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substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 北一電気 Niigata//Electronic Components and Semiconductors
  4. 4 スクリーンプロセス Kanagawa//others
  5. 5 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale

substrate Product ranking

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

  1. Printed circuit board 北一電気
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 FPC for the space industry 太洋テクノレックス 本社 和歌山

substrate Product List

1831~1860 item / All 1948 items

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[Data] Shirutoku Report No. 15 #Substrates and Applications

Explanation of the types and uses of substrates! In particular, we will introduce the types of rigid substrates.

★★Shirutoku Report: Useful Information You Can Benefit From★★ The design values and finished values for wiring widths and layer spacing differ depending on the type of circuit board and manufacturing methods (such as subtractive methods, semi-additive methods, etc.). In this report, we will introduce the different types of circuit boards available. Additionally, WTI offers various types of circuit board design and prototyping services. Please feel free to reach out to us. 【Contents】 ■ Types of Circuit Boards and Their Applications *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Prototype Services
  • Printed Circuit Board
  • substrate

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[Data] Shirutoku Report No. 94 # Component Selection for Low Noise Amplifier (LNA)

What criteria should be used for selecting components? Introducing the selection criteria for LNA!

★★Shirutoku Report: Useful Information You Should Know★★ One of the important components that affects the receiving characteristics of wireless communication is the LNA (Low Noise Amplifier). We often receive requests from customers asking, "What criteria should we use to select this component?" Therefore, this time, we will discuss the selection criteria for LNA. Please take a moment to read it. [Contents] ■(1) Selection of devices considering power-saving requirements ■(2) Selection focusing on NF and P1dB ■(3) Selection focusing on Gain and IP3 *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Where are transparent substrates used?

They are widely adopted in automotive products, amusement products, digital home appliances, and more!

Transparent substrates are active in various products. However, the characteristics of transparent substrates make them inconspicuous, so they can be difficult to find unless you are aware of them. Specifically, they are used in wearable products, home appliances, and communication and office equipment. [Examples of Adoption] - Denso-made headlamp heater - Windshield heater *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Introduction to Fair Process] Parts Procurement/Implementation

Resistors and capacitors are generally kept in stock! We are striving to improve manufacturing quality.

Our company conducts research that takes into account not only price but also availability. We explore various routes, including domestic authorized distributors and overseas market inventories, and propose appropriate procurement methods based on our customers' production plans. Additionally, we carry out special processing such as hand soldering by skilled technicians, pattern cutting, and adding jumper wires, as well as SMT component mounting using cream solder printers, automatic mounters, and reflow ovens. 【Other process examples (excerpt)】 ■ Product planning ■ Circuit design ■ CPU firmware design ■ FPGA design ■ Mechanical design *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • substrate

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Printed circuit board design: analog boards, power boards, single-sided boards.

We accept artwork design for various types of PCBs, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • substrate

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Rigid flex circuit small lot

We also accept prototype and small lot production of rigid-flex PCBs from AW design.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others
  • substrate

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Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • substrate

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Inverter LED power supply LED constant current circuit board

We can accommodate various types and brands of LEDs for our customers' diverse applications.

It is also possible to customize the products developed to meet customer requests according to customer specifications.

  • LED Module
  • substrate

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Tokai Shin-ei Electronic Industry Double-Sided Circuit Board

We offer a variety of products to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides of a glass epoxy insulating board.

  • Other services
  • substrate

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Tōkai Shin'eidenshi Kōgyō FPV Circuit Board

It will be possible to design a board equipped with a BGA with a 0.65 pitch.

FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.

  • Other services
  • substrate

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Daichang Electronics Module Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • substrate

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Fujii Print Industry - High-Difficulty Circuit Board Manufacturing

We can respond at full speed.

The manufacturing of high-difficulty circuit boards, which is increasing due to the miniaturization and high density of electronic components, is one of the areas in which Fuji Print Industry excels the most.

