Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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We support a wide range of measurements from resin samples to ceramics.
We support a wide range of measurements from resin samples to ceramics, with a measurement range of -150°C to 1700°C. A variety of sample holders are available, and measurements can be conducted under a high-purity inert atmosphere due to the vacuum-sealed structure.
Central Semiconductor Schottky Diode CMSSH-3SE
The following four products from Centra Semiconductor are optimal devices for the "LiDAR" in autonomous driving systems and are adopted by overseas LiDAR manufacturers.
It is possible to observe cross-sections while observing FIB processing in real time.
A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
Cryo-processing cooling SEM: Scanning Electron Microscopy method
To observe the structure of liquid samples, it is necessary to conduct a series of analyses while maintaining the original structure of the sample. In cryo-SEM, the sample can be observed by rapidly freezing it to create a cross-section. Furthermore, by combining this with cross-section fabrication techniques using FIB processing, it is possible to obtain more detailed information about the internal structure.
A new proposal that is the first in the industry! A Raman detector has been added to the FE-SEM!
Traditionally, elemental analysis using an EDS detector during FE-SEM observation was common. Our company has transformed the conventional EDS detector into a windowless EDS, allowing for high-sensitivity analysis from Li to U. Additionally, with the inclusion of a Raman detector, it has become possible to obtain information on different compound forms from organic to inorganic.
SiC semiconductor evaluation device using photoluminescence (PL) imaging method
"SemiScope" is a PL imaging device that can measure photoluminescence (PL) images with a resolution of less than 1μm. By using a tiling function that allows imaging measurements while moving the sample, it is possible to obtain PL images of the entire 6-inch wafer with a resolution of approximately 3.3 billion pixels. It visualizes crystal defects in SiC wafers. Non-contact and non-destructive testing can be performed quickly using the PL imaging method. 【Features】 - SiC semiconductor evaluation device - Visualization of crystal defects in SiC wafers - Non-contact, non-destructive testing - Short measurement time possible due to PL imaging method For more details, please contact us or download the catalog.
![[Example of TOF-SIMS] Analysis of Li](https://image.mono.ipros.com/public/product/image/e37/2000653179/IPROS00080532195674667298.png?w=280&h=280)
It is possible to detect with high sensitivity! We will introduce a case comparing the analysis of Li using TOF-SIMS and SEM-EDX.
We will introduce a case comparing the analysis of lithium (Li) using TOF-SIMS and SEM-EDX. While SEM-EDX is used for the analysis of contamination and foreign substances, it is difficult to detect Li with general EDX, excluding windowless EDX. On the other hand, TOF-SIMS can detect Li with high sensitivity. Please feel free to contact us if you need assistance. 【Overview】 ■ Analysis of stains on copper plates ■ SEM-EDX analysis → Difficult to detect Li ■ TOF-SIMS analysis → Li detectable *For more details, please refer to the PDF document or feel free to contact us.
Investigation of the joint condition and joining methods of crimp terminals, as well as the types of materials! Introduction to cross-sectional observation and elemental analysis using SEM/EDX.
I would like to introduce the topic of "Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX." We conducted cross-section preparation of the joint area of the copper crimp terminal fixture for resistance measurement, applied chemical etching to the prepared cross-section, and observed the metal structure before and after etching. As a result, we infer that the detected elements are P (phosphorus), Ag (silver), and Cu (copper), indicating that it is a silver-containing phosphorus copper solder material. *For more details, please refer to the PDF document or feel free to contact us.*
EBSD: Electron Backscatter Diffraction
Measurements can be performed in bulk state without the need for thinning processes like TEM (NBD: Nano Beam Diffraction). It has the high spatial resolution characteristic of SEM and relatively high strain sensitivity. Additionally, there is a possibility of detecting local lattice strain as tensor data.
![[Analysis Case] Evaluation of Carrier Distribution in Near-Infrared VCSEL Using SMM](https://image.mono.ipros.com/public/product/image/666/2000247105/IPROS7426036998969031434.jpg?w=280&h=280)
We can consistently perform everything from disassembly and processing of the implemented product to measurement of the diffusion layer.
We disassembled a near-infrared VCSEL (vertical-cavity surface-emitting laser) implementation to extract a tiny chip, and after cross-section processing, we conducted SMM measurements. A high-resistance current confinement layer was observed surrounding the aperture of the VCSEL. Additionally, near the active layer, films of different materials were stacked, and this composition was measured as a contrast. Contrast was also confirmed within layers of the same composition, which is believed to reflect differences in carrier concentration and band bending.
A GPC/SEC liquid chromatography (LC) system with a multi-detector capable of measuring low molecular weights in the hundreds.
The "1260 Infinity II Multi-Detector GPC/SEC System" allows for the flexible combination of refractive index, light scattering, and viscosity detectors. It provides accurate absolute molecular weights and molecular sizes, making it suitable for the analysis of a wide range of polymers regardless of molecular weight range or solvent. Each detector is individually temperature-controlled, yielding highly precise and reproducible results. You can view all application notes and technical summaries for the 1260 Infinity and 1260 Infinity II Multi-Detector GPC/SEC Systems in the Application Finder. 【Features】 ■ Accurate molecular weight ■ Accurate size and structure ■ Minimal class diffusion ■ Efficient and reproducible ■ Fully upgradeable *For more details, please refer to the related links or feel free to contact us.
![[Analysis Case] Numerical Evaluation of Active Material Volume by Three-Dimensional SEM](https://image.mono.ipros.com/public/product/image/e67/2000245870/IPROS71538505590252360233.jpeg?w=280&h=280)
It is possible to calculate the volume of each substance from Slice&View data.
Using data from Slice&View (a method that repeatedly performs FIB processing and SEM observation to obtain dozens of continuous images), it is possible to calculate the volume of particles and other micron-sized objects. This allows us to obtain information such as the presence ratio and average volume of each substance within a certain volume. In this case study, we will introduce an example where the volume of active material was calculated from the Slice&View analysis results of a lithium-ion secondary battery cathode, and the presence ratio was determined.
Data communication VCSEL chip
Our high-speed 850 nm multimode VCSEL chip is designed to meet the stringent specifications of high-speed data communication. Features • 850 µm multimode • Narrow spectral width • High reliability • Single chip • Compatible with 4,12 arrays • RoHS compliant
Single-mode VCSEL
Our single-mode VCSEL is designed to meet the stringent specifications of a wide range of optical sensing applications. Features • Single-mode • Polarization-stable emission • Gaussian beam profile • High reliability • Low power consumption • Back cathode and top anode configuration • RoHS and REACH compliant
You can select 2 to 3 types of raw materials and products.
The "VSE3 type" is a separator designed to process large quantities of powdered and granular materials. It can sort raw materials and products into 2 to 3 different types. The structure consists of a sieve frame, frame, drive unit, and screen (mesh frame). 【Features】 ■ Capable of separating impurities and large particles mixed in grain raw materials and products, as well as removing powder and clumps. ■ High processing capacity with low power consumption. ■ Drive motor mounted on the sieve frame. ■ The distance between the motor shaft and the main shaft is constant, preventing slippage and disconnection of the V-belt. *For more details, please refer to the PDF document or feel free to contact us.
