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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

976～990 item / All 1843 items

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[Document] TCS4-200/250 Calibration Board Manual

[Document] TCS4-200/250 Calibration Board Manual

Pad size 65μm × 50μm! Introducing the substrate top view and pattern list.

This document includes the calibration board "TCS4-200/250" handled by Techno Probe Inc. It introduces the arrangement, pad pitch, applications, and positions of the components. It is a simple and easy-to-reference booklet. Please take a moment to read it. 【Contents (partial)】 ■ Pattern Name ■ Mounted Component Symbols ■ Applications ■ Positions of Components *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Printed circuit board

Printed circuit board

We respond to all requests regarding delivery times, costs, and more! Custom printed circuit board manufacturing tailored to your needs.

At Chotong Co., Ltd., we accept printed circuit board manufacturing tailored to our customers' needs. From software development and circuit design to assembly, we manage the entire process and deliver the finished product with just one invoice, handling all aspects of PCB manufacturing. 【Features】 ■ Artwork design by experienced design specialists ■ Established network of partner manufacturers ■ Capable of manufacturing from prototypes and small lot diverse products to mass production ■ Support for various substrate materials ■ Consultation available for short lead times on prototypes and mass production *For more details, please refer to our catalog or feel free to contact us.

  • Processing Contract

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LED circuit board

LED circuit board

LED circuit board

This is an example of a custom product with numerous red chip LEDs arranged on a printed circuit board.

  • Lighting for image processing
  • Contract manufacturing
  • Other optical parts

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Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

Introduction to Quartz Glass Micro-Hole Formation and Metal Filling Technology (Developed Product)

It is suitable for applications such as high-frequency low transmission loss substrates (5G communication) and MEMS/sensor substrates!

We would like to introduce our technology for "Quartz Glass Micro-Hole Formation and Metal Filling." It is possible to achieve glass vias without micro-cracks and glass vias with metal filling that are voidless. We can provide flatness for both the glass top surface and the metal top surface. This technology is suitable for applications such as high-frequency low transmission loss substrates (5G communication), high-density flip chip mounting substrates, and MEMS/sensor substrates. 【Features】 ■ Glass vias without micro-cracks ■ Glass vias with voidless metal filling ■ Flatness of glass top surface and metal top surface ■ Wiring patterns on both sides of the glass and multilayer wiring can also be produced *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Development Board Example: "High-Speed Optical Serial to Parallel Conversion Board"

Development Board Example: "High-Speed Optical Serial to Parallel Conversion Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Serial to Parallel Conversion Board" rapidly converts optical serial data into parallel format and sets information to other boards. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interfaces - Optical Input/Output SFP (3.125Gbps) × 3 channels - Parallel Input/Output × 10 channels - Ethernet × 1 channel ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers

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Substrate Remake Service Abirika × Meiko Electronics

Substrate Remake Service Abirika × Meiko Electronics

Circuit board remake service: Revise long-selling circuit boards that you want to continue producing! We will assist you in achieving further long-term supply!!

Even if you want to redesign... The developers from 20 years ago are no longer available. There are no resources allocated for redesign. There is no software specification document. We can solve those problems! We propose products that can be supplied for a longer term, not just microcontrollers! Please consult us when replacing microcontrollers from other companies with Renesas! *For more details, please refer to the PDF document or feel free to contact us.

  • Prototype Services

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Glass capillary

Glass capillary

We will create glass capillaries in the size you desire. They can be used not only for experiments but also as parts for devices and equipment.

■If you provide the desired outer diameter, inner diameter, and length, we will manufacture the glass capillary tube. ■Please consult us for items with strict tolerances.

  • Glassware and containers

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Solenoid Control Board "Solekit Multi Controller"

Solenoid Control Board "Solekit Multi Controller"

Can be connected to a 5V board-mounted solenoid! You can operate up to 4 solenoid kits with a switch.