  • Other machine elements
  • substrate

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Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.

  • Other metal materials
  • substrate

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Thin film circuit board for high-speed transmission

High-precision thin-film circuit boards that support high-speed data communication.

In the telecommunications industry, especially in areas where high-speed data transmission is required, it is important to minimize signal delay and noise. Thin-film circuit boards address these challenges with high-density wiring and excellent thermal conductivity. Our thin-film circuit boards are ideal for laser diode (LD) mounting substrates and optical communication applications. 【Usage Scenarios】 * Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 * Stabilization of high-speed data transmission * Improvement in signal quality * Enhanced product reliability

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  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • substrate

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Thin film circuit board for automobiles

Thin film circuit board achieving high reliability

In the automotive industry, the reliability of electronic components is crucial for achieving both safety and durability. Particularly for electronic components used under temperature variations, vibrations, and harsh environments, the quality of the substrate significantly affects the product's performance and lifespan. Thin-film circuit substrates address these challenges with high-precision fine circuit patterns and excellent thermal conductivity, contributing to the high performance of vehicles. 【Application Scenarios】 - In-vehicle radar - In-vehicle LED - In-vehicle sensors 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Contributing to high performance

  • 【採用】ガルバノ4.jpg
  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • substrate

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Thin Film Circuit Board for IoT (Submount Carrier)

Thin film circuit boards that contribute to energy saving. Free technical documentation available!

In the IoT industry, miniaturization of devices and the extension of battery life have become important challenges. To achieve energy efficiency, efficient power utilization of components is essential. Our thin-film circuit boards support the development of energy-saving devices through high-precision fine circuit pattern formation technology. 【Usage Scenarios】 - Wearable devices - Smart sensors - IoT gateways 【Benefits of Implementation】 - Miniaturization of devices - Reduction of power consumption - Extension of battery life

  • 【採用】ガルバノ4.jpg
  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • substrate

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Thin Film Circuit Board for Robotics

Thin film circuit boards supporting high-precision robot control.

In the robotics industry, advanced motion control and precise sensor information processing are required. Particularly, as robots become smaller and more high-performance, high-density mounting of circuit boards and high reliability are crucial. Thin-film circuit boards have been developed to meet these demands. 【Usage Scenarios】 - Robot arms requiring high-precision positioning control - Robots processing fine sensor information - Mobile robots that require miniaturization and lightweight design 【Benefits of Implementation】 - Miniaturization and lightweight design through high-density mounting - Performance improvement through high-precision circuit patterns - Increased longevity due to high reliability

  • 【採用】ガルバノ4.jpg
  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • substrate

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Achieving thinness with thin-film circuit boards for displays.

Thin film circuit boards contribute to the slimming down of displays!

In the display industry, there is a constant demand for thinner and more functional products. In particular, space-saving and lightweight designs are crucial factors that influence product competitiveness. To achieve thinness, it is essential to reduce the thickness of the substrate while simultaneously ensuring high reliability and performance. Our thin-film circuit substrates utilize advanced thin-film processing technology to contribute to the thinning of displays. 【Usage Scenarios】 - Thin displays - High-density mounting substrates - High heat dissipation substrates 【Benefits of Implementation】 - Increased added value of products through thinning - Realization of high-precision circuit patterns - High reliability and durability

  • 【採用】ガルバノ4.jpg
  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • substrate

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We will respond with lower prices and shorter lead times than other companies!

We have over 10,000 types of components! From large-sized L dimension boards to the manufacturing of water-related (waterproof/drip-proof/dust-proof) product boards, we can accommodate your needs.

