We achieve reliable and stable workpiece adhesion and fixation in various industrial machinery and equipment.
The "Porous Chuck" is a component primarily incorporated into dicing saws, bonders, and inspection equipment in the semiconductor manufacturing process.
By utilizing the porous structure of the table surface and negative pressure, it is possible to hold thin silicon wafers flat. We manufacture it as a "one-of-a-kind" product, customizing the appropriate materials and shapes according to the specifications and requests of each customer.
Additionally, we offer a variety of unit products with added functions, such as "HoVaC" and "Surface Emitting Porous Chuck."
【Features】
■ Stable adhesion
■ Diverse porous materials
■ High precision and quality
■ Flatness of 3μm or less
■ MADE IN JAPAN
*For more details, please refer to the PDF document or feel free to contact us.