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Ultrasonic cutter Product List and Ranking from 30 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

Ultrasonic cutter Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 精電舎電子工業 本社、柏工場、営業所(仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡)、室蘭事務所 Tokyo//Industrial Machinery
  3. 兼松PWS Kanagawa//Industrial Machinery
  4. 4 null/null
  5. 5 テクノアルファ Tokyo//Electronic Components and Semiconductors

Ultrasonic cutter Product ranking

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Ultrasonic Cutter SONOPET JII Series 精電舎電子工業 本社、柏工場、営業所(仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡)、室蘭事務所
  2. High-precision flip chip bonder 'femto2'
  3. High-precision die bonder and flip chip bonder 'lambda2'
  4. 4 ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松PWS
  5. 5 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder

Ultrasonic cutter Product List

61~84 item / All 84 items

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High-performance material ultrasonic cutter "Manufactured by Adwells Corporation"

We have achieved high-quality cut surfaces without burrs, dust, cutting debris, or warping through our unique ultrasonic cutting technology, which significantly reduces cutting load.

A variety of high-performance materials are being developed to improve product performance in a wide range of applications, including electronics. Cutting technologies that maximize the properties of these materials are in demand. Adwell's ultrasonic cutter contributes to the development and manufacturing technology of electronic products and resin/rubber products.

  • UC1000SA.png
  • UC1000LS.JPG
  • Capacitor
  • Ultrasonic cutter

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Tabletop Ultrasonic Cutter 'BC-KW430C'

Smooth cutting operations with ultrasonic vibrations!

The 『BC-KW430C』 is a compact handheld tabletop ultrasonic cutter that allows you to easily cut straight lines and curves with a pen-like feel, without applying much force. By applying fine vibrations of 40,000 times per second to the tip of the blade, it smoothly cuts through various biological tissues and products. Additionally, the cut surface is clean and smooth, without damaging the material. 【Specifications】 ■ Frequency: 40kHz ■ Maximum Output: 30W ■ Input Power: AC100V 50/60Hz ■ Dimensions: 270(W) × 170(D) × 140(H) mm ■ Weight: Approximately 3kg *For more details, please download the PDF or contact us.

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Ultrasonic Cutter UC1000LS

Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.

The "UC1000LS" is an ultrasonic cutter that assists in the precision cutting of industrial products using ultrasonic technology. By applying high-frequency vibrations to the blade, it suppresses material deformation during cutting, allowing for high-quality cross-sections. Additionally, by controlling the position with a high-precision actuator, it achieves half-cutting of thin materials. 【Features】 ■ Assists in the precision cutting of industrial products with ultrasound ■ Cuts metal and plastic materials with high-quality cross-sections ■ Achieves high-precision half-cutting even for thin materials ■ Allows for shape cutting with shaped blades ■ Cuts out small parts while feeding the material stage *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Ultrasonic cutter

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Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment
  • Ultrasonic cutter

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Tabletop Semi-Automatic Ultrasonic Cutter 'USC Pro8'

For central kitchens! Small semi-automatic ultrasonic cutter for food processing.

The "USC Pro8" is a newly developed small, semi-automatic ultrasonic cutter designed for central kitchens operated by medium and small-sized businesses, which traditionally used large equipment running on mass production lines for food processing. We aim to provide solutions for customers who have found it difficult to implement such systems, focusing on efficiency and quality stabilization. We encourage you to adopt this product and share your feedback with us. 【Features】 ○ An automatic cutting device that cuts into the set shape and also cleans the blade edge. ○ Capable of making clean cuts. → Suitable for cutting hard frozen items as well as soft items that are prone to losing shape. ○ Allows for high-quality cutting operations to be safely repeated without requiring advanced skills. ○ The cutting speed can also be set. → Can be utilized for various items. For more details, please contact us or download the catalog.

  • Food Cutting Equipment
  • Ultrasonic cutter

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LED flip chip bonder

LED flip chip mounting device

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

  • Other mounting machines
  • Ultrasonic cutter

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Ultrasonic cleaning machines, application equipment, measuring instruments / Honda Electronics

Featuring a wide range of products including flow-type cleaning machines, ultrasonic cutters, and ultrasonic welders!

This catalog introduces the "ultrasonic cleaning machines, application devices, and measuring instruments" handled by Oki Sangyo. It features a wide range of products, including the flow-type cleaning machine "W-357-1MPG," the ultrasonic cutter "ZO-80," the ultrasonic welder "SONAC-200," and the ultrasonic level gauge "HD350 series." Please make use of this for selecting products. [Contents] ■ Ultrasonic cleaning equipment ■ Ultrasonic application devices ■ Ultrasonic measuring instruments ■ Ultrasonic vibration devices ■ Optional items ■ Company overview *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Other measurement, recording and measuring instruments
  • Ultrasonic Cleaner
  • Ultrasonic cutter

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ASMPT's ultra-high precision flip chip bonder 'NANO'

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

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  • Bonding Equipment
  • Ultrasonic cutter

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ASMPT manufactured flip chip bonder - Novaplus

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

  • Bonding Equipment
  • Ultrasonic cutter

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Hobby Ultrasonic Cutter ZO-80II(2)

Plastic cuts like butter! Convenient for reducing cutting work time!

