Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
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Central Semiconductor Schottky Diode CMSSH-3SE
The following four products from Centra Semiconductor are optimal devices for the "LiDAR" in autonomous driving systems and are adopted by overseas LiDAR manufacturers.
It is possible to observe cross-sections while observing FIB processing in real time.
A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
Cryo-processing cooling SEM: Scanning Electron Microscopy method
To observe the structure of liquid samples, it is necessary to conduct a series of analyses while maintaining the original structure of the sample. In cryo-SEM, the sample can be observed by rapidly freezing it to create a cross-section. Furthermore, by combining this with cross-section fabrication techniques using FIB processing, it is possible to obtain more detailed information about the internal structure.
A new proposal that is the first in the industry! A Raman detector has been added to the FE-SEM!
Traditionally, elemental analysis using an EDS detector during FE-SEM observation was common. Our company has transformed the conventional EDS detector into a windowless EDS, allowing for high-sensitivity analysis from Li to U. Additionally, with the inclusion of a Raman detector, it has become possible to obtain information on different compound forms from organic to inorganic.
SiC semiconductor evaluation device using photoluminescence (PL) imaging method
"SemiScope" is a PL imaging device that can measure photoluminescence (PL) images with a resolution of less than 1μm. By using a tiling function that allows imaging measurements while moving the sample, it is possible to obtain PL images of the entire 6-inch wafer with a resolution of approximately 3.3 billion pixels. It visualizes crystal defects in SiC wafers. Non-contact and non-destructive testing can be performed quickly using the PL imaging method. 【Features】 - SiC semiconductor evaluation device - Visualization of crystal defects in SiC wafers - Non-contact, non-destructive testing - Short measurement time possible due to PL imaging method For more details, please contact us or download the catalog.
![[Example of TOF-SIMS] Analysis of Li](https://image.mono.ipros.com/public/product/image/e37/2000653179/IPROS00080532195674667298.png?w=280&h=280)
It is possible to detect with high sensitivity! We will introduce a case comparing the analysis of Li using TOF-SIMS and SEM-EDX.
We will introduce a case comparing the analysis of lithium (Li) using TOF-SIMS and SEM-EDX. While SEM-EDX is used for the analysis of contamination and foreign substances, it is difficult to detect Li with general EDX, excluding windowless EDX. On the other hand, TOF-SIMS can detect Li with high sensitivity. Please feel free to contact us if you need assistance. 【Overview】 ■ Analysis of stains on copper plates ■ SEM-EDX analysis → Difficult to detect Li ■ TOF-SIMS analysis → Li detectable *For more details, please refer to the PDF document or feel free to contact us.
Investigation of the joint condition and joining methods of crimp terminals, as well as the types of materials! Introduction to cross-sectional observation and elemental analysis using SEM/EDX.
I would like to introduce the topic of "Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX." We conducted cross-section preparation of the joint area of the copper crimp terminal fixture for resistance measurement, applied chemical etching to the prepared cross-section, and observed the metal structure before and after etching. As a result, we infer that the detected elements are P (phosphorus), Ag (silver), and Cu (copper), indicating that it is a silver-containing phosphorus copper solder material. *For more details, please refer to the PDF document or feel free to contact us.*
EBSD: Electron Backscatter Diffraction
Measurements can be performed in bulk state without the need for thinning processes like TEM (NBD: Nano Beam Diffraction). It has the high spatial resolution characteristic of SEM and relatively high strain sensitivity. Additionally, there is a possibility of detecting local lattice strain as tensor data.
![[Analysis Case] Evaluation of Carrier Distribution in Near-Infrared VCSEL Using SMM](https://image.mono.ipros.com/public/product/image/666/2000247105/IPROS7426036998969031434.jpg?w=280&h=280)
We can consistently perform everything from disassembly and processing of the implemented product to measurement of the diffusion layer.
