We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Ultrasonic cutter.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Ultrasonic cutter Product List and Ranking from 28 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Aug 19, 2026～Sep 15, 2026
This ranking is based on the number of page views on our site.

Ultrasonic cutter Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 19, 2026～Sep 15, 2026
This ranking is based on the number of page views on our site.

  1. テクノアルファ Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所 Tokyo//Industrial Machinery
  4. 4 スズキマリン 産業機器課 Shizuoka//Industrial Machinery
  5. 5 兼松ＰＷＳ Kanagawa//Industrial Machinery
Go to Company Ranking

Ultrasonic cutter Product ranking

Last Updated： Aggregation Period:Aug 19, 2026～Sep 15, 2026
This ranking is based on the number of page views on our site.

  1. Ultrasonic Cutter SONOPET JII Series 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所
  2. [Ultrasonic Cutter Application Example] Tried welding using the back of the blade. スズキマリン 産業機器課
  3. Aluminum wire bonder/ribbon bonder ASTERION テクノアルファ
  4. 4 High-precision die bonder / flip chip bonder FDB210 / 211 澁谷工業
  5. 5 High-precision die bonder/flip chip bonder 'sigma'

Ultrasonic cutter Product List

61～78 item / All 78 items

Displayed results
Ultrasonic Ribbon Bond RB0300SS

Ultrasonic Ribbon Bond RB0300SS

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tabletop Semi-Automatic Ultrasonic Cutter 'USC Pro8'

Tabletop Semi-Automatic Ultrasonic Cutter 'USC Pro8'

For central kitchens! Small semi-automatic ultrasonic cutter for food processing.

The "USC Pro8" is a newly developed small, semi-automatic ultrasonic cutter designed for central kitchens operated by medium and small-sized businesses, which traditionally used large equipment running on mass production lines for food processing. We aim to provide solutions for customers who have found it difficult to implement such systems, focusing on efficiency and quality stabilization. We encourage you to adopt this product and share your feedback with us. 【Features】 ○ An automatic cutting device that cuts into the set shape and also cleans the blade edge. ○ Capable of making clean cuts. → Suitable for cutting hard frozen items as well as soft items that are prone to losing shape. ○ Allows for high-quality cutting operations to be safely repeated without requiring advanced skills. ○ The cutting speed can also be set. → Can be utilized for various items. For more details, please contact us or download the catalog.

  • Food Cutting Equipment
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
LED flip chip bonder

LED flip chip bonder

LED flip chip mounting device

- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.

  • Other mounting machines
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
ASMPT's ultra-high precision flip chip bonder 'NANO'

ASMPT's ultra-high precision flip chip bonder 'NANO'

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

  • Bonding Equipment
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
ASMPT manufactured flip chip bonder - Novaplus

ASMPT manufactured flip chip bonder - Novaplus

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ

  • Bonding Equipment
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Hobby Ultrasonic Cutter ZO-80II(2)

Hobby Ultrasonic Cutter ZO-80II(2)

Plastic cuts like butter! Convenient for reducing cutting work time!

The ultrasonic cutter is a tool that shortens work time by utilizing the blade, vibration, and frictional heat through the transmission of ultrasonic vibrations to the blade, file, and whetstone. The hobby ultrasonic cutter ZO-80 has been discontinued, and the successor model ZO-80II has been released with unchanged cutting performance. Features: - Equipped with the best cutting performance for hobby ultrasonic cutters, featuring Super High Mode (Super High Mode is not a function used continuously). - Power settings are available in three levels (Normal Mode, High Mode, Super High Mode). - By using the optional foot switch ZH801, a 10-minute timer can be turned off. - Handpiece parts can be purchased separately (ZH802/ZH803). - Automatic stop function (10 minutes in Normal Mode, 5 minutes in High Mode, 3 minutes in Super High Mode).

  • cutter
  • Power tools
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Fuji Industrial Co., Ltd.

Fuji Industrial Co., Ltd.

Ultrasonic cutter

This product applies ultrasonic vibrations to the cutter blade, reducing resistance during cutting. It is expected to improve the quality of the cut surface, reduce deformation of the workpiece, and suppress adhesion to the blade. Our ultrasonic cutter features include a long cutter blade suitable for thick workpieces, a disc-shaped cutter blade that is not limited to the conventional pulling cut, and high-load capability utilizing powerful ultrasonic technology.

  • others
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flip chip bonder, semi-automatic flip chip bonder.

Flip chip bonder, semi-automatic flip chip bonder.

High-precision bonding machine with ±5μm accuracy

The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).

  • Steel
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Disc-shaped ultrasonic cutter FUM-1 model-2000

Disc-shaped ultrasonic cutter FUM-1 model-2000

Industrial Ultrasonic Cutter: Realization of 3D Processing with Disc Blades

Support for various cutting processes using ultrasonic cutters - Automation of manual processes - Improvement of cutting surface quality - Reduction of deformation of the workpiece - Maintenance of processing dimensions for low-rigidity workpieces We propose the use of ultrasonic cutters to address these challenges.

  • Other processing machines
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Firefighting Application Case] Ultrasonic Cutter for Forensic Investigation and Fire Investigation Training

[Firefighting Application Case] Ultrasonic Cutter for Forensic Investigation and Fire Investigation Training

[Demo units available for loan] Remarkable sharpness and outstanding durability! Introduction of case studies on the use of ultrasonic cutters for firefighting.

The commercial ultrasonic cutter 'SUW-30CD' that we handle can cut plastic materials from electrical appliances and other sources, which are considered causes of fires, as desired. It demonstrates its power in improving fire cause investigation capabilities. When an alternating voltage is applied to the piezoelectric ceramics incorporated in the built-in transducer, it utilizes the property of slight expansion and contraction. This vibration is further amplified by a horn (amplitude amplifier), providing ultrasonic vibrations of 40,000 times per second to the blade attached to the tip, enhancing the cutting effect. It has been confirmed that using this product makes it easy to remove melted resin residues and to separate fused parts. [Case Study] ■ Target Material: Plastic materials from electrical appliances, etc. ■ Equipment Used: Ultrasonic Cutter 'SUW-30CD' *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • cutter
  • Ultrasonic cutter

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Ultrasonic cutter

Related Categories of Ultrasonic cutter

IPROS Services
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.