We handle the solenoid control board "Solekit Multi Controller." It can operate up to 4 Solekits with a switch and is also compatible with 5V board-equipped solenoids (SSAH0830, SSBH0830). Additionally, when the cover is removed, it can be used as a "Multi Controller USB." 【Features】 ■ Can operate up to 4 Solekits with a switch ■ Compatible with 5V board-equipped solenoids ■ Can be used as a "Multi Controller USB" when the cover is removed *For more details, please refer to the PDF document or feel free to contact us.

  • Solenoid Actuators
  • Other machine elements

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SMAP Series Mirror Polishing Machine

SMAP Series Mirror Polishing Machine

Numerous achievements in simplifying polishing work with various materials. A device that allows anyone to easily perform artisan polishing.

The "SMAP" is a mirror shot machine developed with the aim of performing complex three-dimensional irregular shape mirror finishing and micro-burr removal in fine processing, which have been traditionally required needs. The abrasive media of the projected material is completely different from conventional ones; it consists of fine abrasive grains layered around a core material that has elasticity and stickiness, and can be reused through regeneration, contributing to cost reduction. 【Features】 ■ No post-cleaning required due to dry polishing ■ No jigs needed, allowing for immediate polishing ■ Large amounts of polishing material can be ejected from the nozzle, drastically reducing polishing time ■ Minimal shape change of the workpiece due to elastic polishing material, enabling uniform polishing ■ Thin workpieces can be processed without thermal changes *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Processing Contract

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Mirror Polishing Machine "SMAP-IV Type"

Mirror Polishing Machine "SMAP-IV Type"

Shortening processing time with overwhelming projection power! Capable of handling large workpieces that other models cannot.

The "SMAP-IV type" is a mirror shot machine designed for large workpieces. Compared to the "SMAP-II type," the working space and projection volume are more than four times greater. It can handle large workpieces that other models cannot. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air inlet/usage: Φ6 150L/min (0.6MPa) ■ Body dimensions (excluding side door): W1200×H1900×D1125 (mm) ■ Weight: 270kg ■ Power: Main motor 2.2kW, elevator motor 60W, dust collector 0.4kW ■ Media usage: 12L *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment

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Mirror Polishing Machine "SMAP-W Type"

Mirror Polishing Machine "SMAP-W Type"

Successfully developed a movable nozzle that leverages the characteristics of SMAP media! It accommodates polishing for sizes that cannot be held by hand.

The "SMAP-W Type" is a mirror shot machine designed for heavy workpieces. By combining it with a rotating platform on casters, it is possible to polish while also moving the workpiece. We have successfully developed a movable nozzle that takes advantage of the characteristics of SMAP media. Please feel free to contact us when you need assistance. 【Specifications (Excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air outlet/usage: Φ6 10L/min (0.6MPa) ■ Main body dimensions (excluding side door): W1060×H1850×D990 (mm) ■ Weight: 280kg ■ Power: Main motor 2.2kW, elevator motor 60W (conveyor motor) ■ Media usage: 15L *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Orientation CNT substrate

Orientation CNT substrate

Vertically oriented CNTs are produced by depositing a catalyst on a heat-resistant substrate such as metal or ceramics and heating the substrate to 650-800°C in a carbon source CVD gas.

We offer samples of vertically aligned CNT substrates (for a fee) and can also prototype samples that grow vertically aligned CNTs on your desired substrate. We can grow on various three-dimensional shapes, not just flat substrates, but also meshes, fibers, and more. Additionally, we respond to various requests such as selective growth of CNTs on mask patterns and the fabrication of honeycomb CNT films.

  • Other polymer materials

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AlN slice substrate

AlN slice substrate

Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.

We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.

  • others

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厚銅基板　大電流基板

厚銅基板　大電流基板

大電流への対応を可能とした厚銅基板

一般的なプリント基板の回路厚が35μmであるのに対し、2000μmまでの厚銅による回路を実現することにより、大電流への対応を可能とした厚銅基板です。 通常のエッチング工程による回路形成の場合、回路断面は“台型”をしていますが、弊社の大電流基板は“そろばん型”をしているのを特徴としており、 設計値に対してトップ寸法と断面積をより広く確保できます。

  • Printed Circuit Board

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