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substrate Product List and Ranking from 21 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 鋼鈑工業 Tokyo//Industrial Machinery
  3. スクリーンプロセス Kanagawa//others
  4. 4 アイン 本社工場 Nagano//Electronic Components and Semiconductors
  5. 4 INSPEC Inc. Akita//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  2. Substrate "MD" 鋼鈑工業
  3. Substrate "Impedance Control" スクリーンプロセス
  4. 4 Substrate "Copper Base Wiring Board with Posts" アイン 本社工場
  5. 5 Substrate AOI "SX Series" INSPEC Inc.

substrate Product List

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Substrate AOI "SX Series"

Substrate AOI "SX Series"

From high-resolution pattern inspection at L/S = 5/5 µm to laser via inspection, we provide the optimal solution for all your visual inspection needs.

We offer a comprehensive lineup of AOI systems covering a wide range of substrates—from high-end models supporting minimum line/space widths of 5/5 µm to mid-range models. Our systems deliver ultra-high-precision inspection for everything from circuit patterns to laser vias. In addition to standard circuit and laser via inspection, our solutions are also capable of measuring and outputting line/space widths as well as top/bottom diameters of vias. 【Rich Options】 - Verify inspection results directly on a PC using defect images saved by the inspection system—no dedicated verification machine required. - Significantly reduce verification workload with AI-based automatic defect classification. - Analyze defect trends by type and location using panel-level data mapping, enabling effective feedback to upstream processes. - Offline teaching system allows recipe creation without occupying the inspection equipment. - Optional server system available for storing inspection results.

  • Circuit Board Inspection Equipment
  • substrate

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[Service] System Contract Development

[Service] System Contract Development

Support from small lots to mass production! One-stop support from specification consideration to design, prototype evaluation, and mass production.

We collaborate with our partner, Offrom, to provide one-stop support from specification review to design, prototype evaluation, and mass production. We can accommodate both small lots and large-scale production. We offer services in "circuit board development," "enclosure manufacturing," "software development," and "FPGA development." Please feel free to consult us regarding EOL support and design changes for existing products. 【Service Details (Excerpt)】 ■ Circuit Board Development - High-quality circuit board design - Heat management and noise reduction - Stabilization of power supply for high-speed operation - High-layer and thin circuit boards - Support for various video interfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded system design service
  • Other contract services
  • Circuit board design and manufacturing
  • substrate

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Introduction to Circuit Board Manufacturing

Introduction to Circuit Board Manufacturing

Speedy response from prototype to mass production! Introduction to circuit board manufacturing.

We can handle everything from prototype production of flexible printed circuit boards to mass production. In addition to standard single-sided and double-sided boards, we also combine our know-how in rigid and flexible boards, so you can trust us with the manufacturing of multi-layer flexible boards (up to 8 layers) and rigid-flex boards (up to 8 layers). We primarily focus on the manufacturing of ceramic substrates, commonly referred to as ceramic boards, which have high heat resistance and excellent electrical characteristics, as well as the assembly and mounting of hybrid ICs. For patterning (metalizing) on ceramic substrates, we use a thick-film printing method, and in recent years, we have applied this technique to pattern various materials, including metals like aluminum and stainless steel, as well as resin-based materials like PET. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Substrate "Alumina substrate"

Substrate "Alumina substrate"

Alumina substrate with excellent thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness!

The "alumina substrate" is a substrate made of alumina ceramics that excel in thermal conductivity, insulation, heat resistance, strength, acid resistance, and cost-effectiveness. The warping of the substrate is extremely small, and it can also be used for thin films. It is a product with excellent lubricity. Additionally, it has high dimensional accuracy and stable slits and through-holes, making it suitable for high breakability applications, including chip network substrates and ultra-small chip substrates. 【Features】 ■ Stable slits and through-holes ■ Extremely small warping of the substrate ■ High dimensional accuracy ■ Excellent lubricity ■ High breakability *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • substrate

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Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

A high-current board that can minimize current loss compared to the design value!

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Substrate "MD"

Substrate "MD"

This is a product that utilizes advanced nano-level polishing and plating technologies!

This product is a substrate used in computer storage devices (hard disk drives). Made from aluminum discs, it undergoes processes such as grinding, electroless nickel-phosphorus plating, mirror polishing, and various characteristic inspections. 【Features】 ■ Manufactured using advanced nano-level polishing and plating technologies ■ Dramatically increases storage capacity *For more details, please contact us or download the catalog.

