substrate Product List and Ranking from 581 Manufacturers, Suppliers and Companies

Printed circuit board

We provide printed circuit boards used in various fields.

Daimuta Electronics Co., Ltd. handles single-sided printed circuit boards, double-sided through-hole boards, multilayer printed circuit boards, and assembled products. We have established a consistent production line from materials to shipment, enabling us to respond to any requests with short lead times, from prototyping to mass production. Additionally, we assist in the miniaturization and high performance of electronic devices through the introduction of advanced manufacturing equipment and state-of-the-art inspection equipment and quality control. 【Products】 ■ Printed Circuit Boards - Single-sided printed circuit boards - Double-sided through-hole boards - Multilayer printed circuit boards - Assembled products *For more details, please download the PDF or feel free to contact us.

Company：大牟田電子工業
Price：Other

Printed Circuit Board
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Introduction to the Printed Circuit Board Manufacturing Business

We manufacture composite substrates and high-frequency printed circuit boards tailored to customer users.

The manufacturing base of Kyoei Denshi has established the latest production lines, is engaged in the development of new technologies, and is capable of producing printed circuit boards from prototypes to mass production across a wide range of fields. 【Features】Our unique manufacturing technology allows us to provide circuit boards that cannot be made elsewhere. ■ By utilizing technology to bond aluminum and substrates, we have significantly improved the design flexibility of aluminum-based substrates and enabled aluminum grounding. ■ By laminating honeycomb materials, we achieve both warpage prevention and lightweight, low dielectric properties for the circuit boards. ■ By converting busbars and coils into circuit boards, we realize insulation and miniaturization. *For more details, please contact us or download the PDF for more information.

Company：共栄電資
Price：Other

Printed Circuit Board
substrate

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Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

Company：共栄電資
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Polyester hybrid laminated board [Compatible with products over 1m!]

It is possible to manufacture items exceeding 1 meter! Mainly used as insulation boards for railways and power plants.

We would like to introduce the "Polyester Hybrid Laminated Board" handled by Kyoei Electric Co., Ltd. The polyester resin can be colored with pigments such as white and N7 gray. The laminate thickness ranges from T1 to T40, and the substrate consists of alternating layers of glass cloth and glass mat. Our company can manufacture products exceeding 1 meter, so please feel free to contact us when needed. 【Features】 ■ Polyester resin, vinyl ester resin ■ Substrate: alternating layers of glass cloth and glass mat ■ Laminate thickness: approximately T1 to T40 ■ Maximum dimensions: approximately 1000*2300 ■ Can be colored with pigments in polyester resin (white, N7 gray, etc.) *For more details, please refer to the PDF document or feel free to contact us.

Company：共栄電資
Price：Other

Other polymer materials
substrate

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Printed circuit board

We respond to a variety of products, small lots, and short delivery times with cutting-edge equipment and our unique production management system.

Hokuei Electric Co., Ltd. has been engaged in the assembly of printed circuit boards for automotive and office automation equipment. We respond to a variety of small lots and short delivery times, and we also quickly address new job requests. We take pride in our ability to meet customer demands, including quality, delivery, and cost, with unmatched capability. 【Main Products】 ■ Printed circuit boards for meters ■ Auto light sensors ■ Automotive lighting (for doors) *For more details, please download the PDF or feel free to contact us.

Company：北一電気
Price：Other

Printed Circuit Board
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Printed circuit board assembly

Leave your printed circuit boards and PCB assembly products to us.

We provide support from design to component mounting for printed circuit boards and board-mounted products. We can accommodate printed circuit boards from double-sided boards to high-layer-count boards and impedance boards. Please feel free to consult us for small quantities starting from one piece. 【Features】 ■ One-stop proposal for board design, mounting, and industrial electrical equipment *For more details, please download the PDF or contact us.

Company：新東工業
Price：Other

Printed Circuit Board
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Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

Company：システック開発・ものづくり　高速通信制御（FPGA）
Price：Other

Communications
Circuit board design and manufacturing
substrate

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Characteristics of Daishin Sangyo Co., Ltd.

Even one unit is fine! We can accommodate from small lots to mass production.

