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substrate(kit) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
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substrate Product List

1～27 item / All 27 items

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5C-SSM evaluation kit_box

5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors
  • substrate

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FSM Adapter Board

FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board
  • substrate

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Rigid substrate

Rigid substrate

Rigid substrate

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Universal board for PIC microcontroller board MB-P11

Universal board for PIC microcontroller board MB-P11

Ideal for electronic projects using PIC microcontrollers.

This is a PIC microcontroller board for experimentation and evaluation compatible with the PIC16F/18F series.

  • Printed Circuit Board
  • substrate

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Integrated design and manufacturing solution services

Integrated design and manufacturing solution services

All of our printed circuit boards, including special products, can be accommodated for assembly!

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers
  • substrate

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OKI Circuit Technology Pattern Design

OKI Circuit Technology Pattern Design

Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.

Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.

This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

Announcement of the "Kii Space HUB" feature and participation in "Ecosystem Link #44".

~ Taiyo TechnoRex Accelerates Its Efforts in the Space Industry ~ An interview article introducing our company's challenges in the space sector has been published on the official website of "Kii Space HUB," a space industry support project promoted by Wakayama Prefecture. ▼ https://kii-space-hub.jp/reports/action-workshop-vol1.html The article summarizes our efforts to apply the FPC technology we have cultivated over many years to the space business, as well as our learnings from entering the field and future prospects. Additionally, on February 24, 2026, our employee Akihiro Moriwaki will present on the potential of FPC for satellites at the event "Ecosystem Link #44 presented by It’s Sta." ▼ https://u-fino.com/event/list/detail/000503.html This event will be held as a gathering place for diverse players in the space industry. Our company will continue to promote the application of technology and business expansion in the space industry.

  • 記事掲載_KiiSpaceHUBｘEcosystem Link #44.jpg
  • 記事ＱＲコード.jpg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • cable
  • substrate

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Board "SY-KUS-01"

Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • substrate

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing
  • substrate

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Support for flex-rigid structures

Support for flex-rigid structures

Achieving miniaturization, high density, and high reliability through flex-rigid integration!

Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Composite board thick wiring board "T-SEC-Board"

Composite board thick wiring board "T-SEC-Board"

Increase the number of layers to match the pin count of the mounted components! We can accommodate thick multilayer printed circuit boards.

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Control board with GPS module [High precision positioning] [Under development]

Control board with GPS module [High precision positioning] [Under development]

Developing a control board equipped with a high-precision positioning GPS module.

■Equipment using a positioning system with centimeter-level accuracy (under development) - Achieves high-precision positioning through GNSS + RTK. - GNSS (Global Navigation Satellite System): Global navigation satellite system - GPS (USA), QZSS (Japan), Galileo (Europe), etc. - RTK (Real Time Kinematic): Relative positioning utilizing ground reference stations - Positioning data from GNSS satellites is received by ground reference stations and mobile stations, and the mobile station uses correction data from the reference station to adjust the positioning data, achieving centimeter-level accuracy.

  • Printed Circuit Board
  • substrate

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Support for high-density components

Support for high-density components

High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Millimeter-wave radar compatible printed circuit board (substrate)

Millimeter-wave radar compatible printed circuit board (substrate)

We would like to propose a printed circuit board equipped with a millimeter-wave antenna!

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing
  • substrate

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High board thickness and narrow pitch printed circuit board manufacturing technology.

High board thickness and narrow pitch printed circuit board manufacturing technology.

High-precision FiTT method! Achieving further high multilayer and high board thickness areas for narrow pitch BGA compatible boards.

We would like to introduce our "High Board Thickness and Narrow Pitch Printed Circuit Board Manufacturing Technology." Based on the FiTT method, we promote high-precision technology to achieve narrow pitch printed circuit boards in the realm of high multilayer and high board thickness. Main applications include semiconductor tester boards, load boards, socket boards, and probe cards. 【Features】 ■ High-precision FiTT method enables narrow pitch BGA compatible boards in high multilayer and high board thickness areas. ■ Supports 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing. ■ Supports 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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5G base station antenna compatible printed circuit board (PCB)

5G base station antenna compatible printed circuit board (PCB)

We would like to propose a printed circuit board for 5G base station antennas!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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400Gbps switch-compatible printed circuit board (PCB)

400Gbps switch-compatible printed circuit board (PCB)

We would like to propose a printed circuit board compatible with 400Gbps switches!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Market Report] Global Market for Ceramic Balls

[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • substrate

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