We disassembled a near-infrared VCSEL (vertical-cavity surface-emitting laser) implementation to extract a tiny chip, and after cross-section processing, we conducted SMM measurements. A high-resistance current confinement layer was observed surrounding the aperture of the VCSEL. Additionally, near the active layer, films of different materials were stacked, and this composition was measured as a contrast. Contrast was also confirmed within layers of the same composition, which is believed to reflect differences in carrier concentration and band bending.
A GPC/SEC liquid chromatography (LC) system with a multi-detector capable of measuring low molecular weights in the hundreds.
The "1260 Infinity II Multi-Detector GPC/SEC System" allows for the flexible combination of refractive index, light scattering, and viscosity detectors. It provides accurate absolute molecular weights and molecular sizes, making it suitable for the analysis of a wide range of polymers regardless of molecular weight range or solvent. Each detector is individually temperature-controlled, yielding highly precise and reproducible results. You can view all application notes and technical summaries for the 1260 Infinity and 1260 Infinity II Multi-Detector GPC/SEC Systems in the Application Finder. 【Features】 ■ Accurate molecular weight ■ Accurate size and structure ■ Minimal class diffusion ■ Efficient and reproducible ■ Fully upgradeable *For more details, please refer to the related links or feel free to contact us.
![[Analysis Case] Numerical Evaluation of Active Material Volume by Three-Dimensional SEM](https://image.mono.ipros.com/public/product/image/e67/2000245870/IPROS71538505590252360233.jpeg?w=280&h=280)
It is possible to calculate the volume of each substance from Slice&View data.
Using data from Slice&View (a method that repeatedly performs FIB processing and SEM observation to obtain dozens of continuous images), it is possible to calculate the volume of particles and other micron-sized objects. This allows us to obtain information such as the presence ratio and average volume of each substance within a certain volume. In this case study, we will introduce an example where the volume of active material was calculated from the Slice&View analysis results of a lithium-ion secondary battery cathode, and the presence ratio was determined.
Data communication VCSEL chip
Our high-speed 850 nm multimode VCSEL chip is designed to meet the stringent specifications of high-speed data communication. Features • 850 µm multimode • Narrow spectral width • High reliability • Single chip • Compatible with 4,12 arrays • RoHS compliant
Single-mode VCSEL
Our single-mode VCSEL is designed to meet the stringent specifications of a wide range of optical sensing applications. Features • Single-mode • Polarization-stable emission • Gaussian beam profile • High reliability • Low power consumption • Back cathode and top anode configuration • RoHS and REACH compliant
You can select 2 to 3 types of raw materials and products.
The "VSE3 type" is a separator designed to process large quantities of powdered and granular materials. It can sort raw materials and products into 2 to 3 different types. The structure consists of a sieve frame, frame, drive unit, and screen (mesh frame). 【Features】 ■ Capable of separating impurities and large particles mixed in grain raw materials and products, as well as removing powder and clumps. ■ High processing capacity with low power consumption. ■ Drive motor mounted on the sieve frame. ■ The distance between the motor shaft and the main shaft is constant, preventing slippage and disconnection of the V-belt. *For more details, please refer to the PDF document or feel free to contact us.
![[Data DL available・DSC] Understanding the gelatinization of starch in rice, noodles, etc.](https://image.mono.ipros.com/public/product/image/813/2000766278/IPROS98637519284911439701.png?w=280&h=280)
In DSC, you can understand the gelatinization and aging of starch, which are important factors in food processing. Please fully experience this technology that can also be applied to other foods.