Daishin Sangyo Co., Ltd. thoroughly implements the "3S" that is trusted by our customers. (1) Speed (Prompt Response), (2) Service (Proposals/Information Provision), (3) Special (Advanced Technology Support) Our company welcomes requests from design to circuit board production, parts procurement, and rapid delivery of actual layers. We can accommodate from small lots to mass production. Please feel free to contact us. 【Features】 ■ Support for printed circuit boards, design, board production, parts procurement, assembly, and finished products ■ Capable of handling small lots to mass production ■ Able to provide ultra-short delivery times for printed circuit boards ■ Lead-free compliance * For more details, please refer to the PDF materials or feel free to contact us.

Company：大伸産業
Price：Other

Printed Circuit Board
Circuit board processing machine
Other processing machines
substrate

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[Data] BGA Mounting Board Data Specifications

Below t1.6! Here are examples of data specifications for BGA-mounted substrates.

This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.

Company：大伸産業
Price：Other

Printed Circuit Board
Circuit board processing machine
Other processing machines
substrate

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Printed Circuit Board "6-Layer 2-2-2 Build-Up Board"

Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "6-layer 2-2-2 build-up substrate" is a printed circuit board equipped with a 0.3 pitch 144 pin BGA. It features via-on-via with via fill copper plating. The core part has 2 layers of through-hole (TH) with resin filling and cover plating, and the resist is exposed using laser via DI. 【Features】 ■ Via-on-via with via fill copper plating ■ Core part 2-layer TH with resin filling and cover plating ■ Core part 2-layer TH with φ0.2 drill / land diameter φ0.25 *For more details, please refer to the PDF document or feel free to contact us.

Company：大伸産業
Price：Other

Printed Circuit Board
Circuit board processing machine
Circuit board design and manufacturing
substrate

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Printed circuit board "8-layer 6-stage continuous IVH board"

Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima district of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "8-layer 6-stage continuous IVH substrate" is a printed circuit board equipped with a 0.4 pitch 196 pin BGA. The gap between the hole wall patterns is 0.175. L1-2/L1-3/L1-4/L1-5/L1-6/L1-7 IVH passes through L1-8. 【Specifications】 ■ BGA pad/IVH land: φ0.3 ■ Hole wall gap: 0.175 ■ IVH drill diameter - L1-2/L1-3 = φ0.1 - L1-4 to L1-7 = φ0.15 *For more details, please refer to the PDF document or feel free to contact us.

Company：大伸産業
Price：Other

Printed Circuit Board
Circuit board processing machine
Circuit board design and manufacturing
substrate

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GNSS low noise amplifier

Introduction of case studies for equipment using high frequency.

**Features** This is a low-noise amplifier for GNSS (Global Navigation Satellite System). By combining two types of SAW filters, a relative attenuation of over 30dB (compared to 1495.9–1510.9MHz and 1555MHz) is achieved for the L1 (1575.42MHz) and L2 bands (1227.06MHz). It supports various positioning systems, including GPS and the Quasi-Zenith Satellite System (QZSS), and can amplify signals with low noise. Additionally, the power supply is superimposed on the coaxial cable to simplify wiring. *For more details, please download the PDF or feel free to contact us.*

Company：アールエフティ
Price：Other

High frequency/microwave parts
substrate

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Leave it to us for soldering and electronic mechanical parts processing! Catalog available.

For lead-free soldering compliant with RoHS regulations, including flow soldering and reflow soldering, as well as assembly of electronic machinery, [catalog available].

We have 30 years of experience in designing various types of printed circuit boards, from single-sided boards to multilayer boards, including analog and digital circuits. We handle a wide range of precision equipment and industrial machinery, and we look forward to your inquiries, including those from the automotive industry, medical industry, office automation equipment, and amusement sectors. 【Supported Boards】 ◆ Rigid boards and component mounting ◆ Flexible boards and component mounting ◆ Single-sided and double-sided ◆ Multilayer boards *For more details, please download our catalog or feel free to contact us.

Company：オーテ電気
Price：Other

Reflow Equipment
Other mounting machines
substrate

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FA Environment Compatible TWELITE DIP Board

Just replace it with the standard product.

This is a TWELITE board compatible with TWELITE DIP from Monowireless. It has implemented convenient features for the FA environment. 【Features】 - Power enhancement circuit - RST protection circuit - Equipped with FRAM - I2C external pull-up - Input circuit external pull-up

Company：さきラボ
Price：Less than 10,000 yen

Other electronic parts
Embedded Board Computers
Development support tools (ICE, emulators, debuggers, etc.)
substrate

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Manual Exposure Device for Experimental and Research Equipment 'MA-1000 Series'

Unique gap mechanism and high-speed image processing! Multi-layer exposure is possible with the auto-alignment system.

