substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

Company：AndTech
Price：10,000 yen-100,000 yen

Technical Seminar
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[Data] WTI Blog October 2021

Introducing points to consider in cardboard box design - Line Pattern Edition!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from October 5, 2021, to October 26, 2021. It introduces topics such as "Points to Consider in High-Frequency Circuit Design Using Surface-Mount Devices" from October 5, 2021, "Studying Circuit Board Design! (In-House Antenna Course Edition)" from October 19, 2021, and "Leave Hardware and Software Embedded Development to Us" from October 26, 2021. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ October 5, 2021: Points to Consider in High-Frequency Circuit Design Using Surface-Mount Devices ■ October 12, 2021: Key Points to Consider in Cardboard Box Design – Line Drawing Edition ■ October 19, 2021: Studying Circuit Board Design! (In-House Antenna Course Edition) ■ October 26, 2021: Leave Hardware and Software Embedded Development to Us *For more details, please refer to the PDF document or feel free to contact us.

Company：Wave Technology
Price：Other

Other contract services
Embedded system design service
Circuit board design and manufacturing
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[Data] Shirutoku Report No. 15 #Substrates and Applications

Explanation of the types and uses of substrates! In particular, we will introduce the types of rigid substrates.

★★Shirutoku Report: Useful Information You Can Benefit From★★ The design values and finished values for wiring widths and layer spacing differ depending on the type of circuit board and manufacturing methods (such as subtractive methods, semi-additive methods, etc.). In this report, we will introduce the different types of circuit boards available. Additionally, WTI offers various types of circuit board design and prototyping services. Please feel free to reach out to us. 【Contents】 ■ Types of Circuit Boards and Their Applications *For more details, please refer to the PDF document or feel free to contact us.*

Company：Wave Technology
Price：Other

Circuit board design and manufacturing
Prototype Services
Printed Circuit Board
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[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

What criteria should be used for selecting components? Introducing the selection criteria for LNA!

★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.

Company：Wave Technology
Price：Other

Other electronic parts
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Where are transparent substrates used?

They are widely adopted in automotive products, amusement products, digital home appliances, and more!

Transparent substrates are active in various products. However, the characteristics of transparent substrates make them inconspicuous, so they can be difficult to find unless you are aware of them. Specifically, they are used in wearable products, home appliances, and communication and office equipment. [Examples of Adoption] - Denso-made headlamp heater - Windshield heater *For more details, please refer to the related links or feel free to contact us.

Company：シライ電子工業 SPET事業部
Price：Other

Printed Circuit Board
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[Introduction to Fair Process] Parts Procurement/Implementation

Resistors and capacitors are generally kept in stock! We are striving to improve manufacturing quality.

Our company conducts research that takes into account not only price but also availability. We explore various routes, including domestic authorized distributors and overseas market inventories, and propose appropriate procurement methods based on our customers' production plans. Additionally, we carry out special processing such as hand soldering by skilled technicians, pattern cutting, and adding jumper wires, as well as SMT component mounting using cream solder printers, automatic mounters, and reflow ovens. 【Other process examples (excerpt)】 ■ Product planning ■ Circuit design ■ CPU firmware design ■ FPGA design ■ Mechanical design *For more details, please refer to the related links or feel free to contact us.

Company：フェア
Price：Other

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Printed circuit board design: analog boards, power boards, single-sided boards.

We accept artwork design for various types of PCBs, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

Company：アレイ
Price：Other

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Rigid flex circuit small lot

We also accept prototype and small lot production of rigid-flex PCBs from AW design.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

Company：アレイ
Price：Other

Prototype Services
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Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

Company：アレイ
Price：Other

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Inverter LED power supply LED constant current circuit board

We can accommodate various types and brands of LEDs for our customers' diverse applications.

It is also possible to customize the products developed to meet customer requests according to customer specifications.

Company：和光電研
Price：Other

LED Module
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Tokai Shin-ei Electronic Industry Double-Sided Circuit Board

We offer a variety of products to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides of a glass epoxy insulating board.

Company：東海神栄電子工業
Price：Other

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Tōkai Shin'eidenshi Kōgyō FPV Circuit Board

It will be possible to design a board equipped with a BGA with a 0.65 pitch.

FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.

Company：東海神栄電子工業
Price：Other

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Daichang Electronics Module Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

Company：大昌電子
Price：Other

Other network tools
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Fujii Print Industry - High-Difficulty Circuit Board Manufacturing

We can respond at full speed.

