Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 86 items
It is an adhesive that can cure at lower temperatures and in a shorter time compared to typical one-component epoxy adhesives.
The low-temperature fast-curing epoxy adhesive "A-2201BKLC" has the following features: 【Features】 ■ Can cure at low temperatures of 70-80°C. ■ Can cure in a short time of 30-60 minutes. ■ Compliant with low halogen standards.
It is a flexible adhesive with minimal physical property changes at high temperatures. It is suitable for bonding components that require stress relaxation and parts where silicone resin cannot be used.
The flexible epoxy adhesive series includes the following grades: 【Product Range】 ■ White Grade [A-8511WLC] ■ Black Low-Temperature Curing Grade [A-8530BKLC] We have improved the hardness changes during thermal history, which were a challenge with conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. Both are one-component, thermosetting adhesives that are low-halogen compliant, offering good workability and can be used for bonding various shapes of components. They are suitable for applications where silicone cannot be used due to siloxane, as well as for bonding materials and structures that require stress relief.
It is an epoxy adhesive with a low linear expansion coefficient of 17 ppm and high heat resistance!
<Features> - It is an adhesive with a high glass transition temperature and low expansion and contraction. - It is suitable for bonding areas exposed to high temperatures or where stress from expansion and contraction needs to be reduced. - Heat cycle resistance can be expected. - An environmentally friendly adhesive that complies with SDGs. - A low halogen product managed for total chlorine and total bromine content.
An epoxy-based adhesive developed as a temporary fixing agent for chip components! It reduces the burden on electronic components with low-temperature curing at 90°C for 90 seconds.
Solve the problem of component drop due to chip component miniaturization! We achieve fine coating that overturns conventional wisdom. With 'Seal-glo Chip Adhesive', fine coatings such as 1005CR, which are difficult for other companies, can be applied smoothly without clogging the dispenser or mask openings! We have received numerous inquiries due to the trend of component size reduction. 【Benefits】 - No issues with 1005CR bond application (dispenser/printing) - Proven application for 0603CR bond (dispenser) - Confirmed discharge capability with a nozzle inner diameter of Φ0.075mm - Achieved low-temperature curing at 90℃ for 90 seconds - Stable and moderate height coating shape due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible Compared to other chip adhesives currently in use, 'Seal-glo Chip Adhesive' offers many cost advantages, and there are many cases where it results in VA/VE. We encourage you to consider Fuji Chemical Industry's 'Seal-glo Chip Adhesive' at this opportunity. *For details, please contact us or download the catalog.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "National Tile Industry Association for Adhesive Tiles."
Epoxy adhesive EA=925 is an adhesive for decorative tiles. It has a relatively high viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Decorative Tiles" set by the Japan Tile Industry Association, providing strong adhesion for decorative tiles. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=925 is the standard type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "Japan Tile Industry Association for Adhesive Tile Products."
Epoxy Adhesive for Tile Accessories EA=925 Product Image It strongly adheres tiles. In strength and durability tests, it meets the "Quality Standards for Adhesive Tile Accessories" set by the Japan Tile Industry Association. The epoxy adhesive EA=925 is designed for tile accessories. It has a higher viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Tile Accessories" set by the Japan Tile Industry Association, providing strong adhesion for tile accessories. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=950 is a fast-curing type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
Huntsman’s two-component epoxy fast-curing adhesive. A room temperature rapid curing type that exhibits initial strength in 20 minutes. It can be used universally on a wide range of substrates.
This is a two-component epoxy fast-curing adhesive from the global chemical manufacturer Huntsman. It cures rapidly at room temperature, has high shear and peel adhesion strength, and offers a wide range of adhesion to various substrates. *For more details, please refer to the materials or contact us.*
![One-component heat-releasing epoxy adhesive [developed product]](https://image.mono.ipros.com/public/product/image/03b/2000853160/IPROS12289008076012958777.jpeg?w=280&h=280)
It is an adhesive with a high thermal conductivity of 3.1~3.3 W/m·k.
