We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Epoxy adhesive.
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Epoxy adhesive Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Epoxy adhesive Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 理経 Tokyo//IT/Telecommunications
  3. レジナス化成 Tokyo//Manufacturing and processing contract
  4. 4 MUROMACHI CHEMICALS INC. 化学品事業部 Fukuoka//Chemical
  5. 5 ダイゾー ニチモリ事業部 Tokyo//Chemical

Epoxy adhesive Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  2. Epoxy adhesive Araldite RAPID 寺田
  3. Epoxy adhesive Araldite 2014-2 (TDS and SDS available) 寺田
  4. 4 Adhesive Araldite AW106J CI/HV953U J CI 寺田
  5. 5 Epoxy-based adhesive Araldite 2020 (TDS and SDS available) 寺田

Epoxy adhesive Product List

61~75 item / All 85 items

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One-component high strength, high Tg epoxy adhesive

Compatible with low halogenation! High Tg adhesive suitable for plating with tin, zinc, nickel, and more.

The "A-1806BKLC" is a high Tg grade, one-component thermosetting high-strength and high Tg epoxy adhesive that has been improved from the "A-1805BKLC." It possesses high shear and peel adhesion strength, as well as moderate heat resistance, maintaining adhesion even around 170°C. It has good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) and is also compliant with low halogen requirements. 【Features】 ■ High shear and peel adhesion strength ■ Good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) ■ Moderate heat resistance, maintaining adhesion around 170°C ■ Improved high Tg grade from "A-1805BKLC" ■ Compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us.

  • glue

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One-component LCP-compatible epoxy adhesive

Compatible with low halogenation! An adhesive with good adhesion to liquid crystal polymer (LCP).

We would like to introduce our LCP-compatible epoxy adhesive, 'A-7373BKLC.' It can be used for adhesion to liquid crystal polymers (LCP) and has excellent adhesive properties. It is also compliant with low halogen requirements, with a viscosity of 62,000 mPa.s and a gel time of 80 seconds. 【Features】 ■ Excellent adhesion to liquid crystal polymers (LCP) ■ Compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us.

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One-component low-temperature fast-curing epoxy adhesive

It is an adhesive that can cure at lower temperatures and in a shorter time compared to typical one-component epoxy adhesives.

The low-temperature fast-curing epoxy adhesive "A-2201BKLC" has the following features: 【Features】 ■ Can cure at low temperatures of 70-80°C. ■ Can cure in a short time of 30-60 minutes. ■ Compliant with low halogen standards.

  • glue

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Epoxy adhesive series for difficult-to-bond materials

This is a grade that is compatible with materials such as liquid crystal polymer (LCP) and PA9T, which are difficult to bond with conventional adhesives.

The epoxy adhesive series for difficult-to-bond materials includes the following grades: 【Product Group】 ■ Liquid Crystal Polymer (LCP) Grade 【A-7373BKLC】 ■ PA9T Grade 【A-2230BK】 Both are one-component thermosetting adhesives with good workability, suitable for bonding various shapes of components.

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Flexible Epoxy Adhesive Series

It is a flexible adhesive with minimal physical property changes at high temperatures. It is suitable for bonding components that require stress relaxation and parts where silicone resin cannot be used.

The flexible epoxy adhesive series includes the following grades: 【Product Range】 ■ White Grade [A-8511WLC] ■ Black Low-Temperature Curing Grade [A-8530BKLC] We have improved the hardness changes during thermal history, which were a challenge with conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. Both are one-component, thermosetting adhesives that are low-halogen compliant, offering good workability and can be used for bonding various shapes of components. They are suitable for applications where silicone cannot be used due to siloxane, as well as for bonding materials and structures that require stress relief.

  • glue

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Two-component ultra-high heat-resistant epoxy adhesive

It is a product with a glass transition temperature of 269°C, exhibiting particularly excellent heat resistance.

"A-5410-11, H-2410-11" is an adhesive characterized by a high glass transition temperature (Tg) of 269°C, excellent heat resistance, and low linear expansion. Due to its minimal expansion and contraction, it has good heat cycle resistance, making it suitable for use in harsh temperature environments. 【Features】 ■ High Tg and low linear expansion coefficient ■ Good workability for casting applications due to low viscosity ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

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Epoxy-based adhesive Araldite 2011 (TDS and SDS available)

Huntsman’s general-purpose two-component epoxy adhesive. It can be used for bonding a wide range of substrates and has a proven track record in various fields such as automotive and industrial equipment.

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has high toughness and shear and peel adhesion strength, providing a wide range of adhesion to various substrates such as metal, ceramics, rubber, and rigid plastics. *For details, please check the property table below or contact us. *Please note that the 2011 Hardener is classified as a hazardous substance.

  • スクリーンショット 2024-12-09 155014.png
  • Mangan 200ml.JPG
  • Airgun 200ml.JPG
  • Other polymer materials
  • glue

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Epoxy-based adhesive Araldite 2012 (TDS and SDS available)

Huntsman’s two-component epoxy fast-curing adhesive. A room temperature rapid curing type that exhibits initial strength in 20 minutes. It can be used universally on a wide range of substrates.

