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substrate(lsi) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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substrate Product List

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Introduction to Takeda Manufacturing Co., Ltd.

Introduction to Takeda Manufacturing Co., Ltd.

We will manufacture tools in a short delivery time to match the testers you have!

Takeda Manufacturing Co., Ltd. is engaged in the development, manufacturing, and sales of boards for LSI testers and various electronic devices. We have a wealth of experience in cable harnesses, checkers, machined products, resin products, sheet metal products (including painting), and other electronic device prototypes. We strive to create safe tools that can be used for a long time, taking the operating environment into full consideration, so please feel free to contact us with your requests. 【Industry】 ■ Development, manufacturing, and sales of boards for LSI testers and various electronic devices. *For more details, please download the PDF or contact us.

  • Evaluation Board
  • Circuit board design and manufacturing

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Examples of customized boards (ASIC-PLC Board C)

Examples of customized boards (ASIC-PLC Board C)

Examples of customized board achievements (ASIC-PLC Board C)

Board Development: Examples of Customized Board Achievements This is an introduction to boards customized by TDG based on user requests and specifications. ■□■ASIC-PLC Board■□■ This is a PLC board equipped with system LSI such as SIC and PLD. The CPU can be selected from Hitachi's H8 or SH series. Additionally, software development and operation using general-purpose ladder programming is possible. <Board for Printing Machines> By controlling with TDG's ASIC board, we achieve high functionality, miniaturization of control panels, reduced wiring, and cost reduction. *For more details, please contact us.

  • PLC

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Test Board Making Service

Test Board Making Service

We can respond to the design and implementation of prototype (small quantity) boards for LSI testing at a low cost and with a short delivery time!

The "Test Board Making Service" provides affordable and quick responses for the design and implementation of prototype (small quantity) boards for LSI testing. The initial cost is 0 yen, and by using direct drawing for production, total costs can be reduced by 20-40%. Delivery can be handled in as little as 4 days at the shortest. We also accommodate measures against crosstalk and high current application. If you have any other requests, please feel free to contact us. 【Features】 ■ Affordable and quick responses for design and implementation ■ Initial cost is 0 yen; produced using direct drawing ■ Total costs reduced by 20-40% ■ Capable of addressing crosstalk measures and high current application *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • others

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Rigid substrate

Rigid substrate

Rigid substrate

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

  • Other electronic parts
  • others
  • Processing Contract

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract

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Prototype and mass production of printed circuit boards.

Prototype and mass production of printed circuit boards.

We specialize in prototype manufacturing and small-scale production of printed circuit boards, primarily focusing on single-sided, double-sided, four-layer, and six-layer boards. In addition to FR-4 material, we can also accommodate aluminum and iron materials.

Manufacturing of high-layer-count multilayer substrates, IVH substrates, build-up substrates, and back-drill substrates with eight or more layers is possible in collaboration with partner companies. We can also accommodate substrate manufacturing using "low dielectric materials" MEGTRON 6 and MEGTRON 7, as well as "FR-4" halogen-free materials. In addition to printed circuit board manufacturing, we also perform the following tasks: - We collaborate with partner companies that have first and second-class qualifications in printed wiring board manufacturing to conduct artwork design and simulation analysis. - We also handle component mounting for prototype projects.

  • Circuit board design and manufacturing
  • Prototype Services
  • Other FA equipment

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Low Thermal Expansion Material

Low Thermal Expansion Material

LEX Zero Thermal Expansion Material CTE = 0 (Zero)

Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)

  • LEX ZERO1.png
  • LEX ZERO2.png
  • LEX ZERO3.jpg
  • LEX ZERO4.png
  • alloy
  • Other optical parts
  • Resin mold

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers

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ATE substrate

ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

  • Printed Circuit Board

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board

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DSP Multi-Modem Board

DSP Multi-Modem Board

Leave the development of the modem to us! We will develop products that comply with international standards and recommendations.

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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AIoT platform 'SY-I50-SOM'

AIoT platform 'SY-I50-SOM'

AI edge computing is possible! Introducing the SOM board equipped with the MediaTek i500 processor.

The "SY-I50-SOM" is an AIoT platform that incorporates the MediaTek i500 (MT8385) for AI/AR/VR applications. It supports advanced full HD multimedia encoding/decoding capabilities, as well as advanced AI features such as deep learning, neural network acceleration, and computer vision applications. Additionally, we offer an evaluation kit called "SY-I50-EVK (tentative)," which serves as a dedicated evaluation environment and development platform for the SY-I50-SOM. 【Features】 ■ SOM board equipped with MediaTek i500 processor ■ Capable of AI edge computing *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials

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[Market Report] Global Market for Ceramic Substrates

[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others

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