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Solder core Product List and Ranking from 6 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

Solder core Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. 石川金属 Osaka//Ferrous/Non-ferrous metals
  2. 日本アルミット 本社 Tokyo//Ferrous/Non-ferrous metals
  3. null/null
  4. 4 千住金属工業 Tokyo//Electronic Components and Semiconductors
  5. 5 松尾ハンダ 本社大和工場 Kanagawa//others

Solder core Product ranking

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Aluminum-compatible solder "EVASOL EAN Series" 石川金属
  2. Solder with antioxidant additives "LFM-H Series" 日本アルミット 本社
  3. Soldering defects: Flux scattering, solder balls (solder with resin) 石川金属
  4. 4 Sn-Bi series low-temperature solder "LEO series" 千住金属工業
  5. 5 Yani-iri handa "72M Series"

Solder core Product List

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Sn-Bi series low-temperature solder "LEO series"

Soldering at 200℃ is possible! Successfully commercialized low melting point alloys, achieving low-temperature mounting.

The "LEO Series" is a Sn-Bi based low-temperature solder suitable for mounting heat-sensitive components and substrates. It uses a low melting point alloy that allows soldering at 200°C, contributing to energy savings, reducing tip wear, and enabling the use of inexpensive materials, which is expected to lower material and manufacturing costs. The emergence of this repairable material accelerates low-temperature mounting using Sn-Bi in reflow ovens. 【Features】 ■ Suppresses the occurrence of splatter ■ Contributes to energy savings and reduces tip wear, leading to cost reduction ■ Allows for good soldering even at a tip temperature of 210°C ■ Development of low-temperature dedicated flux LEO shows good corrosion resistance and insulation properties *For more details, please refer to the PDF document or feel free to contact us.

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High Workability Type Pb-Free Solder

A high-performance type that is comparable to conventional leaded solder!

Especially in the case of flowing solder (pull solder), it demonstrates outstanding cutting performance, free-flowing and entry solder.

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Non-cleaning type solder with flux

Ideal for soldering high-density printed circuit boards of electronic devices that require high reliability.

High-performance solder with excellent non-cleaning type wetting, spreading, and solder joint reliability.

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*Comprehensive Catalog Giveaway [Solder with a Rich Lineup of Flux]*

Introducing some of our solder with resin! All halogens are additive-free! *The downloadable catalog will be the comprehensive catalog!

The "EVSOL HFC Series" is a completely halogen-free solder with resin. It complies with all current halogen-free standards. It uses special activators other than halogens to ensure wettability equivalent to halogen-containing products. It also demonstrates good wettability for nickel and brass, enabling soldering of a wider variety of components. 【Features】 ■ Completely halogen-free ■ Ensures wettability ■ Compatible with difficult substrates *For more details, please refer to the catalog or feel free to contact us.

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EVASOL MYK Series Solder Compatible with Both Light Heating and Soldering Iron

The workability and reliability required for vehicle-mounted equipment! A beautiful appearance that also accommodates lighting devices.

Laser Heating Compatible The "EVASOL MYK Series" selects materials suitable for rapid heating by light. It achieves high workability and demonstrates sufficient wettability even with low Ag alloys, allowing for cost reduction. Significantly Reduced Spatter Base materials are selected in accordance with rapid heating and the melting point rise of solder alloys. There is almost no spatter, enabling higher quality mounting. Colorless Residue The residue color is very light, making it suitable for mounted products where appearance is important, such as LED lighting equipment. It also reduces the burden of visual inspection. 【Features】 ■ Laser heating compatible ■ Significantly reduced spatter ■ Colorless residue for a beautiful appearance *For more details, please refer to the PDF document or feel free to contact us.

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【Special Use Case】Low Ag / No Ag Solder

We introduce solder and solder paste containing flux that is compatible with low Ag and no Ag.

Currently, the introduction of low-silver solder with reduced Ag content and silver-free solder is progressing. The Ag in solder plays roles such as lowering the melting point of the alloy, improving wettability, and increasing mechanical strength, fatigue strength, and creep strength. We offer solder pastes and flux-cored solders compatible with low-Ag and no-Ag options, so please feel free to contact us. 【Product Introduction】 ■ Solder Paste (Bottle) Wettability-focused 1001 Series ■ Flux-Cored Solder Wettability-focused MFJ Series ■ Flux-Cored Solder Splash Prevention MYK Series *For more details, please feel free to contact us.

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Sn-Pb solder "Super Rodin Series"

Excellent wettability, abundant in-vehicle track record.