The ultrasonic cutter is a tool that shortens work time by utilizing the blade, vibration, and frictional heat through the transmission of ultrasonic vibrations to the blade, file, and whetstone. The hobby ultrasonic cutter ZO-80 has been discontinued, and the successor model ZO-80II has been released with unchanged cutting performance. Features: - Equipped with the best cutting performance for hobby ultrasonic cutters, featuring Super High Mode (Super High Mode is not a function used continuously). - Power settings are available in three levels (Normal Mode, High Mode, Super High Mode). - By using the optional foot switch ZH801, a 10-minute timer can be turned off. - Handpiece parts can be purchased separately (ZH802/ZH803). - Automatic stop function (10 minutes in Normal Mode, 5 minutes in High Mode, 3 minutes in Super High Mode).

  • cutter
  • Power tools
  • Ultrasonic cutter

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Fuji Industrial Co., Ltd.

Ultrasonic cutter

This product applies ultrasonic vibrations to the cutter blade, reducing resistance during cutting. It is expected to improve the quality of the cut surface, reduce deformation of the workpiece, and suppress adhesion to the blade. Our ultrasonic cutter features include a long cutter blade suitable for thick workpieces, a disc-shaped cutter blade that is not limited to the conventional pulling cut, and high-load capability utilizing powerful ultrasonic technology.

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Flip chip bonder, semi-automatic flip chip bonder.

High-precision bonding machine with ±5μm accuracy

The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).

  • Steel
  • Ultrasonic cutter

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[Case Study] Film Gate Cut for Passenger Car Bumper (Material: PP)

Automation achieved with an ultrasonic cutter equipped with a copying mechanism!

The case we are introducing this time is an example of automating the film gate cutting for passenger car bumpers (material: PP). This project was received from a Tier 1 supplier of a major automobile manufacturer. Before we were approached, skilled workers were manually cutting the film gates. They were considering automation, but faced several issues, which led them to contact us. 【Conventional Issues】 - The workpiece dimensions are large, causing distortion when setting the workpiece in the fixture. - Standard robotic processing cannot follow the distortion, resulting in leftover or incomplete cuts of the film gate. Taking the above into account, we proposed the introduction of an "ultrasonic cutter with a following mechanism." 【Benefits of Implementation】 - Enables following the distortion of the workpiece, achieving automation. - The processing surface is smooth, eliminating the need for secondary processes. - The ultrasonic cutter operates at 35kHz, producing no processing noise. - Low electricity costs and energy-efficient. *For more details, please download the materials or contact us directly.

  • Other machine tools
  • Ultrasonic cutter

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[Case Study] Deburring of the outer circumference and finishing of the processing surface of a water storage tank (FRP material)

Automation achieved with a ultrasonic cutter and end mill equipped with a learning mechanism!

This time, we would like to introduce a project that automated the deburring of the outer circumference and the finishing of the processing surface of a water storage tank (made of FRP material) using an ultrasonic cutter and end mill. [Request from a certain housing equipment manufacturer] Until now, all operations were done manually, with burrs being cut with a cutter and the finishing of the processing surface done with a file. However, they wanted to automate these tasks, and approached us for assistance. In response to the customer's request, we proposed the introduction of an "ultrasonic cutter and end mill with a tracing mechanism." In the primary processing stage, the ultrasonic cutter cuts the burrs on the outer circumference, and in the secondary processing stage, the end mill finishes the outer processing surface, creating a two-step process. With the tracing processing, we were able to perform machining that follows the distortion of the workpiece, achieving automation. Additionally, the realization of continuous processing using a hybrid tool equipped with both the ultrasonic cutter and end mill allowed for a reduction in processing time. *What is a hybrid tool? A robotic hand that incorporates two types of processing tools into one, developed to reduce tool change time. *For more details, please download the materials or contact us.

  • Other machine tools
  • Ultrasonic cutter

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Disc-shaped ultrasonic cutter FUM-1 model-2000

Industrial Ultrasonic Cutter: Realization of 3D Processing with Disc Blades

Support for various cutting processes using ultrasonic cutters - Automation of manual processes - Improvement of cutting surface quality - Reduction of deformation of the workpiece - Maintenance of processing dimensions for low-rigidity workpieces We propose the use of ultrasonic cutters to address these challenges.

  • Other processing machines
  • Ultrasonic cutter

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[Firefighting Application Case] Ultrasonic Cutter for Forensic Investigation and Fire Investigation Training

[Demo units available for loan] Remarkable sharpness and outstanding durability! Introduction of case studies on the use of ultrasonic cutters for firefighting.

The commercial ultrasonic cutter 'SUW-30CD' that we handle can cut plastic materials from electrical appliances and other sources, which are considered causes of fires, as desired. It demonstrates its power in improving fire cause investigation capabilities. When an alternating voltage is applied to the piezoelectric ceramics incorporated in the built-in transducer, it utilizes the property of slight expansion and contraction. This vibration is further amplified by a horn (amplitude amplifier), providing ultrasonic vibrations of 40,000 times per second to the blade attached to the tip, enhancing the cutting effect. It has been confirmed that using this product makes it easy to remove melted resin residues and to separate fused parts. [Case Study] ■ Target Material: Plastic materials from electrical appliances, etc. ■ Equipment Used: Ultrasonic Cutter 'SUW-30CD' *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • cutter
  • Ultrasonic cutter

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