  • Other Machine Parts
  • Other electronic components and modules
  • substrate

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[Contracted Services] Reverse Engineering Plus Case Examples

[Contracted Services] Reverse Engineering Plus Case Examples

Providing the value of "Plus"! We have various achievements, including automatic navigation systems and wireless chargers.

In our contracted service "Reverse Engineering Plus," we provide added value through operation principle clarification, function estimation/principle analysis, and evaluation, in addition to standard disassembly and analysis. For example, in foundation redesign (design contracting), we propose solutions by leveraging the diverse technical expertise cultivated by WTI. We have various case studies available. Please feel free to consult us. [Providing the value of "Plus"] ■ Operation principle clarification ■ Function estimation/principle analysis ■ Evaluation (environment setup/automation) ■ Suggestions for improvement ■ Actual design contracting (modifications/new designs) *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract Analysis
  • Other contract services
  • Circuit board design and manufacturing
  • substrate

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[Data] Shirutoku Report No. 18 # Substrate Structure and Package

[Data] Shirutoku Report No. 18 # Substrate Structure and Package

A suitable structural examination is necessary due to the mounted components and wiring density! An explanation of the structure of the substrate.

★★Shirutoku Report: Useful Information You Should Know★★ This report introduces the "Structure of PCBs." It includes topics such as "Classification by PCB Structure," "Conductor Materials and Solder Resist," and "The Importance of Initial Considerations in PCB Structure." Our company is also capable of PCB design starting from initial considerations, including PCB structure. If you have any concerns, please feel free to reach out to us. 【Contents】 ■ Classification by PCB Structure ■ Conductor Materials and Solder Resist ■ The Importance of Initial Considerations in PCB Structure ■ About Flexible PCBs *For more details, please refer to the PDF document or feel free to contact us.*

  • Printed Circuit Board
  • substrate

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Substrate "Copper Base Wiring Board with Posts"

Substrate "Copper Base Wiring Board with Posts"

Direct heat conduction to the base material!

The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Substrate "Flexible Printed Circuit (FPC)" / NOK

Substrate "Flexible Printed Circuit (FPC)" / NOK

Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.

"Flexible Printed Circuit (FPC)" is a circuit board with excellent bending durability, formed on a thin and sturdy film. It can replace harnesses (wires), and it is also capable of shielding processing, waterproofing, and component mounting. Leveraging its features of being "thin," "light," "flexible," and "high-density mounting," it is an indispensable product for miniaturization and weight reduction of portable electronic devices, as well as for space-saving and wiring simplification in various industrial equipment, devices, and automobiles. 【Features】 ■ Extremely thin and can be bent freely ■ Can replace harnesses (wires) ■ Much thinner and lighter compared to rigid boards and harnesses ■ Capable of shielding processing, waterproofing, and component mounting *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Specification] Arduino_DAC_SHIELD Board

[Specification] Arduino_DAC_SHIELD Board

Introducing the specifications of a shield board that performs 8-channel DAC output controlled by SPI for Arduino Uno!

This document is the specification sheet for the "Arduino_DAC_SHIELD board" handled by Tosa Electronics, which engages in the processing, assembly, and inspection of electronic components and electronic circuit boards. It includes product descriptions, usage instructions, and sample programs. The "Arduino_DAC_SHIELD board" is a shield board for Arduino Uno that provides 8-channel DAC output controlled via SPI. [Contents] ■ Product Description ■ Usage Instructions ■ Sample Programs ■ Circuit Diagram *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials
  • substrate

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory
  • substrate

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Substrate "Flat Copper PWB"

Substrate "Flat Copper PWB"

Directly mount LEDs onto a copper-based surface!! If you seek heat dissipation, choose 'Flat Copper PWB'.

"Flat Copper PWB" achieves high heat dissipation effectiveness by directly mounting the LED heat dissipation section onto a copper base surface. 【Features】 ■ Direct mounting of the LED heat dissipation section onto the copper base surface ■ High heat dissipation effectiveness (thermal conductivity: 398W/m·k)

  • Printed Circuit Board
  • Other electronic parts
  • LED Module
  • substrate

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Substrate

Substrate

Wiring for electrical products and precision instruments! Introducing our circuit boards.

