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Solder core Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Solder core Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 石川金属 Osaka//Ferrous/Non-ferrous metals
  2. 千住金属工業 Tokyo//Electronic Components and Semiconductors
  3. 日本アルミット 本社 Tokyo//Ferrous/Non-ferrous metals
  4. 4 小島半田製造所 Chiba//Manufacturing and processing contract
  5. 5 松尾ハンダ 本社大和工場 Kanagawa//others
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Solder core Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum-compatible solder "EVASOL EAN Series" 石川金属
  2. Soldering defects: Flux scattering, solder balls (solder with resin) 石川金属
  3. Solder with flux for aluminum wire "EVASOL C601 Series" 石川金属
  4. 4 Sn-Bi series low-temperature solder "LEO series" 千住金属工業
  5. 5 Solder with resin entry "SR-HS" 日本アルミット 本社

Solder core Product List

16～30 item / All 30 items

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Aluminum-compatible solder "EVASOL EAN Series"

Aluminum-compatible solder "EVASOL EAN Series"

Uses fluorine-based special surfactants! Offers strong wettability while being compatible with no-wash applications.

Soldering possible with aluminum The "EVASOL EAN series" uses a special fluorine compound as an activator. Even aluminum parts, which are difficult to solder, can be soldered with strong reactivity. New Applications It enables soldering to aluminum wires, which was previously impossible. It allows for the introduction of aluminum wires in a wide range of applications. No-clean compatibility It suppresses corrosion and ensures reliability after joining. Like regular rosin-core solder, cleaning of flux residue is not necessary. 【Features】 ■ Soldering possible with aluminum ■ Enables the introduction of aluminum wires in a wide range of applications ■ No-clean compatibility due to suppressed corrosion *For more details, please refer to the PDF document or feel free to contact us.

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Difficult-to-solder materials compatible solder 'EVASOL ESK Series'

Difficult-to-solder materials compatible solder 'EVASOL ESK Series'

Uses fluorine-based special surfactants! Compatible with no-wash while having strong wettability.

Powerful wettability The "EVASOL ESK series" uses a special fluorine compound as an active agent. With strong activity, it demonstrates good workability even on difficult base materials such as nickel and brass. Soldering of stainless steel is also possible Even for stainless steel parts that are difficult to solder, hand soldering with a soldering iron and robot soldering are possible. Supports no-clean It suppresses corrosion and ensures reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Soldering of stainless steel is also possible ■ Supports no-clean *For more details, please refer to the PDF materials or feel free to contact us.

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Solder with flux for aluminum wire "EVASOL C601 Series"

Solder with flux for aluminum wire "EVASOL C601 Series"

Supports terminal processing of aluminum wire, achieving high joint reliability.

Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.

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Soldering defects: wet defects, bridges, horns (solder with flux)

Soldering defects: wet defects, bridges, horns (solder with flux)

We will introduce knowledge and techniques related to soldering defects, such as material selection.

Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.

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Soldering defects: Flux scattering, solder balls (solder with resin)

Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.

One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.

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Soldering defect: residue cracking

Soldering defect: residue cracking

We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.

Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.

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Focus on moisture resistance and compliant with halogen-free standards! EYP series solder with resin.

Focus on moisture resistance and compliant with halogen-free standards! EYP series solder with resin.

Halogen-free standard compliant! Significantly reduced scattering, enabling high-quality mounting! Demonstrates sufficient wettability even at low output, reducing damage to mounted components due to heat.

Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.

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Solder 'EVASOL DDL Series' for preventing residue cracking.

Solder 'EVASOL DDL Series' for preventing residue cracking.

Clear the reliability and operability required for in-vehicle use.

Joint development with Denso Specialists in automotive electrical components fully cooperate in specification formulation and product evaluation. Achieving high levels of reliability and workability. Prevention of residue cracking The residue has flexibility, preventing cracks from thermal shock and vibrations. Cost reduction is possible by omitting the coating process. Compatible with various methods Compatible with various methods such as hand soldering, soldering robots, and lasers. Widely adaptable to diversifying mounted products. 【Features】 Prevention of residue cracking, no coating material required Compatible with laser heating methods Good workability *For more details, please refer to the PDF materials or feel free to contact us.

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Laser soldering iron compatible, soldering "EVASOL EYP Series"

Laser soldering iron compatible, soldering "EVASOL EYP Series"

J-STD-709 halogen-free standard compliance Strong wettability for nickel base material

Laser Heating Compatibility Materials suitable for rapid heating by laser are selected. They exhibit sufficient wettability even at low power, reducing damage to mounted components due to heat. Significantly Reduced Spattering Base materials are chosen to match the rapid heating and the melting point rise of solder alloys. There is almost no spattering, enabling higher quality mounting. No-Clean Compatibility Corrosiveness is minimized, ensuring reliability after joining. Like standard flux-containing solders, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult substrates ■ Significantly reduced spattering ■ No-clean compatibility *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free solder "EVASOL HFC Series"

Halogen-free solder "EVASOL HFC Series"

All halogens are additive-free, good wettability.

Completely Halogen-Free The 'EVASOL HFC Series' does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. Ensured Wettability We use special surfactants that are not halogen-based. It demonstrates wettability equivalent to halogen-containing products. Compatible with Difficult Substrates It shows good wettability on nickel and brass. This allows for soldering of a wider variety of components. 【Features】 ■ Complies with halogen-free standards ■ Excellent wettability ■ Compatible with difficult substrates *For more details, please refer to the PDF document or feel free to contact us.

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High operability solder "EVASOL MFJ Series"

High operability solder "EVASOL MFJ Series"

3Ag, compatible with both low Ag! Excellent workability and low scattering.

- Good wettability even with low Ag The "EVASOL MFJ series" has improved wettability significantly, making it compatible with low Ag alloys. It allows for cost reduction while maintaining work efficiency comparable to 3Ag. - Reduced splatter The base material is selected according to the melting point increase of the solder alloy. This results in less splatter and enables higher quality mounting. - Excellent wettability retention By combining surfactants, the retention of wettability has improved. Stable mounting is possible regardless of the size or type of components. 【Features】 ■ Excellent wettability even with low Ag ■ Minimal splatter ■ Improved wettability characteristics *For more details, please refer to the PDF document or feel free to contact us.*

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Water-soluble flux solder "EVASOL WSG Series"

Water-soluble flux solder "EVASOL WSG Series"

Good water washability, excellent wettability, and low scattering.

Good water washability "EVASOL WSG Series" uses a water-soluble base material instead of rosin. Residues after soldering can be easily washed away with water. Excellent wettability By selecting surfactants tailored to the base material, wettability has been improved. Stable mounting is possible regardless of the type of components. Reduced splatter Thanks to the effects of special surfactants, solder and flux splatter has been reduced. This enables the assurance of higher mounting quality. 【Features】 ■ Good water washability ■ Excellent wettability ■ Significantly reduced splatter *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free solder "EVASOL HRK Series"

Halogen-free solder "EVASOL HRK Series"

Halogen-free standard compliant, excellent wettability and low scattering.

Halogen-free standard compliant No Cl or Br added, which are the causes of dioxin generation. Complies with most halogen-free standards. Ensured wettability Special surfactants other than Cl and Br are added. It demonstrates good wettability while complying with halogen-free standards. Reduced scattering The use of special surfactants has reduced scattering. It helps to minimize substrate contamination and ensures higher assembly quality. 【Features】 ■ Excellent wettability ■ Significantly reduced scattering ■ Halogen-free standard compliant *For more details, please refer to the PDF document or feel free to contact us.

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