The manufacturing of high-difficulty circuit boards, which is increasing due to the miniaturization and high density of electronic components, is one of the areas in which Fuji Print Industry excels the most.

Company：富士プリント工業
Price：Other

Other machine elements
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Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.

Company：Citizen Finedevice Co.,Ltd
Price：Other

Other metal materials
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Thin film circuit board for high-speed transmission

High-precision thin-film circuit boards that support high-speed data communication.

In the telecommunications industry, especially in areas where high-speed data transmission is required, it is important to minimize signal delay and noise. Thin-film circuit boards address these challenges with high-density wiring and excellent thermal conductivity. Our thin-film circuit boards are ideal for laser diode (LD) mounting substrates and optical communication applications. 【Usage Scenarios】 * Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 * Stabilization of high-speed data transmission * Improvement in signal quality * Enhanced product reliability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin film circuit board for automobiles

Thin film circuit board achieving high reliability

In the automotive industry, the reliability of electronic components is crucial for achieving both safety and durability. Particularly for electronic components used under temperature variations, vibrations, and harsh environments, the quality of the substrate significantly affects the product's performance and lifespan. Thin-film circuit substrates address these challenges with high-precision fine circuit patterns and excellent thermal conductivity, contributing to the high performance of vehicles. 【Application Scenarios】 - In-vehicle radar - In-vehicle LED - In-vehicle sensors 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Contributing to high performance

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin Film Circuit Board for IoT (Submount Carrier)

Thin film circuit boards that contribute to energy saving. Free technical documentation available!

In the IoT industry, miniaturization of devices and the extension of battery life have become important challenges. To achieve energy efficiency, efficient power utilization of components is essential. Our thin-film circuit boards support the development of energy-saving devices through high-precision fine circuit pattern formation technology. 【Usage Scenarios】 - Wearable devices - Smart sensors - IoT gateways 【Benefits of Implementation】 - Miniaturization of devices - Reduction of power consumption - Extension of battery life

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Thin Film Circuit Board for Robotics

Thin film circuit boards supporting high-precision robot control.

In the robotics industry, advanced motion control and precise sensor information processing are required. Particularly, as robots become smaller and more high-performance, high-density mounting of circuit boards and high reliability are crucial. Thin-film circuit boards have been developed to meet these demands. 【Usage Scenarios】 - Robot arms requiring high-precision positioning control - Robots processing fine sensor information - Mobile robots that require miniaturization and lightweight design 【Benefits of Implementation】 - Miniaturization and lightweight design through high-density mounting - Performance improvement through high-precision circuit patterns - Increased longevity due to high reliability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Achieving thinness with thin-film circuit boards for displays.

Thin film circuit boards contribute to the slimming down of displays!

In the display industry, there is a constant demand for thinner and more functional products. In particular, space-saving and lightweight designs are crucial factors that influence product competitiveness. To achieve thinness, it is essential to reduce the thickness of the substrate while simultaneously ensuring high reliability and performance. Our thin-film circuit substrates utilize advanced thin-film processing technology to contribute to the thinning of displays. 【Usage Scenarios】 - Thin displays - High-density mounting substrates - High heat dissipation substrates 【Benefits of Implementation】 - Increased added value of products through thinning - Realization of high-precision circuit patterns - High reliability and durability

Company：Citizen Finedevice Co.,Ltd
Price：Other

Circuit board design and manufacturing
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Liquid Flow Sensor Evaluation Kit 'EK-SLI-2000'

The interface (connector) is RS485, I2C, USB, or analog (4-pin M8)!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-2000'. The interfaces (connectors) are RS485, I2C, USB, or analog (4-pin M8), with a maximum flow rate of 5ml/min (aqueous) and 80ml/min (hydrocarbon). It has an IP65 rating for water and dust resistance. Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-2000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-1300F'

Includes a conversion adapter cable for connecting from a 6-pin connector to an SCC1-USB sensor cable!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-1300F'. The interface (connector) is I2C (6-pin Molex). The response speed is <20ms, and the maximum flow rate is 40ml/min (for both aqueous and hydrocarbon liquids). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-1300F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
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Shinshu Koden Co., Ltd. Company Profile

In addition to the company overview, we publish our efforts towards the environment, a list of equipment and facilities, and our history!

