensured reliable operation checks for both the circuit board alone and the entire equipment, facilitating a smooth transition to mass production and stable supply. To the design team, procurement, and production management—please utilize our replacement design case studies as an optimal solution to enhance operational efficiency, product quality, and reliability in response to obsolete IC measures and specification changes. Feel free to contact us!
- Company：倭技術研究所
- Price：Other
【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～
無駄なイニシャル費は払わなくていい！ 独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。
株式会社ケイツーでは、独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。これによりフレキ基板製造の短納期化および大幅なイニシャルコスト費の削減が可能です。NCマシンによる加工の課題でありました加工精度・加工面につきても金型加工と遜色のない仕上がりとなっております。 通常フレキ基板を製造するには、数量の大小にこだわらず、カバーレイ加工や外形加工に金型またはトムソン型（ヴィクトリア型）が不可欠です。その結果、金型に関する時間や費用によって通常のリジッド基板と比較して納期が長く、イニシャル費も非常に高くなっておりました。当社では、カバーレイ加工や外形加工に金型を使用せずにNCマシンを使用して、金型作成に要する時間と費用を削減できます。もちろん、加工精度や仕上がり形状は金型加工と比較しても遜色のないものです。 詳しくはお問い合わせ、またはカタログをダウンロードしてください。
- Company：ケイツー
- Price：Other
Advantages of K2: More cost-effective response for medium lot production of flexible materials.
Providing medium lot products that are unsuitable for both prototype manufacturers and mass production manufacturers at low prices!
Our company offers proposals to reduce initial costs by using laser processing for the prototyping of flexible substrates. However, when it comes to medium lot production, it is more cost-effective to manufacture using molds. For large quantities that cannot be handled by prototyping manufacturers, and where the initial costs become too high for mass production manufacturers, please leave it to us. We can provide it at a low price. *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケイツー
- Price：Other
![[Example] Printed Circuit Board - Multi-layer Board with Different Materials](https://image.mono.ipros.com/public/product/image/193/2000158291/IPROS7262833653583899044.JPG?w=280&h=280)
[Example] Printed Circuit Board - Multi-layer Board with Different Materials
Introducing the combination of Teflon material and different substrates using illustrations!
At Shinkou Photo Service Co., Ltd., we also accept orders for printed circuit board pattern design (digital, analog, high frequency) as well as assembly (QFP, QFN, BGA). We can take orders for either design or assembly. 【Catalog Contents】 ■Combination of Teflon materials and other substrates ■Combination of Teflon materials with aluminum or copper plates ■Combination of Teflon materials with each other 【Various Manufacturers Handled】 ■ARLON, Chuko Chemical Industrial, Nippon Pillar Industry, Panasonic Electric Works, ROGERS, and others For more details, please download the catalog or contact us.
- Company：伸光写真サービス
- Price：Other
Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"
Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.
At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.
- Company：サトーセン
- Price：Other
Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"
Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.
At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.
- Company：サトーセン
- Price：Other
Technical Introduction: "Magnetic Reduction Technology"
Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.
At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.
- Company：サトーセン
- Price：Other
BMW i3 Disassembly Investigation Report Detailed Contents
A complete disassembly investigation of the electronic circuit boards used in the BMW i3.
The BMW i3, an electric vehicle, is referred to in various ways as a carbon fiber car, but efforts have been made to reduce weight in every possible part to lighten the body. In this instance, there are about 70 electronic circuit boards used in this model, and we have disassembled and investigated all of these boards, compiling a report on the types of components, model numbers, technologies, and the nature of the costs involved. The downloadable materials include details on the content of each report, along with pricing information. Furthermore, for customers who contract to purchase all of these reports by September 30, 2015, we are offering an exceptional price of $25,000. Purchases can also be made in Japanese yen, and it is more affordable than buying a single BMW i3, while also allowing for an easy understanding of what components are used and their associated costs.
- Company：テックインサイツジャパン株式会社（TechInsights）
- Price：1 million yen-5 million yen
Face's Wisdom Bag: "Screws and Tightening Torque"
There are various types of screws, and their intended use differs depending on the application. This page explains the types of screws and torque.
For more details, please refer to the PDF document or feel free to contact us.
- Company：フェイス
- Price：Other
Face's Wisdom Bag: "Basic Elements of Cost Reduction"
By designing circuit boards from the perspective of the assembly site, customers can achieve benefits such as reduced labor costs and improved quality.
This explains the basic elements of cost reduction as points to consider during circuit board design. *For more details, please refer to the PDF materials or feel free to contact us.*
- Company：フェイス
- Price：Other
Face's Wisdom Bag: "Points to Note When Releasing Materials (2)"
We will propose points of caution and countermeasures from the perspective of the manufacturing site regarding the material outbound process.
This item introduces precautions for parts shipping (parts packaging) and examples that can lead to manufacturing defects. *For more details, please refer to the PDF document or feel free to contact us.
- Company：フェイス
- Price：Other
![[Example of Use] Sensor 99.9% Alumina Substrate](https://image.mono.ipros.com/public/product/image/cd7/2000177635/IPROS14631865573786854532.jpeg?w=280&h=280)
[Example of Use] Sensor 99.9% Alumina Substrate
A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.
A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.
![[Performance Introduction] Measures for Longevity Using Ceramics](https://image.mono.ipros.com/public/product/image/a04/2000798534/IPROS52885571780756700906.jpeg?w=280&h=280)
[Performance Introduction] Measures for Longevity Using Ceramics
By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.
Ceramics are lightweight materials with excellent wear resistance and corrosion resistance compared to metals, and their adoption is progressing for extending the lifespan of equipment parts and addressing wear issues. By replacing metal components of equipment with ceramics such as silicon carbide or silicon nitride, the lifespan of the parts is extended, significantly reducing maintenance work for part replacements. JFC offers a lineup of five types of silicon carbide and two types of silicon nitride. Silicon nitride SNP03 is a high-strength type with enhanced fracture toughness and bending strength compared to the standard SNP02. Please consider JFC's ceramics for the long lifespan of your equipment parts. *For more details, please download the catalog. Additionally, JFC also manufactures and sells composite materials made of ceramics and metals. For example, SA701, featured in the PDF materials, is a composite of SiC ceramics and aluminum. It is effective when a material that is resistant to cracking is required.
High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.
We offer a substrate embedded with copper coins to efficiently dissipate heat.
Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.
- Company：三和電子サーキット
- Price：Other
