We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. null/null
  4. 4 null/null
  5. 5 スクリーンプロセス Kanagawa//others
Go to Company Ranking

substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Introduction to the Functional Ceramic Products Division of Nikko Corporation for the 2025 fiscal year.
  2. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  3. 5 Examples of EMS/OEM/ODM Development in Electronic Devices! [Case Study Materials Available]
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Aluminum foil etched circuit board

substrate Product List

346～360 item / All 1407 items

Displayed results
STH technology

STH technology

Implementation of components directly above the through hole and solder balls is possible! Achieving high density in the circuit board.

The "STH technology" is a technique that enables the mounting of components directly above the through-hole by filling the through-hole section. Since pads can be formed directly above the through-hole, it allows for chip component mounting, ball mounting, and wire bonding, making high-density mounting possible. Additionally, it excels in moisture resistance and chemical resistance compared to conventional S/R ink filling, thereby improving the reliability of the through-hole. 【Features】 ■ Enables component mounting directly above the through-hole ■ Allows for high-density mounting ■ Moisture resistance and chemical resistance ■ Improved reliability of the through-hole ■ Can form STH directly under the chip and be used as a thermal through-hole *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Build-up technique

Build-up technique

Complex structures can be realized by combining machining technology, STH technology, and others!

Our build-up substrates enable complex structures through a combination of proprietary technologies (such as milling technology and STH technology), meeting the demands for high density and high functionality. We have a proven track record of drilling holes using laser vias in various materials that possess characteristics such as high heat resistance, high Tg, and chemical resistance. Additionally, our unique vacuum hot press method ensures that there are no voids in the inner layers, allowing for highly reliable build-up substrates with excellent flatness and positional accuracy between inner layer patterns. 【Features】 ■ Capable of forming laser holes directly above through holes in combination with STH technology ■ Fill via method allows laser holes to be filled with Cu plating ■ Achieves even higher density *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Hirayama Fine Tech Co., Ltd. Business Introduction

Hirayama Fine Tech Co., Ltd. Business Introduction

We aim to create products that our customers can trust and feel secure about.

Heiyama Fine Tech Co., Ltd. was founded in 1910, initially engaged in industrial engraving, and has evolved into a manufacturer of printed circuit board design and production, supported by tradition and technical expertise. In 2008, we established a new factory in Uenohara City, Yamanashi Prefecture, and introduced state-of-the-art equipment. Additionally, we have implemented IT integration through electronic tags across all processes, utilizing this data not only for production management but also for quality improvement, and are committed to continuous enhancement. We always maintain a sense of gratitude, value "monozukuri" (craftsmanship) from the customer's perspective, and will continue to promote various technological innovations and value creation. 【Business Content】 ○ Design and manufacturing of printed circuit boards For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to substrate

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.