In starch processed foods, it is very important to understand the gelatinization (α phase) and the retrogradation (β phase) phenomena. Our company has the technology to grasp these phenomena using DSC (Differential Scanning Calorimetry). In this case, we introduce an example of this technology: "Understanding the gelatinization of starch in rice and noodles." Additionally, this technology can also measure the degree of retrogradation. For more details, please refer to the PDF materials. In addition to DSC, our company also specializes in various thermal analyses such as TG-DTA and TMA. https://www.seiko-sfc.co.jp/service/thermal.html ●DSC (Differential Scanning Calorimetry): It can be used for analyzing sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG-DTA (Thermogravimetric and Differential Thermal Analysis): It can be used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating heat resistance. ●TMA (Thermomechanical Analysis): It can be used for measuring sample expansion rate, glass transition, softening point, etc. There are other examples available, so please take a look. https://www.seiko-sfc.co.jp/case/index.html
![[FIB] Focused Ion Beam Processing](https://image.mono.ipros.com/public/product/image/b01/387108030/IPROS7900017760392336423.jpg?w=280&h=280)
FIB refers to a focused ion beam with a diameter ranging from a few nanometers to several hundred nanometers, which can be used to scan the sample surface to etch or deposit material in specific areas.
FIB refers to a focused ion beam with diameters ranging from several nanometers to several hundred nanometers, which can be used to etch specific areas (sputtering) or deposit materials such as carbon (C), tungsten (W), and platinum (Pt) onto specific regions by scanning the sample surface. Additionally, the shape of the processed sample can be recognized through SIM images, which detect secondary electrons generated by irradiating the sample with the ion beam. - Arbitrary shape processing through etching in micro-regions (several nanometers to several tens of micrometers) is possible (typical processing size: around 20 μm) - Sample preparation for SEM, SEM-STEM, and TEM imaging (cross-sections of specific areas can be produced) - Fine pattern deposition and thin film formation (C, W, Pt deposition) are possible in the range of several micrometers to several tens of micrometers - High-resolution SIM (Scanning Ion Microscope) imaging is possible (acceleration voltage 30 kV: 4 nm) - Observation of metal crystal grains (Al, Cu, etc.) is possible with SIM images.
The deformation and fracture of plastic washers, gaskets, etc., due to localized compressive stress can be estimated using a TMA and stress-strain measurement device.
●Sample: Estimation of deformation and fracture due to localized compressive stress on plastic washers, gaskets, etc. ●Method: Compression creep measurement and stress-strain measurement using TMA (Thermomechanical Analysis) and stress-strain measurement equipment. ●Results: The deformation of the sample due to compression was understood from the creep curve and stress-strain curve. Please take a moment to read the PDF materials. In addition to TMA, our company also specializes in various thermal analyses such as DSC and TG/DTA. ●DSC: Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG/DTA: Can be used for analysis of moisture content, ash content, decomposition, oxidation, and evaluation of heat resistance. ●TMA: Can be used for measuring sample expansion rate, glass transition, softening point, etc. We would be happy to discuss this case and thermal analysis with you at any time. https://www.seiko-sfc.co.jp/service/thermal.html Case introduction https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. Please request them through the inquiry button, and we will send them to you.
We will take clear photos and report back! Using analytical equipment, we will investigate and analyze the identity of the foreign substance.
Are you troubled by issues of appearance defects and functional defects caused by foreign substances? If we can identify the nature of the foreign substance, it will provide an important clue to uncovering the pathway of its contamination. Our company will investigate and analyze the nature of the foreign substance using analytical equipment. We will take clear photographs according to the size of the foreign substance and report our findings. We will conduct detailed observations of the size, color tone, and adhesion state of the appearance, and if it is an organic substance, we will analyze it using FT-IR; if it is an inorganic substance, we will use SEM/EDX. Please feel free to consult us when you need our services. 【Features】 ■ Clear photographs will be taken and reported according to the size of the foreign substance ■ Detailed observations of the size, color tone, and adhesion state of the appearance ■ Analysis using FT-IR for organic substances and SEM/EDX for inorganic substances *For more details, please refer to the PDF document or feel free to contact us.
Precise measurement of micro-areas on the sample surface! High-speed analysis using a galvanometer mirror.