This is a two-component epoxy fast-curing adhesive from the global chemical manufacturer Huntsman. It cures rapidly at room temperature, has high shear and peel adhesion strength, and offers a wide range of adhesion to various substrates. *For more details, please refer to the materials or contact us.*

  • スクリーンショット 2024-12-09 155014.png
  • Mangan 200ml.JPG
  • Airgun 200ml.JPG
  • Other polymer materials
  • glue

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PARQIT Low Shrinkage Epoxy Adhesive

A light-curing resin with low curing shrinkage that is not affected by positional displacement!

It is suitable for applications where positional misalignment of lenses, holders, fine optical components, sensors, fibers, etc., is a concern. Liquid-curable resins shrink in volume when they change from liquid to solid during the curing reaction. This is called curing shrinkage, and in precision bonding, it can cause issues such as optical axis misalignment and positional displacement. Generally, the curing shrinkage rate of epoxy resins is about 3-5%, and even types containing inorganic fillers have a shrinkage of about 2%. This phenomenon is not limited to epoxy resins; it is also observed in acrylate resins, which typically have a higher shrinkage rate than epoxy, shrinking about 5-10%. The epoxy-based precision adhesive developed by our company contains inorganic fillers and includes types with a curing shrinkage rate below 1%, types with a linear expansion coefficient of 4-7×10^-5, and various curing wavelengths of 300 nm, 360 nm, 405 nm, as well as visible light curing types. *For more details, please download the catalog or contact us.*

  • plastic
  • glue
  • Optical Experimental Parts

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Aluminum filler epoxy adhesive: high thermal conductivity solution

Adhesive for heat sinks that combines aluminum filler, low viscosity, high adhesion, and thermal conductivity.

Epoxy, Etc.'s 70-3812 NC is an innovative solution for industries requiring excellent thermal conductivity and heat resistance, containing aluminum filler. This epoxy adhesive is designed for bonding parts and materials that require heat resistance, making it a superior material in the market. 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It has passed NASA's low outgassing test (ASTM E-595-07), making it suitable for use in outer space.

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Epoxy, Etc. Company's 5-minute curing epoxy adhesive 10-3005

A fast-curing adhesive with high bonding strength that cures in 5 minutes at room temperature. Used for electronic devices and jewelry.

Epoxy, Etc.'s fast-curing epoxy adhesive boasts high bonding strength and excellent applicability to a wide range of materials and uses. The curing time at room temperature is quick, ranging from 5 to 46 minutes, making it ideal for situations where workability is required. The features are as follows: - High bonding strength. - Rapid curing at room temperature (three stages of speed) - Resistance to water and chemicals - Excellent thermal shock resistance - 1:1 mixing ratio - Impact resistant This adhesive is not only effective for bonding various materials but also meets the UL94HB flammability requirements, making it suitable for use in applications with thermal loads.

  • glue

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Epoxy adhesive Araldite 2013-1 (TDS and SDS available)

Huntsman’s general-purpose two-component epoxy adhesive. It is in paste form, making it less likely to drip, and has weather resistance and chemical resistance.

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has good weather resistance and chemical resistance, and it comes in a paste form with a metallic color that can be applied to vertical surfaces. This is a general-purpose grade paste adhesive. If you prefer a low-viscosity product, please consider 2011 or 2012 (RAPID). For more details, please check the documentation or contact us. *Please note that 2013-1 has a hardener that is classified as a toxic substance.

  • Mangan 200ml.JPG
  • Airgun 200ml.JPG
  • Other polymer materials
  • glue

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Epoxy adhesive Araldite 2014-2 (TDS and SDS available)

Two-component epoxy adhesive from Huntsman. In addition to heat resistance up to 140°C, it also has high chemical resistance, water resistance, and thixotropic properties that prevent dripping even at a thickness of 5mm.

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has a heat resistance of up to 140°C and particularly high chemical and water resistance, making it suitable for bonding various materials such as metals, electronic components, and glass. Due to its high heat resistance, it can also be used in relatively high-temperature environments. For more details, please check the documentation or contact us. *Please note that the 2014-2 hardener is classified as a hazardous substance.

  • スクリーンショット 2024-12-09 155014.png
  • Mangan 200ml.JPG
  • Airgun 200ml.JPG
  • Other polymer materials
  • glue

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Epoxy-based adhesive Araldite 2015-1 (TDS and SDS available)

It is a two-component epoxy adhesive from Huntsman. It has excellent toughness and weather resistance. It can fill gaps and has high thixotropy, allowing it to remain non-sagging even at a thickness of 10mm.

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a tough paste that can bond GRP, SMC, and dissimilar materials, and can fill gaps. It does not sag even when applied thickly. For details, please check the properties table below or contact us. It is a non-hazardous substance, making it easy to manage and handle.

  • スクリーンショット 2024-12-09 155014.png
  • Mangan 200ml.JPG
  • Airgun 200ml.JPG
  • Other polymer materials
  • glue

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