Good wettability and low spattering Special surfactants achieve both wettability and low spattering. High-quality soldering is possible with various mounted products. Rich automotive track record For over 25 years since its launch, it has been used by many users, including in the automotive sector. *There are three types of rosin-containing solder available depending on the application. GXM Series Standard product of the Super Rojin series. It has a good balance of wettability, low spattering, and reliability, and is widely used in automotive electronic components, home appliances, and consumer products. GXR Series The most reliable product in the Super Rojin series. It is ideal for mounting products that prioritize reliability, such as automotive circuit board components and industrial equipment. GXB Series The product with the highest wettability in the Super Rojin series. It has good wettability even for difficult substrates like brass and is used in switch components. *For more details, please refer to the PDF document or feel free to contact us.

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Difficult-to-solder materials and soldering: "Steclon Series"

Uses fluorine-based special surfactants, providing strong wettability while being compatible with no-rinse applications.

Powerful wettability Special fluorine compounds were used as surfactants. With strong activity, it shows good workability even on difficult base materials such as nickel and brass. Soldering possible on stainless steel Soldering by hand with a soldering iron and robotic soldering is possible even for stainless steel parts that are difficult to solder. Supports no-clean Corrosiveness is suppressed, ensuring reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Supports no-clean ■ Soldering possible on stainless steel *For more details, please refer to the PDF document or feel free to contact us.

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Completely halogen-free compatible! Solder with resin that is also compatible with difficult base materials.

Completely halogen-free compatible! Demonstrates wettability equivalent to halogen-containing products, and is compatible with difficult materials such as nickel and brass!

Our "Yani-iri Solder (HFC Series)" is completely halogen-free and does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. It also demonstrates good wettability for nickel and brass, allowing for soldering of a wider variety of components. Additionally, it uses special activators other than halogens, exhibiting wettability comparable to halogen-containing products.

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Solder with resin entry "SR-HS"

Suitable for soldering multi-pin components and point soldering of through holes.

"SR-HS" is a solder that supports through-hole soldering and allows for high-speed and stable soldering. When soldering to through-hole PCBs, it ensures stable wetting on the back side of the land. Additionally, the spread of flux residue is stable, suppressing interference from flux residue around the soldered area. [Features] ■ Enables high-speed and stable soldering ■ Suppresses flux scattering ■ Compatible with alloys that prevent solder tip erosion *For more details, please download the PDF or feel free to contact us.

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Solder with antioxidant additives "LFM-H Series"

Oxidation can be suppressed, and the metallic luster of the molten solder surface can be maintained!

The "LFM-H Series" is a solder containing antioxidants that achieves "reduction of oxidation dross on the surface of molten solder" and "reduction of solder ball scattering" due to the effects of the antioxidants. We offer a lineup of SAC305, Sn-Cu-based, and copper erosion-resistant alloys. Please feel free to contact us if you have any requests. 【Features】 ■Significantly suppresses the generation of oxidation dross ■Reduces the occurrence of solder balls during dipping *For more details, please download the PDF or feel free to contact us.

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High-performance halogen-free solder "DB-ZERO"

Corresponds to ROL0 of J-STD-004C! Reduction of cleaning labor due to horn generation is possible.

We would like to introduce our high-performance halogen-free solder, 'DB-ZERO.' This product complies with J-STD-004C ROL0. It improves the quality of solder on through-holes required for automatic machine point placement. Additionally, it allows for a reduction in cleaning labor associated with the occurrence of solder spikes. Please feel free to contact us if you have any inquiries. 【Features】 ■ Measures for through-hole quality ■ Halogen-free ROL0 ■ Measures for solder spikes *For more details, please refer to the PDF document or feel free to contact us.

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Yani-iri handa "Shell-RC"

No splattering solder!

"Shell-RC" is a resin-filled solder that minimizes the scattering of flux and solder to the utmost limit. With 100% (※) non-splashing resin-filled solder, we achieve "stable soldering" and "production efficiency" for your products. ※ Based on our research results. 【Mechanism】 1. During V-groove processing, the pressure of the cutter slightly flattens the solder wire, making it oval. 2. To return the oval shape to a circle and to suppress the moisture absorption of the flux, the V-groove is closed. 3. To prevent moisture absorption from the gap created by closing the V-groove, a moisture-proof agent is coated. ※ This has the effect of suppressing the oxidation of the metal surface of the resin-filled solder, resulting in stable and rapid melting of the resin-filled solder. ※ For more details, please feel free to contact us.

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Lead solder

Choose according to your needs! Reducing plastic by adopting paper packaging.