The "LASER BLENDER" is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, allowing for "local," "imaging," and "depth" analysis. It not only simplifies the preprocessing for ICP analysis but also expands the range of analytical methods, including direct solid analysis, high-speed analysis, and local analysis. 【Features】 ■ Reduces thermal effects and refines generated particles for high precision using FHG f's laser ■ High-speed ablation with a galvanometer scanner ■ Enables high spatial resolution measurements with a minimum focal diameter of 1μmΦ ■ Equipped with a goniometer to correct sample tilt ■ Arbitrary setting of ablation shapes using a tablet device *For more details, please refer to the related links or feel free to contact us. Exhibition Participation JASIS 2023 Advanced Science and Analytical Systems & Solutions Exhibition Date: September 6-8, 2023, 10:00 AM - 5:00 PM Venue: Makuhari Messe International Exhibition Hall, 2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture 261-0023 Booth: 4B-206
Active in a highly competitive market for over 40 years! We provide customized solutions.
Our affiliated company, Diotec Semiconductor AG, specializes in semiconductor diodes and rectifiers. We provide customized solutions tailored to the configuration of semiconductor chips, packages, and leads. We have been active in this highly competitive market for over 40 years. Please feel free to contact us when needed. 【Products Offered】 ■ Semiconductor Diodes ■ Rectifiers * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Generally, it is possible to observe transition phenomena such as melting, glass transition, crystallization, and thermosetting of materials even in difficult low-temperature regions.
Depending on the material, glass transition, cryocrystallization, and melting points may exist in the low-temperature range. Our company has the technology to measure these characteristics using DSC (Differential Scanning Calorimetry). We hope you can utilize this technology to understand material properties. In this case, we introduce an example of this technology: "DSC Measurement of Silicone Rubber (Low-Temperature Measurement)." Please refer to the PDF document for details. In addition to DSC, our company also specializes in various thermal analyses such as TG-DTA and TMA. https://www.seiko-sfc.co.jp/service/thermal.html ●DSC (Differential Scanning Calorimetry): Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG-DTA (Thermogravimetric and Differential Thermal Analysis): Can be used for analysis of sample moisture content, ash content, decomposition, oxidation, and thermal resistance evaluation. ●TMA (Thermomechanical Analysis): Can be used for measuring sample expansion rate, glass transition, softening point, etc. Please take a look at many other examples below: https://www.seiko-sfc.co.jp/case/index.html
The results of DMA measurements can predict the long-term deformation (creep measurement) of materials. This can be utilized in evaluations that typically take a long time.
At our company, by applying the WLF rule (the time-temperature superposition principle) to the results of DMA measurements, we can estimate properties such as elasticity in frequency regions that have not actually been measured (creating master curves). Would you like to utilize this technology to understand material properties? In this case, we introduce an example of this technology: "Prediction of long-term deformation of rubber (creep test)". Please refer to the PDF document for details. In addition to DSC, our company also specializes in various thermal analyses such as TG-DTA and TMA. https://www.seiko-sfc.co.jp/service/thermal.html ●DSC (Differential Scanning Calorimetry): Used for analyzing melting, glass transition, thermal history, crystallization, curing, Curie point, etc., and for measuring specific heat. ●TG-DTA (Thermogravimetric and Differential Thermal Analysis): Used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating heat resistance. ●TMA (Thermomechanical Analysis): Used for measuring expansion rate, glass transition, softening point, etc. Please see below for other examples as well. https://www.seiko-sfc.co.jp/case/index.html
Nano to angstrom resolution! Observation of fine morphology and composition analysis at the atomic level.
TEM/STEM is an analytical method that uses an electron beam to image samples. The spatial resolution of TEM/STEM is approximately 1 to 2 Å. High-energy electrons (80 to 200 keV) can penetrate electron-transparent samples (up to about 100 nm thick). While the spatial resolution of TEM/STEM is superior to that of SEM, it often requires complex sample preparation. Additionally, in recent years, the introduction of AC-STEM (STEM with spherical aberration-corrected lenses) has enabled higher resolution analysis compared to conventional STEM. EAG Laboratories owns more than 20 TEM/STEM instruments and over 30 FIB-SEM systems for sample preparation. We also have multiple EDS/EELS systems for elemental analysis. With a sufficient number of facilities for analysis, we can always respond to TEM/STEM analysis requests with short turnaround times (standard delivery: 6 to 8 business days / expedited delivery: upon inquiry).
