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Ultrasonic cutter Product List and Ranking from 30 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Ultrasonic cutter Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所 Tokyo//Industrial Machinery
  3. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  4. 4 null/null
  5. 5 テクノアルファ Tokyo//Electronic Components and Semiconductors
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Ultrasonic cutter Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Ultrasonic Cutter SONOPET JII Series 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所
  2. High-precision flip chip bonder 'femto2'
  3. High-precision die bonder and flip chip bonder 'lambda2'
  4. 4 ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Ultrasonic cutter Product List

31～60 item / All 84 items

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

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Flip Chip Bonder "FB2000SS"

Flip Chip Bonder "FB2000SS"

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

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Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>

Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>

Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.

The "UC1000SA" is a standalone ultrasonic cutter that can cut multilayer materials, such as all-solid batteries with a multilayer structure, without dragging. Thanks to the various sensor information built into the device, the process operation can be understood in detail, making it effective for process startup and mass production management. Additionally, by applying high-frequency vibrations from ultrasonic waves to the blade, it cuts while suppressing material deformation, resulting in high-quality cross-sections without burrs or warping. 【Features】 ■ Cuts metal foils with high-quality cross-sections ■ Cuts multilayer materials without dragging ■ Easy integration into automated systems ■ Comprehensive process monitoring capabilities *For more details, please download the PDF or feel free to contact us.

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Flexible substrate ultrasonic bonding application

Flexible substrate ultrasonic bonding application

There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!

We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.

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DMB bonding application using ultrasonic bonding

DMB bonding application using ultrasonic bonding

Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.

We would like to introduce our technology, "DMB Joining Application using Ultrasonic Welding." With Adwells' ultrasonic welding devices "UB2000/3000/5000LS," we achieve the joining of DMB sheets made from copper (Cu) and aluminum (Al) for power devices and areas requiring low thermal conductivity. The fine protrusions on the DMB sheets serve as the joining points, making it easier for materials to bond together and allowing for adaptation to various applications. 【Features】 ■ Can join materials that can only withstand low loads and low power ■ Does not scratch the surface of materials ■ Can join materials with a large surface area ■ Can join thicker materials ■ Can join devices that are molded *For more details, please download the PDF or feel free to contact us.

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Ultrasonic Tube Sealer "UTS-50S"

Ultrasonic Tube Sealer "UTS-50S"

World's first! Desktop ultrasonic sealing machine

The "UTS-50S" is a desktop ultrasonic tube sealer characterized by its compact body and high production capacity. - It is specialized for small-lot production of various types, allowing for reduced initial investment. - Being a desktop model, it takes up little space. - Back filling reduces the need for capping processes and personnel. - The cavitation effect ensures no defects. - It features a skill-less design that can be mastered in just three minutes, even by beginners. - Tool-free setup changes are easy. - The energy-efficient design keeps electricity costs low. - Only one holder is needed for parts, incurring no extra running costs. - In-house prototyping accelerates product development. [Features] ■ High production capacity ■ Space-saving, suitable for cell production ■ Compatible with tube lengths from 70 to 220 mm ■ Optional marking function can be added *For more details, please refer to the PDF document or feel free to contact us.

  • Sealing
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ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.

The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.

  • Other electronic parts
  • Ultrasonic cutter

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Small-scale production and development die bonder / flip chip bonder DB258

Small-scale production and development die bonder / flip chip bonder DB258

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.

  • Bonding Equipment
  • Ultrasonic cutter

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High-precision die bonder / flip chip bonder FDB210 / 211

High-precision die bonder / flip chip bonder FDB210 / 211

It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.

  • Other semiconductor manufacturing equipment
  • Ultrasonic cutter

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Ultrasonic Cutter "SUW-30 Series"

Ultrasonic Cutter "SUW-30 Series"

Supports various cutting scenes! Easy and simple cutting.

The "SUW-30 Series" is an ultrasonic cutter that allows for easy, light, and smooth cutting of targeted lines beautifully. We offer four products: the "SUW-30CD," which enables dynamic cutting while standing; the "SUW-30CT," suitable for precise and detailed tabletop work using a foot switch; the "SUW-30CTL," which can accommodate a longer blade; and the "SUW-30CMH," designed to be mounted on dedicated machines or robots to enhance labor-saving efficiency. Tasks that typically take a long time with a standard utility knife can be completed easily, lightly, and quickly. 【Product Lineup】 ■ SUW-30CD: Convenient handheld switch type ■ SUW-30CMH: Equipped with external input terminal and cooling air nipple ■ SUW-30CT: Designed for tabletop work ■ SUW-30CTL: Capable of mounting a blade with a total length of 27mm (effective length 22mm) *For more details, please refer to the related links or feel free to contact us.