The thermally conductive one-component epoxy adhesive has the following features: 【Features】 ■ It has a high thermal conductivity (3.1~3.3 W/m·k), making it suitable for thermal dissipation applications. ■ There are grades with a high glass transition temperature of 200°C. ■ It can be considered for heat generation measures and thermal interface materials (TIM). ■ Being a one-component adhesive, there is no need for weighing or mixing, resulting in good workability. ■ It excels in workability, stability, and electrical insulation. ■ Two grades with different reactivity and glass transition temperatures are available for selection.
We will strongly bond the tiles. In strength and durability tests, we meet the quality standards of the "National Tile Industry Association for Adhesive Tile Products."
Epoxy adhesive EA=925 is an adhesive for decorative tiles. It has a relatively high viscosity and is a kneadable type of adhesive. In strength and durability tests, it meets the "Quality Standards for Adhesive Decorative Tiles" set by the Japan Tile Industry Association, providing strong adhesion for decorative tiles. After curing, it becomes translucent, allowing for coloring by mixing in pigments. EA=928 is a high-viscosity type of our tile adhesive. Additionally, due to the properties of epoxy resin, it has good wettability, making it suitable for adhesive applications beyond tiles.
Adhesive for heat sinks that combines aluminum filler, low viscosity, high adhesion, and thermal conductivity.
Epoxy, Etc.'s 70-3812 NC is an innovative solution for industries requiring excellent thermal conductivity and heat resistance, containing aluminum filler. This epoxy adhesive is designed for bonding parts and materials that require heat resistance, making it a superior material in the market. 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It has passed NASA's low outgassing test (ASTM E-595-07), making it suitable for use in outer space.
A fast-curing adhesive with high bonding strength that cures in 5 minutes at room temperature. Used for electronic devices and jewelry.
Epoxy, Etc.'s fast-curing epoxy adhesive boasts high bonding strength and excellent applicability to a wide range of materials and uses. The curing time at room temperature is quick, ranging from 5 to 46 minutes, making it ideal for situations where workability is required. The features are as follows: - High bonding strength. - Rapid curing at room temperature (three stages of speed) - Resistance to water and chemicals - Excellent thermal shock resistance - 1:1 mixing ratio - Impact resistant This adhesive is not only effective for bonding various materials but also meets the UL94HB flammability requirements, making it suitable for use in applications with thermal loads.
![[Specification Sheet Available] TERADITE Adhesive Series](https://image.mono.ipros.com/public/product/image/5ea/2000704845/IPROS56124320361784046822.png?w=280&h=280)
We offer one-component heat-curing types, two-component room temperature curing types, and anaerobic curing types. Samples are also available.
The TERADITE adhesive series from Terada Corporation is an adhesive primarily designed for bonding various metals and plastics. It is made to order, but you can purchase it in small quantities (around a few hundred grams). Samples are also available, so if you are interested, please feel free to contact us. Additionally, customization according to customer requirements is possible. If you wish to customize, please do not hesitate to inquire. ■ Single-component heat-curing epoxy adhesive ■ Two-component room temperature-curing epoxy adhesive (Note: TE-6010 is a potting resin, but it has high suitability for bonding bake boards.) ■ Anaerobic curing (polyepoxy methacrylate) adhesive *For more details, please download the PDF document from the bottom or contact us.
Huntsman’s general-purpose two-component epoxy adhesive. It is in paste form, making it less likely to drip, and has weather resistance and chemical resistance.
This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has good weather resistance and chemical resistance, and it comes in a paste form with a metallic color that can be applied to vertical surfaces. This is a general-purpose grade paste adhesive. If you prefer a low-viscosity product, please consider 2011 or 2012 (RAPID). For more details, please check the documentation or contact us. *Please note that 2013-1 has a hardener that is classified as a toxic substance.
