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Ultrasonic cutter Product List and Ranking from 30 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Ultrasonic cutter Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アドウェルズ Fukuoka//Manufacturing and processing contract
  2. テクノアルファ Tokyo//Electronic Components and Semiconductors
  3. ファインテック日本 Tokyo//Industrial Electrical Equipment
  4. 4 兼松ＰＷＳ Kanagawa//Industrial Machinery
  5. 5 null/null
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Ultrasonic cutter Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. DMB bonding application using ultrasonic bonding アドウェルズ
  2. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  3. ASMPT's ultra-high precision flip chip bonder 'NANO' 兼松ＰＷＳ
  4. 4 ±0.8um positional accuracy fluxless compatible thermal compression flip chip bonder
  5. 5 Aluminum wire bonder/ribbon bonder ASTERION テクノアルファ

Ultrasonic cutter Product List

31～45 item / All 86 items

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

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Flip Chip Bonder "FB2000SS"

Flip Chip Bonder "FB2000SS"

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

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Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>

Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>

Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.

The "UC1000SA" is a standalone ultrasonic cutter that can cut multilayer materials, such as all-solid batteries with a multilayer structure, without dragging. Thanks to the various sensor information built into the device, the process operation can be understood in detail, making it effective for process startup and mass production management. Additionally, by applying high-frequency vibrations from ultrasonic waves to the blade, it cuts while suppressing material deformation, resulting in high-quality cross-sections without burrs or warping. 【Features】 ■ Cuts metal foils with high-quality cross-sections ■ Cuts multilayer materials without dragging ■ Easy integration into automated systems ■ Comprehensive process monitoring capabilities *For more details, please download the PDF or feel free to contact us.

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Flexible substrate ultrasonic bonding application

Flexible substrate ultrasonic bonding application

There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!

We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.

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DMB bonding application using ultrasonic bonding

DMB bonding application using ultrasonic bonding

Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.

We would like to introduce our technology, "DMB Joining Application using Ultrasonic Welding." With Adwells' ultrasonic welding devices "UB2000/3000/5000LS," we achieve the joining of DMB sheets made from copper (Cu) and aluminum (Al) for power devices and areas requiring low thermal conductivity. The fine protrusions on the DMB sheets serve as the joining points, making it easier for materials to bond together and allowing for adaptation to various applications. 【Features】 ■ Can join materials that can only withstand low loads and low power ■ Does not scratch the surface of materials ■ Can join materials with a large surface area ■ Can join thicker materials ■ Can join devices that are molded *For more details, please download the PDF or feel free to contact us.

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Ultrasonic Tube Sealer "UTS-50S"

Ultrasonic Tube Sealer "UTS-50S"

World's first! Desktop ultrasonic sealing machine

The "UTS-50S" is a desktop ultrasonic tube sealer characterized by its compact body and high production capacity. - It is specialized for small-lot production of various types, allowing for reduced initial investment. - Being a desktop model, it takes up little space. - Back filling reduces the need for capping processes and personnel. - The cavitation effect ensures no defects. - It features a skill-less design that can be mastered in just three minutes, even by beginners. - Tool-free setup changes are easy. - The energy-efficient design keeps electricity costs low. - Only one holder is needed for parts, incurring no extra running costs. - In-house prototyping accelerates product development. [Features] ■ High production capacity ■ Space-saving, suitable for cell production ■ Compatible with tube lengths from 70 to 220 mm ■ Optional marking function can be added *For more details, please refer to the PDF document or feel free to contact us.

  • Sealing
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High-precision die bonder/flip chip bonder 'sigma'

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

  • Bonding Equipment

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High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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High-precision full-auto flip chip bonder: femto2

High-precision full-auto flip chip bonder: femto2

The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.

The model name femto2 of the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.5μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely isolates itself from external influences, achieving a stable assembly process with top-class yield. *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment

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Full Auto Flip Chip Bonder: femto blu

Full Auto Flip Chip Bonder: femto blu

The FINEPLACER femto blu is a new model of a fully automatic flip chip bonder/die bonder that balances productivity and precision.

This is a die bonder device that supports various bonding processes in prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic parts. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers safety for operators regarding the use of process gases and UV irradiation. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip compatible • Cost-effective equipment configuration • Supports various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

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ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.

The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.

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Small-scale production and development die bonder / flip chip bonder DB258

Small-scale production and development die bonder / flip chip bonder DB258

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.

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High-precision die bonder / flip chip bonder FDB210 / 211

High-precision die bonder / flip chip bonder FDB210 / 211

It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.

  • Other semiconductor manufacturing equipment

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Ultrasonic Cutter "SUW-30 Series"

Ultrasonic Cutter "SUW-30 Series"

Supports various cutting scenes! Easy and simple cutting.

The "SUW-30 Series" is an ultrasonic cutter that allows for easy, light, and smooth cutting of targeted lines beautifully. We offer four products: the "SUW-30CD," which enables dynamic cutting while standing; the "SUW-30CT," suitable for precise and detailed tabletop work using a foot switch; the "SUW-30CTL," which can accommodate a longer blade; and the "SUW-30CMH," designed to be mounted on dedicated machines or robots to enhance labor-saving efficiency. Tasks that typically take a long time with a standard utility knife can be completed easily, lightly, and quickly. 【Product Lineup】 ■ SUW-30CD: Convenient handheld switch type ■ SUW-30CMH: Equipped with external input terminal and cooling air nipple ■ SUW-30CT: Designed for tabletop work ■ SUW-30CTL: Capable of mounting a blade with a total length of 27mm (effective length 22mm) *For more details, please refer to the related links or feel free to contact us.

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[Ultrasonic Cutter Application Example] Tried welding using the back of the blade.

[Ultrasonic Cutter Application Example] Tried welding using the back of the blade.

[Demo units available] Introducing application examples of the compact ultrasonic welding machine series.

Are you under the impression that ultrasonic cutters are only used for cutting materials? Both ultrasonic cutters and ultrasonic welding machines operate on the same principle, amplifying the vibrations of the transducer through a horn to process the tip. In this instance, we will introduce a method of using the Suzuki ultrasonic cutter to cut materials and then directly use the cutter to weld them in a linear fashion. By tilting the cutter blade horizontally and using it on a surface, it can also be used for adding resin, and using the back of the blade allows for continuous welding close to the blade width. 【Application Examples】 ■ Target Material: Non-woven fabric: Thickness 0.6mm (0.15mm x 4 sheets) ■ Equipment Used: Ultrasonic Cutter SUW30CD, Replacement Blade H4 ■ Content: Continuous welding using the back part of the cutter blade 【Examples of Cutter Adoption in 2019】 - Model and figure production, model parts processing - Adhesive removal - Acrylic pipe cutting - Cutting of vulcanized rubber rolls - Cutting of candles - Fire investigation - Cutting and welding of nylon ropes - Cutting of soft leather for clothing - Cutting of canvas and tarpaulin - Destructive testing of blow-molded products *Please see the list of examples at the URL below.

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