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[Ultrasonic Cutter Application Example] Tried welding using the back of the blade.

[Ultrasonic Cutter Application Example] Tried welding using the back of the blade.

[Demo units available] Introducing application examples of the compact ultrasonic welding machine series.

Are you under the impression that ultrasonic cutters are only used for cutting materials? Both ultrasonic cutters and ultrasonic welding machines operate on the same principle, amplifying the vibrations of the transducer through a horn to process the tip. In this instance, we will introduce a method of using the Suzuki ultrasonic cutter to cut materials and then directly use the cutter to weld them in a linear fashion. By tilting the cutter blade horizontally and using it on a surface, it can also be used for adding resin, and using the back of the blade allows for continuous welding close to the blade width. 【Application Examples】 ■ Target Material: Non-woven fabric: Thickness 0.6mm (0.15mm x 4 sheets) ■ Equipment Used: Ultrasonic Cutter SUW30CD, Replacement Blade H4 ■ Content: Continuous welding using the back part of the cutter blade 【Examples of Cutter Adoption in 2019】 - Model and figure production, model parts processing - Adhesive removal - Acrylic pipe cutting - Cutting of vulcanized rubber rolls - Cutting of candles - Fire investigation - Cutting and welding of nylon ropes - Cutting of soft leather for clothing - Cutting of canvas and tarpaulin - Destructive testing of blow-molded products *Please see the list of examples at the URL below.

  • Special Processing Machinery
  • Resin processing machine
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Hobby Ultrasonic Cutter ZO-40II

Hobby Ultrasonic Cutter ZO-40II

Plastic cuts like butter!

The ultrasonic cutter ZO-41, released on May 15, 2014, features two cutting modes: normal mode and high mode, and it also incorporates an automatic adjustment function (T.A.F circuit), making it the best-selling model in the ZO series. This time, without changing the cutting performance, we have made a minor change by adding one requested operation method, and it has been introduced as ZO-41II (2).

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High-performance ultrasonic cutter "Sonic Cutter ZERO"

High-performance ultrasonic cutter "Sonic Cutter ZERO"

Light touch with sharp cutting ability! Beautiful cutting surfaces and finishes can be achieved with ultrasonic vibrations.

The "Sonic Cutter ZERO" is a high-performance cutter that utilizes ultrasonic vibrations at a frequency of 38,000 to 40,000 times per second. It demonstrates its power in cutting applications that require complex shapes and precision. (For materials such as fabric, rubber, film, plastic, urethane, and pattern modification of printed circuit boards, etc.) It is ideal for cutting, trimming, window cutting, design cuts, and deburring of various thin materials. Since there is no vibration transmitted to the hand, it allows for precise blade placement, enabling highly accurate cuts. 【Features】 ■ Improved visibility ■ Lightweight ■ Reduced heat generation ■ Equipped with heat protection function ■ Worldwide power supply compatibility

  • Cutter/Scissors
  • Ultrasonic cutter

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Ultrasonic tube sealer

Ultrasonic tube sealer

It is a compact all-digital controlled ultrasonic tube sealing unit.

The ultrasonic oscillation control is entirely digital, and in addition to time control, energy control and dimensional control can also be used. The pressurization mechanism is also fully digitally controlled, making it a precision ultrasonic sealing unit with excellent reproducibility and stability.

  • Ultrasonic Oscillator
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[Technical Information] Effectiveness of Ultrasonic Cutters

[Technical Information] Effectiveness of Ultrasonic Cutters

We have solved the drawbacks of water jet cutting and press machine die cutting!

We would like to introduce the effectiveness of ultrasonic cutters. When industrially cutting complex soft materials such as carpets and interior panels into intricate shapes, traditional methods have included water jet cutting and die cutting using press machines. The cutting method using ultrasonic cutters addresses the shortcomings of three methods: water jet cutting, laser cutting, and die cutting with press machines. This technique was certified in September 2005 as part of the government's initiative for "cross-industry collaboration and new business field development" (commonly known as new collaboration). 【Addressed Shortcomings】 ■ Water Jet Cutting: While capable of high-speed and diverse shape cutting, it has challenges such as equipment and running costs, the impact of water usage on the material being cut, and burrs that form on the cutting surface. ■ Laser Cutting: Risk of material melting and ignition. ■ Die Cutting with Press Machines: Suitable for mass production but has difficulties in accommodating design changes. *For more details, please refer to the PDF document or feel free to contact us.