Introducing Hox Co., Ltd., aiming for the pinnacle of EMS, with a focus on high quality and high reliability. ■ Purchasing Power of Components ⇒ Our company holds over 10,000 types of components. ⇒ We can procure at low cost and with short delivery times through unique domestic and international routes. ■ Design and Technical Capability ⇒ We are capable of hardware and software (firmware and applications) development and design, inspection machines, mechatronics applications, sheet metal enclosures, and plastic molded products. ■ Production Technology Capability ⇒ We provide total support from the design and manufacturing of manufacturing adjustment and inspection equipment to the startup of the equipment. ■ PCB Mounting Capability ⇒ Large PCBs: We can handle L-size boards up to 510mm x 460mm. ⇒ High-density multilayer boards: Achievements include a maximum of 60 layers and a maximum board thickness of 6.3mm. ⇒ We have extensive experience in high-density multilayer boards, aluminum boards, high-difficulty boards, and the mounting of prototype components. We have received high praise, especially for the production of large boards and BGA mounting and rework tasks. ■ Special Processing Manufacturing Capability ⇒ We have abundant experience in special processing coatings and urethane resin potting performed after the assembly of printed circuit boards and electronic devices. *Please refer to the PDF download for an introduction to our manufacturing equipment and product samples.

  • Visual Inspection Equipment
  • Soldering Equipment
  • Other inspection equipment and devices
  • substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLI-2000'

The interface (connector) is RS485, I2C, USB, or analog (4-pin M8)!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-2000'. The interfaces (connectors) are RS485, I2C, USB, or analog (4-pin M8), with a maximum flow rate of 5ml/min (aqueous) and 80ml/min (hydrocarbon). It has an IP65 rating for water and dust resistance. Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-2000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3S-1300F'

Includes a conversion adapter cable for connecting from a 6-pin connector to an SCC1-USB sensor cable!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-1300F'. The interface (connector) is I2C (6-pin Molex). The response speed is <20ms, and the maximum flow rate is 40ml/min (for both aqueous and hydrocarbon liquids). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-1300F ×1 ■ SLF3x mounting clamp ×1 ■ SCC1-USB sensor cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin ribbon cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

  • Flow Sensor
  • Evaluation Board
  • substrate

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Shinshu Koden Co., Ltd. Company Profile

In addition to the company overview, we publish our efforts towards the environment, a list of equipment and facilities, and our history!

At Shinshu Koden Co., Ltd., we offer circuit design, printed circuit board pattern design, chip mounting, assembly, wiring, enclosure assembly and wiring, and various inspections. On our company website, we introduce not only our company profile but also our efforts towards the environment, a list of equipment, and our history. Please feel free to consult us when you need our services. 【Our Company Website - Company Information】 ■Greetings ■Company Profile ■History ■Environmental Initiatives ■List of Equipment ■Access Map *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

A flexible substrate that achieves high reliability even in harsh automotive environments.

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss flexible substrate for medical devices

Flexible substrates contributing to the miniaturization and high performance of precision medical devices.

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

A highly durable flexible substrate that demonstrates stable performance even in harsh environments.

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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【プリント基板イニシャル費削減】~フレキ基板小ロット製造対応~

無駄なイニシャル費は払わなくていい! 独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。

株式会社ケイツーでは、独自のノウハウを用いてNCマシンによるフレキ基板のカバーレイ加工・外形加工を実現しました。これによりフレキ基板製造の短納期化および大幅なイニシャルコスト費の削減が可能です。NCマシンによる加工の課題でありました加工精度・加工面につきても金型加工と遜色のない仕上がりとなっております。 通常フレキ基板を製造するには、数量の大小にこだわらず、カバーレイ加工や外形加工に金型またはトムソン型(ヴィクトリア型)が不可欠です。その結果、金型に関する時間や費用によって通常のリジッド基板と比較して納期が長く、イニシャル費も非常に高くなっておりました。当社では、カバーレイ加工や外形加工に金型を使用せずにNCマシンを使用して、金型作成に要する時間と費用を削減できます。もちろん、加工精度や仕上がり形状は金型加工と比較しても遜色のないものです。 詳しくはお問い合わせ、またはカタログをダウンロードしてください。

  • Printed Circuit Board
  • substrate

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