We would like to introduce the leaded solder from Taiyo Electric Industry Co., Ltd., which is safe for beginners to use, available at BuhinDana Co., Ltd. Each product includes soldering methods and tips tailored to its specific application. We offer the "SE-7 series" in a 70g roll for professional use, and the "SD-8 series" in a paper case for hobby use. 【Product Lineup】 <Professional Use (Partial)> ■ SE-75012: For model making ■ SE-75016: For electrical components ■ SE-76006: For high-density mounting ■ SE-76008: For precision printed circuit boards ■ SE-76010: For electronic projects ■ SE-76012: For audio components *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free type: Lead-free solder with resin

Halogen-free products focusing on workability.

Reduce halogenated substances contained in conventional flux to the limit, resulting in environmentally friendly lead-free solder.

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Flux residue removal type: Lead-free solder with resin.

The scattered flux residue does not break or peel off.

Lead-free solder that significantly improves the issues of poor conductivity around the camera lens of mobile phones and within electronic components.

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[JIS A Grade Type] Leaded solder

The heat resistance durability of the flux has improved, demonstrating excellent cleanliness.

Solder with excellent insulation properties and high reliability.

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Aluminum-compatible solder "EVASOL EAN Series"

Uses fluorine-based special surfactants! Offers strong wettability while being compatible with no-wash applications.

Soldering possible with aluminum The "EVASOL EAN series" uses a special fluorine compound as an activator. Even aluminum parts, which are difficult to solder, can be soldered with strong reactivity. New Applications It enables soldering to aluminum wires, which was previously impossible. It allows for the introduction of aluminum wires in a wide range of applications. No-clean compatibility It suppresses corrosion and ensures reliability after joining. Like regular rosin-core solder, cleaning of flux residue is not necessary. 【Features】 ■ Soldering possible with aluminum ■ Enables the introduction of aluminum wires in a wide range of applications ■ No-clean compatibility due to suppressed corrosion *For more details, please refer to the PDF document or feel free to contact us.

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Difficult-to-solder materials compatible solder 'EVASOL ESK Series'

Uses fluorine-based special surfactants! Compatible with no-wash while having strong wettability.

Powerful wettability The "EVASOL ESK series" uses a special fluorine compound as an active agent. With strong activity, it demonstrates good workability even on difficult base materials such as nickel and brass. Soldering of stainless steel is also possible Even for stainless steel parts that are difficult to solder, hand soldering with a soldering iron and robot soldering are possible. Supports no-clean It suppresses corrosion and ensures reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Soldering of stainless steel is also possible ■ Supports no-clean *For more details, please refer to the PDF materials or feel free to contact us.

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Solder with flux for aluminum wire "EVASOL C601 Series"

Supports terminal processing of aluminum wire, achieving high joint reliability.

Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.

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Soldering defects: wet defects, bridges, horns (solder with flux)

We will introduce knowledge and techniques related to soldering defects, such as material selection.

Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.

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Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.

One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.

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Soldering defect: residue cracking

We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.

Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.

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【Special Application Example】Laser Soldering (Paste, Flux-Cored Solder)

Introducing laser soldering.

Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.

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Focus on moisture resistance and compliant with halogen-free standards! EYP series solder with resin.

Halogen-free standard compliant! Significantly reduced scattering, enabling high-quality mounting! Demonstrates sufficient wettability even at low output, reducing damage to mounted components due to heat.

Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.

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Solder 'EVASOL DDL Series' for preventing residue cracking.

Clear the reliability and operability required for in-vehicle use.

Joint development with Denso Specialists in automotive electrical components fully cooperate in specification formulation and product evaluation. Achieving high levels of reliability and workability. Prevention of residue cracking The residue has flexibility, preventing cracks from thermal shock and vibrations. Cost reduction is possible by omitting the coating process. Compatible with various methods Compatible with various methods such as hand soldering, soldering robots, and lasers. Widely adaptable to diversifying mounted products. 【Features】 Prevention of residue cracking, no coating material required Compatible with laser heating methods Good workability *For more details, please refer to the PDF materials or feel free to contact us.

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Laser soldering iron compatible, soldering "EVASOL EYP Series"

J-STD-709 halogen-free standard compliance Strong wettability for nickel base material

Laser Heating Compatibility Materials suitable for rapid heating by laser are selected. They exhibit sufficient wettability even at low power, reducing damage to mounted components due to heat. Significantly Reduced Spattering Base materials are chosen to match the rapid heating and the melting point rise of solder alloys. There is almost no spattering, enabling higher quality mounting. No-Clean Compatibility Corrosiveness is minimized, ensuring reliability after joining. Like standard flux-containing solders, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult substrates ■ Significantly reduced spattering ■ No-clean compatibility *For more details, please refer to the PDF document or feel free to contact us.

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