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  • Plastic processing machines (cutting and rolling)
  • Ultrasonic cutter

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Small Ultrasonic Cutter / Model Number M2745EK-412E

Small Ultrasonic Cutter / Model Number M2745EK-412E

It has two cutting modes: normal mode and high mode, and also features an automatic adjustment function (T.A.F circuit).

■Minimizing melting to the utmost: T.A.F circuit The ultrasonic cutter adjusts its cutting ability (input to the transducer) based on the load applied to the blade during cutting (such as the hardness, thickness, and melting state of the object, the user's force application, and the angle of the blade). - When the load is high: High cutting ability (input to the transducer) - When the load is low: Low cutting ability (input to the transducer) The ultrasonic cutter is a tool that cuts while vibrating. During cutting, frictional heat is generated due to the vibration of the object being cut and the blade. This has been adopted as the best driving method currently considered, reflecting the user's desire to reduce melting caused by this frictional heat. ■No need to keep pressing the button? Do you want it to operate only while pressed? In response to user feedback that it is difficult to work while pressing the button, conventional machines introduced an operation method where the handpiece switch operates for 10 minutes after being pressed and released. (It stops if pressed again.) Since it continues to operate even when the finger is released, there are also requests to operate only while the button is pressed, so the M2745EK-412E allows users to choose either operation when powering on.

  • Cutter/Scissors
  • Ultrasonic cutter

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COF/COG compatible flip chip bonder

COF/COG compatible flip chip bonder

Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.

Full automation is possible at a low cost through integration with the conveying system.

  • Bonding Equipment
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Cell production compatible, ultrasonic compatible flip chip bonder

Cell production compatible, ultrasonic compatible flip chip bonder

Cell production support. Capable of handling everything from multi-variety production applications to process and material development!

● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.

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High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
  • Ultrasonic cutter

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[Technical Information] The Principle of the Ultrasonic Cutter 'Sonofile'

[Technical Information] The Principle of the Ultrasonic Cutter 'Sonofile'

Introducing the principles and features of ultrasonic cutters that can be used for various applications!

This document contains technical information about the ultrasonic cutter "Sonofile," which can be mounted on robots as a tool for cutting and deburring. This product makes it easy to cut materials that are difficult to cut with standard cutters, such as plastic products, rubber products, non-woven fabrics, composite materials made by layering these, film products, and food items where the cutting surface is important. We also introduce the principles, features, and examples of processing. [Contents] ■ What is ultrasound? ■ What is cutting with an ultrasonic cutter? ■ Principles of the ultrasonic cutter SONOFILE ■ Features of the ultrasonic cutter SONOFILE ■ Examples of processing *For more details, please refer to the PDF document or feel free to contact us.

  • Ultrasonic Oscillator
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Ultrasonic Cutter "Sonofile"

Ultrasonic Cutter "Sonofile"

Easily cut through resin products and composite materials that are difficult to cut with regular blades!

Sonotec's ultrasonic cutter, the "SONOFILE series," facilitates the cutting of resin products and composite materials that are difficult to cut with conventional blades by vibrating the blade 20,000 to 40,000 times per second. A wide range of materials, including composites, plastics, rubber, and leather, can be cut freely with minimal processing pressure, sharp cross-sections, and no chips. By attaching the tool to a robotic hand, it is possible to perform three-dimensional processing and use air cooling, enabling 24-hour operation. In addition to having low initial costs and running costs, it excels in maintainability, generates almost no dust, and is environmentally friendly. = 2020 Fiscal Year, 17th Kawasaki Manufacturing Brand Certified Product = = Certified by the Ministry of Economy, Trade and Industry as one of the "100 New Global Niche Top Companies" = [Features] ■ Easy cutting of resin products and composite materials ■ Capable of 24-hour operation with robotic hand attachment ■ Almost no dust generated, environmentally friendly *For more details, please download the PDF and take a look.

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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

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Sword-type ultrasonic cutter FUM-1 model-2000

Sword-type ultrasonic cutter FUM-1 model-2000

Industrial ultrasonic cutter: Expansion of the application range of ultrasonic cutters with large blades and long blades.

Support for various cutting processes using ultrasonic cutters - Automation of manual processes - Improvement of cut surface quality - Reduction of deformation of the workpiece - Maintenance of processing dimensions for low-rigidity workpieces We propose the use of ultrasonic cutters to address these challenges.

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Table with ultrasonic agitation water tank

Table with ultrasonic agitation water tank

Cavitation effect caused by ultrasonic vibrations in liquid!

The cavitation effect assists in the surface finish of the mold cavity.

  • Ultrasonic Oscillator
  • Ultrasonic cutter

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