MH-1000 Multi-Wire Saw
● Down-cutting method using diamond wire ● No slurry required due to fixed abrasives ● Compatible with wafer processing of small diameters up to 4 inches
- Compatible with wafer processing of small diameters up to 4 inches - Down-cut method using high-performance electroplated diamond wire - No slurry required due to fixed abrasives - Capable of processing various materials by changing wire speed - Square cutting is also possible - High-precision processing of all hard and brittle materials is possible
- Company:マック産業機器 テクノロジーセンター
- Price:Other