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Ultrasonic cutter Product List and Ranking from 30 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Ultrasonic cutter Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アドウェルズ Fukuoka//Manufacturing and processing contract
  2. テクノアルファ Tokyo//Electronic Components and Semiconductors
  3. ファインテック日本 Tokyo//Industrial Electrical Equipment
  4. 4 兼松ＰＷＳ Kanagawa//Industrial Machinery
  5. 5 null/null
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Ultrasonic cutter Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. DMB bonding application using ultrasonic bonding アドウェルズ
  2. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
  5. 5 Aluminum wire bonder/ribbon bonder ASTERION テクノアルファ

Ultrasonic cutter Product List

61～75 item / All 86 items

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High-performance material ultrasonic cutter "Manufactured by Adwells Corporation"

High-performance material ultrasonic cutter "Manufactured by Adwells Corporation"

We have achieved high-quality cut surfaces without burrs, dust, cutting debris, or warping through our unique ultrasonic cutting technology, which significantly reduces cutting load.

A variety of high-performance materials are being developed to improve product performance in a wide range of applications, including electronics. Cutting technologies that maximize the properties of these materials are in demand. Adwell's ultrasonic cutter contributes to the development and manufacturing technology of electronic products and resin/rubber products.

  • UC1000SA.JPG
  • UC1000LS.JPG
  • Capacitor

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High-precision low-load flip chip bonder CB-600 by Athlete FA

High-precision low-load flip chip bonder CB-600 by Athlete FA

Achieving a mounting accuracy of ±1 [μm] and an ultra-low load of 0.049 [N]! High-precision bonding compatible with extremely low loads.

The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)

A lineup of features that meet the needs of various factories! Industry-leading speed FCB (Flip Chip Bonder) specialized for small chips.

The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.

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  • Bonding Equipment

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Tabletop Ultrasonic Cutter 'BC-KW430C'

Tabletop Ultrasonic Cutter 'BC-KW430C'

Smooth cutting operations with ultrasonic vibrations!

The 『BC-KW430C』 is a compact handheld tabletop ultrasonic cutter that allows you to easily cut straight lines and curves with a pen-like feel, without applying much force. By applying fine vibrations of 40,000 times per second to the tip of the blade, it smoothly cuts through various biological tissues and products. Additionally, the cut surface is clean and smooth, without damaging the material. 【Specifications】 ■ Frequency: 40kHz ■ Maximum Output: 30W ■ Input Power: AC100V 50/60Hz ■ Dimensions: 270(W) × 170(D) × 140(H) mm ■ Weight: Approximately 3kg *For more details, please download the PDF or contact us.

  • cutter

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Ultrasonic Cutter UC1000LS

Ultrasonic Cutter UC1000LS

Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.

The "UC1000LS" is an ultrasonic cutter that assists in the precision cutting of industrial products using ultrasonic technology. By applying high-frequency vibrations to the blade, it suppresses material deformation during cutting, allowing for high-quality cross-sections. Additionally, by controlling the position with a high-precision actuator, it achieves half-cutting of thin materials. 【Features】 ■ Assists in the precision cutting of industrial products with ultrasound ■ Cuts metal and plastic materials with high-quality cross-sections ■ Achieves high-precision half-cutting even for thin materials ■ Allows for shape cutting with shaped blades ■ Cuts out small parts while feeding the material stage *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Ultrasonic Ribbon Bond RB0300SS

Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment

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Tabletop Semi-Automatic Ultrasonic Cutter 'USC Pro8'

Tabletop Semi-Automatic Ultrasonic Cutter 'USC Pro8'

For central kitchens! Small semi-automatic ultrasonic cutter for food processing.

The "USC Pro8" is a newly developed small, semi-automatic ultrasonic cutter designed for central kitchens operated by medium and small-sized businesses, which traditionally used large equipment running on mass production lines for food processing. We aim to provide solutions for customers who have found it difficult to implement such systems, focusing on efficiency and quality stabilization. We encourage you to adopt this product and share your feedback with us. 【Features】 ○ An automatic cutting device that cuts into the set shape and also cleans the blade edge. ○ Capable of making clean cuts. → Suitable for cutting hard frozen items as well as soft items that are prone to losing shape. ○ Allows for high-quality cutting operations to be safely repeated without requiring advanced skills. ○ The cutting speed can also be set. → Can be utilized for various items. For more details, please contact us or download the catalog.

  • Food Cutting Equipment

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LED flip chip bonder

LED flip chip bonder

LED flip chip mounting device

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

  • Other mounting machines

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Ultrasonic cleaning machines, application equipment, measuring instruments / Honda Electronics

Ultrasonic cleaning machines, application equipment, measuring instruments / Honda Electronics

Featuring a wide range of products including flow-type cleaning machines, ultrasonic cutters, and ultrasonic welders!

This catalog introduces the "ultrasonic cleaning machines, application devices, and measuring instruments" handled by Oki Sangyo. It features a wide range of products, including the flow-type cleaning machine "W-357-1MPG," the ultrasonic cutter "ZO-80," the ultrasonic welder "SONAC-200," and the ultrasonic level gauge "HD350 series." Please make use of this for selecting products. [Contents] ■ Ultrasonic cleaning equipment ■ Ultrasonic application devices ■ Ultrasonic measuring instruments ■ Ultrasonic vibration devices ■ Optional items ■ Company overview *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Other measurement, recording and measuring instruments
  • Ultrasonic Cleaner

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High-precision flip chip bonder 'femto2'

High-precision flip chip bonder 'femto2'

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

  • Other semiconductor manufacturing equipment

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High-precision, high-function flip chip bonder: sigma

High-precision, high-function flip chip bonder: sigma

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

  • Bonding Equipment

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Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Multipurpose Die Bonder / Flip Chip Bonder "pico 2"

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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ASMPT's ultra-high precision flip chip bonder 'NANO'

ASMPT's ultra-high precision flip chip bonder 'NANO'

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

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  • Bonding Equipment

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ASMPT manufactured flip chip bonder - Novaplus

ASMPT manufactured flip chip bonder - Novaplus

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

  • Bonding Equipment

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Hobby Ultrasonic Cutter ZO-80II(2)

Hobby Ultrasonic Cutter ZO-80II(2)

Plastic cuts like butter! Convenient for reducing cutting work time!

The ultrasonic cutter is a tool that shortens work time by utilizing the blade, vibration, and frictional heat through the transmission of ultrasonic vibrations to the blade, file, and whetstone. The hobby ultrasonic cutter ZO-80 has been discontinued, and the successor model ZO-80II has been released with unchanged cutting performance. Features: - Equipped with the best cutting performance for hobby ultrasonic cutters, featuring Super High Mode (Super High Mode is not a function used continuously). - Power settings are available in three levels (Normal Mode, High Mode, Super High Mode). - By using the optional foot switch ZH801, a 10-minute timer can be turned off. - Handpiece parts can be purchased separately (ZH802/ZH803). - Automatic stop function (10 minutes in Normal Mode, 5 minutes in High Mode, 3 minutes in Super High Mode).

  • cutter
  • Power tools

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