The "MA-1000 series" is a manual exposure device suitable for small-lot production of various types and for experiments and research. It can adopt soft contact exposure and proximity exposure. Additionally, we prepare optical systems that combine ultra-high-pressure mercury lamps, various mirrors, and special lenses appropriately according to the application and substrate size. 【Features】 ■ Capable of soft contact exposure and proximity exposure ■ In-plane uniform illumination using a unique mirror and lens optical system ■ Multi-layer exposure is possible *For more details, please refer to the related links or feel free to contact us.

Company：SCREENファインテックソリューションズ
Price：Other

Other processing machines
substrate

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Germanium substrate

Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!

We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.

Company：エムシーオー
Price：Other

Contract manufacturing
substrate

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Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

Company：グレンエアジャパン
Price：Other

Board to Board Connectors
Printed Circuit Board
substrate

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Printed circuit board

We provide total coordination from circuit board design to product completion!

Our company provides total coordination from CAD design of printed circuit boards to board manufacturing, assembly, sheet metal processing, resin processing, cable processing, and assembly inspection. Since there is a close connection between each process, we streamline manufacturing to reduce time and labor costs while providing high-quality products at lower costs. Please feel free to contact us if you have any requests. *For more details, please do not hesitate to inquire.

Company：メイソル
Price：Other

Contract manufacturing
Circuit board design and manufacturing
substrate

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Processing of support substrates for semiconductor wafers

Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.

At Musashino Fine Glass, we accept processing of support substrates for semiconductor wafers. We offer substrates made of borosilicate glass, non-acrylic glass, and quartz glass. Rectangular substrates can be processed up to a maximum size of 370×470mm, and circular substrates up to a maximum diameter of φ300mm, with processing methods available for sizes as small as 10mm square. During the prototype development phase, we can process from just one piece, so please feel free to consult with us when needed. 【Processing Overview】 ■ Processing Substrates: Borosilicate glass, non-acrylic glass, quartz glass ■ Processing Sizes: Maximum rectangular size 370×470mm, maximum circular size φ300mm (minimum size available upon consultation) ■ Thickness Accuracy: TTV≦1μm is possible ■ Processing Quantity: Processing from one piece during prototype development, mass production is also possible *For more details, please refer to the PDF document or feel free to contact us.

Company：武蔵野ファインガラス
Price：Other

Processing Contract
Circuit board design and manufacturing
Other semiconductors
substrate

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Printed circuit board

From the manufacturing of printed circuit boards to pattern design and component mounting.

Our company is a specialized manufacturer of printed circuit boards located in Kawaguchi City, Saitama Prefecture. We manufacture using small films, allowing for the production of prototypes and small lots with a variety of products. Additionally, we actively manufacture using films retrieved from defunct circuit board companies, which others tend to avoid. 【Our Features】 ■ Low initial costs ■ Partial modifications are possible ■ Production from other companies' films is also possible ■ We propose more cost-effective manufacturing methods ■ Management period for films and plates is a minimum of 5 years *Please feel free to contact us for more details.

Company：ジーティーサーキット
Price：Other

Printed Circuit Board
substrate

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Printed circuit board

Leave everything related to the design, manufacturing, assembly, and procurement of printed circuit boards to us!

Our company provides 24-hour support for the design, manufacturing, assembly, and procurement of printed circuit boards with ultra-short delivery times. We leverage our network across various industries both domestically and internationally to manage and procure semiconductors and electronic components in-house. Additionally, we offer flexible responses from small lot production to mass production and prototype assembly, enabling us to achieve short delivery times and high-quality production that is challenging for overseas manufacturing. 【Features】 ■ Same-day shipping for single-sided boards at the shortest level ■ Initial time reduction system ■ Capable of handling sizes from 0603 ■ Support for large boards (LL) ■ We can produce boards starting from just one piece *For more details, please download the PDF or feel free to contact us.

Company：シーエス工業
Price：Other

Printed Circuit Board
Contract manufacturing
substrate

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Multilayer substrate

The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

Company：ExPlus
Price：Other

Processing Contract
Circuit board design and manufacturing
substrate

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4-layer high-density wiring circuit board

Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM

Company：ExPlus
Price：Other

Circuit board design and manufacturing
substrate

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8-layer rigid-flexible printed circuit board

It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.

Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens

Company：ExPlus
Price：Other

Circuit board design and manufacturing
substrate

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2-layer rigid substrate

It is a commonly used circuit board.

It is a two-layer FR-4 substrate.

Company：ExPlus
Price：Other

Circuit board design and manufacturing
EMS
substrate

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4-layer high-density multilayer substrate

Generally, high multi-layer lamination technology is adopted in manufacturing.

Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ

Company：ExPlus
Price：Other

Circuit board design and manufacturing
substrate

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Tokunaga Manufacturing Co., Ltd. Business Introduction

Visualizing temperature and humidity within the factory to address static electricity! Capable of small-lot production with diverse manufacturing equipment.

TokuNaga Manufacturing Co., Ltd. is a company that assembles printed circuit boards for electronic devices and various electrical components, as well as assembling molded products and metal parts. Within the factory, temperature and humidity are visualized, and at the headquarters, measures are taken to improve low humidity environments using a dry fog humidifier, as well as wearing conductive work clothing, conductive shoes, and grounding bands to address static electricity issues. Additionally, certified personnel are engaged in in-process inspections and soldering work, and to aim for higher skills, education and qualification acquisition are promoted. 【Business Activities】 ■ Printed circuit boards for oil heating devices, power supply equipment, control devices, etc. ■ Assembly of operation panels, power boxes, etc. *For more details, please refer to the PDF materials or feel free to contact us.

Company：徳永製作所
Price：Other

Contract manufacturing
substrate

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Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.

We also have detailed materials explaining mold (potting) and coating that can implement measures for waterproofing, humidity resistance, and earthquake resistance of the implementation substrate.

If the printed circuit board is used as is, it often leads to malfunctioning of the board, damage to components or the board itself, and a reduction in the lifespan of the board. Therefore, for printed circuit boards in harsh environments, measures such as waterproofing, moisture-proofing, vibration-proofing, dust-proofing, and explosion-proofing become necessary. As a countermeasure, resin molding (resin potting) can be used to inject urethane resin into cases, which can shut out dust, dirt, water, and vibrations. Additionally, since the board is fixed in place, it can be protected from vibrations. *Consideration for implementation is possible even without a case. Furthermore, by coating the surface of the board, it is possible to protect the board from dust, dirt, and moisture. *For more details, please refer to the PDF document or feel free to contact us.

Company：東條製作所
Price：Other

Processing Contract
Coating Agent
substrate

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Resin potting that contributes to the vibration resistance and long life of substrates.

By injecting urethane resin into cases, dust, dirt, and water are shut out! This processing technology contributes to the waterproofing, dustproofing, and seismic resistance of printed circuit boards.

Resin potting is a processing technology that allows for the injection of urethane resin into cases, effectively shutting out dust, dirt, and water. Since the circuit board is fixed in place, it can be protected from vibrations. This contributes to the waterproofing, long life, and earthquake resistance of the mounted circuit board. 【Advantages of Resin Potting】 - No worries about dust or dirt adhering to the circuit board - Excellent waterproofing and moisture resistance - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets - Prototyping is possible We will carry out work according to your requirements, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

Company：東條製作所
Price：Other

Processing Contract
Coating Agent
substrate

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Printed circuit board

We specialize in the manufacturing of "single-sided printed circuit boards" and "double-sided printed circuit boards"!

Our company specializes in the manufacturing of printed circuit boards up to "30mm round or 30mm square" and "50mm round or 50mm square" among wiring boards. We are also skilled in small lot production, working with copper-clad laminates ranging from 1 to about 30 sheets as the work size, cutting materials into panels (boards) sized from 255mm square to 340mm square, with our preferred lot size being the production of 10 to 300 panels (boards) per lot. Additionally, we focus on the rare production of "paper phenolic resin boards" in Japan, achieving stable supply. 【Our Features】 ■ Preferred board sizes are small items (compact and small sizes) ■ Preferred lot sizes are small quantities ■ Resist using thermosetting inks and UV-cured inks ■ Basic production involves "repeat production" with press processing ■ Specializing in rigid boards with "single-sided and double-sided" options *Please feel free to contact us for more details.

Company：ベテル工業
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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substrate Product List and Ranking from 581 Manufacturers, Suppliers and Companies | IPROS GMS

substrate Manufacturer, Suppliers and Company Rankings

substrate Product ranking