At Shinshu Koden Co., Ltd., we offer circuit design, printed circuit board pattern design, chip mounting, assembly, wiring, enclosure assembly and wiring, and various inspections. On our company website, we introduce not only our company profile but also our efforts towards the environment, a list of equipment, and our history. Please feel free to consult us when you need our services. 【Our Company Website - Company Information】 ■Greetings ■Company Profile ■History ■Environmental Initiatives ■List of Equipment ■Access Map *For more details, please refer to the related links or feel free to contact us.

Company：信州光電
Price：Other

Circuit board design and manufacturing
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[Development Case] - Inkjet Printer Ejection Control Board [EOL Support]

Replacement design for embedded systems - a new design solution fully addressing end-of-life IC measures and specification changes.

The customer faced a situation where the ICs and semiconductors in use became obsolete, making it urgent to consider alternatives. Additionally, due to changes in equipment specifications, the number of modifications needed on the circuit board increased. Furthermore, due to constraints of the equipment casing, it was not possible to change the existing board size, shape, or connector positions, necessitating a redesign that could accommodate all requirements while maintaining the conventional design. Our company carefully selected alternative components with equivalent basic functions, pin configurations, and sizes, and conducted a redesign of the circuit board patterns as needed. We eliminated unnecessary circuits and minimized changes to component placement and wiring patterns, allowing us to conduct integration verification into the equipment while maintaining the existing specifications. This ensured reliable operation checks for both the circuit board alone and the entire equipment, facilitating a smooth transition to mass production and stable supply. To the design team, procurement, and production management—please utilize our replacement design case studies as an optimal solution to enhance operational efficiency, product quality, and reliability in response to obsolete IC measures and specification changes. Feel free to contact us!

Company：倭技術研究所
Price：Other

Embedded system design service
Microcomputer
EMS
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【プリント基板イニシャル費削減】～フレキ基板小ロット製造対応～

無駄なイニシャル費は払わなくていい！　独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。

株式会社ケイツーでは、独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。これによりフレキ基板製造の短納期化および大幅なイニシャルコスト費の削減が可能です。NCマシンによる加工の課題でありました加工精度・加工面につきても金型加工と遜色のない仕上がりとなっております。通常フレキ基板を製造するには、数量の大小にこだわらず、カバーレイ加工や外形加工に金型またはトムソン型（ヴィクトリア型）が不可欠です。その結果、金型に関する時間や費用によって通常のリジッド基板と比較して納期が長く、イニシャル費も非常に高くなっておりました。当社では、カバーレイ加工や外形加工に金型を使用せずにNCマシンを使用して、金型作成に要する時間と費用を削減できます。もちろん、加工精度や仕上がり形状は金型加工と比較しても遜色のないものです。詳しくはお問い合わせ、またはカタログをダウンロードしてください。

Company：ケイツー
Price：Other

Printed Circuit Board
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Advantages of K2: More cost-effective response for medium lot production of flexible materials.

Providing medium lot products that are unsuitable for both prototype manufacturers and mass production manufacturers at low prices!

Our company offers proposals to reduce initial costs by using laser processing for the prototyping of flexible substrates. However, when it comes to medium lot production, it is more cost-effective to manufacture using molds. For large quantities that cannot be handled by prototyping manufacturers, and where the initial costs become too high for mass production manufacturers, please leave it to us. We can provide it at a low price. *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイツー
Price：Other

Printed Circuit Board
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[Example] Printed Circuit Board - Multi-layer Board with Different Materials

Introducing the combination of Teflon material and different substrates using illustrations!

At Shinkou Photo Service Co., Ltd., we also accept orders for printed circuit board pattern design (digital, analog, high frequency) as well as assembly (QFP, QFN, BGA). We can take orders for either design or assembly. 【Catalog Contents】 ■Combination of Teflon materials and other substrates ■Combination of Teflon materials with aluminum or copper plates ■Combination of Teflon materials with each other 【Various Manufacturers Handled】 ■ARLON, Chuko Chemical Industrial, Nippon Pillar Industry, Panasonic Electric Works, ROGERS, and others For more details, please download the catalog or contact us.

Company：伸光写真サービス
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
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Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

Company：サトーセン
Price：Other

Printed Circuit Board
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Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

Company：サトーセン
Price：Other

Printed Circuit Board
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substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies | IPROS GMS

substrate Manufacturer, Suppliers and Company Rankings

substrate Product ranking