Various measurements can be efficiently conducted! Easily and affordably replaceable sensors.
The "Setline DSC/DSC+" is a differential scanning calorimeter manufactured by Setaram Instrumentation. It employs a simple structured plate-type DSC sensor. Due to its rod-type sensor structure, which can be replaced by the user, it significantly reduces repair time and costs in case of sensor failure. 【Features】 ■ Utilizes a simple structured plate-type DSC sensor ■ Significantly reduces repair time and costs in case of sensor failure ■ Rapid heating and cooling rates ■ Efficiently conducts various measurements *For more details, please refer to the PDF document or feel free to contact us.
![[SIM] Scanning Ion Microscopy Method](https://image.mono.ipros.com/public/product/image/d09/387108028/IPROS2308410282720757772.jpg?w=280&h=280)
Observation of SIM images is possible with high resolution (accelerating voltage 30kV: 4nm).
- SIM imaging observation is possible with high resolution (accelerating voltage 30kV: 4nm). - Compared to SEM images, SIM images provide information about the extreme surface layer. - Observation of metal crystal grains is possible (e.g., Al, Cu). - The resolution is inferior to SEM images (SIM: 4nm, SEM: 0.5nm). ■Features of MST-owned equipment - Compatible with JEIDA standard wafers with a maximum sample size of 300mm in diameter. - Continuous cross-sectional SIM imaging acquisition is possible in combination with FIB (Focused Ion Beam) processing (Slice & View).
Visualizing the invisible air environment. Sophisticated German design.
Invisible air environment. Visualizing the values of CO2 (carbon dioxide), PM2.5, VOCs (volatile organic compounds), temperature, humidity, and other factors in living environments such as homes, offices, tutoring centers, and accommodations, and adjusting them for a comfortable environment is a very important aspect of daily life. The Laserliner air monitor series is designed to visualize the values of air quality, enabling appropriate measures such as ventilation, the use of air purifiers, and adjustments to heating and cooling.
Visualizing the invisible air environment. Sophisticated German design.
Invisible air environment. Visualizing the values of CO2 (carbon dioxide), PM2.5, VOCs (volatile organic compounds), temperature, humidity, and other factors in living environments such as homes, offices, schools, and accommodations, and adjusting them for a comfortable environment is a very important aspect of daily life. The Laserliner air monitor series is designed to visualize the values of air quality, aiming to facilitate appropriate measures such as ventilation, the use of air purifiers, and adjustments to heating and cooling.
Measurement of the relative molecular weight and molecular weight distribution of polymers and oligomers.
This method utilizes the pores of a filler used as a stationary phase to separate sample molecules in order of increasing molecular size, and is also known as size exclusion chromatography (SEC). Larger molecules penetrate the pores of the gel less and move through the column and elute faster than smaller molecules. In this way, by separating and eluting based on molecular size, and using the differences in refractive index (RI) between the solvent and the sample solution or the absorption of functional groups (UV) to detect concentration, a distribution of molecules can be obtained.
![[Handbook Presentation] Analysis and Evaluation](https://image.mono.ipros.com/public/product/image/f82/2000772236/IPROS70157480137697418570.png?w=280&h=280)
In "Evaluation and Analysis of Li-ion Batteries," a series of evaluations including prototyping, testing, battery disassembly, and non-atmospheric exposure analysis is possible.
Our company supports trouble resolution with advanced technology and cutting-edge equipment cultivated in the electronics field. This document includes "areas of support" such as "MSEC's analysis and evaluation support areas," "analysis case studies" like "comprehensive analysis of Li-ion batteries," and "introduction of analytical equipment." Please feel free to download and take a look. 【Contents (partial)】 <Areas of Support> ■ MSEC's analysis and evaluation support areas ■ Comprehensive analysis system for power devices and modules <Analysis Case Studies> ■ Front-end analysis ■ Power device package defect analysis *For more details, please refer to the PDF document or feel free to contact us.