At Sun Label, we respond to our customers' needs by designing and manufacturing printed circuit boards. We offer a lineup that includes "single-sided boards," which have conductor patterns formed on one side of an insulator, and "double-sided boards," which have conductor patterns on both sides and can consist of multiple layers. Additionally, we also handle double-sided adhesive sheets that can be reused and are usable even in high-temperature environments (with a momentary peak temperature of about 260°C). 【Products Offered】 ■ Single-sided boards ■ Double-sided boards ■ High heat-resistant double-sided adhesive sheets *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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Substrate "APOLLO5C Series"

Substrate "APOLLO5C Series"

Proposal for Image and Communication Models Equipped with Cyclone V SoC

The APOLLO5C series is an ideal development platform for communication and image processing. It also offers design quality suitable for use in mass-produced products. In the artwork design of each board, PI/SI simulations are conducted in detail to implement the best design practices. 【Features】 ○ Supports various interfaces → ETHERNET, USB 3.0, SDCARD, DisplayPort For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • substrate

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AT substrate universal type / type with lug terminals

AT substrate universal type / type with lug terminals

Ideal for the construction of analog circuits using discrete components.

Universal board with a dot pitch of 4mm.

  • Printed Circuit Board
  • substrate

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Substrate "Dielectric Substrate for Microwave Use"

Substrate "Dielectric Substrate for Microwave Use"

It has a stable temperature characteristic with a high Q value in the high frequency range, achieving a wide range of inductance!

The "dielectric substrate for microwave applications" can be used for electronic components for mobile phones, microwave communication devices, microwave integrated circuit (MIC) substrates, stripline resonators, Bluetooth, and other applications. This product features stable temperature characteristics with a high Q value in the high-frequency range, achieved through our unique ceramic material technology, and realizes a wide range of permittivity. Precision processing such as surface polishing and slicing is also available upon request. Please feel free to contact us. 【Features】 ■ High Q value in the high-frequency range ■ Stable temperature characteristics ■ Realizes a wide range of permittivity *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • substrate

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Substrate Remake Service Abirika × Meiko Electronics

Substrate Remake Service Abirika × Meiko Electronics

Circuit board remake service: Revise long-selling circuit boards that you want to continue producing! We will assist you in achieving further long-term supply!!

Even if you want to redesign... The developers from 20 years ago are no longer available. There are no resources allocated for redesign. There is no software specification document. We can solve those problems! We propose products that can be supplied for a longer term, not just microcontrollers! Please consult us when replacing microcontrollers from other companies with Renesas! *For more details, please refer to the PDF document or feel free to contact us.

  • Prototype Services
  • substrate

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Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!

The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Data] Shirutoku Report No. 13 # Characteristic Impedance

[Data] Shirutoku Report No. 13 # Characteristic Impedance

The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.

★★Useful Information Report: Knowledge is Power★★ This report introduces the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it essential to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Prototype Services
  • substrate

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Substrate "Impedance Control"

Substrate "Impedance Control"

Impedance measurement creates test coupons outside the product! The design values for the impedance line can be simulated by our company.

In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. By providing us with impedance specifications and other details before or during the design phase, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS800s4 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Metal base wiring board

Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts
  • substrate

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Substrate "Knight Frogs WINE"

Substrate "Knight Frogs WINE"

ECC support! A high-grade board equipped with 10Gb Ethernet and an extended temperature range.

Gofeltec's "Knight Frogs WINE" is a compact, high-grade COM Express module equipped with Intel's third-generation 64-bit SoC Intel Xeon/Pentium processors. The main memory is DDR4 SO-DIMM, supporting up to 8GB and ECC. In addition to the standard I/O of COM Express Type 6, the carrier board can be equipped with 2 channels of 10G Ethernet. 【Features】 ■ 10Gb Ethernet equipped ■ ECC support ■ Extended temperature range (-5℃ to 70℃) ■ Available in Basic Module Size (125×95mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Memory
  • substrate

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Substrate "HIGH POWER LED PWB"

Substrate "HIGH POWER LED PWB"

Covers a wide range from 360 to 740 nm in the near ultraviolet region! Uses light-resistant white ink!

The "HIGH POWER LED PWB" is a product of Shirato Print Circuit Board Manufacturing Co., Ltd., which is engaged in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. It has excellent light resistance, not deteriorating even after 2000 hours of exposure to deep ultraviolet light at 254nm. Due to its inorganic materials, it can withstand temperatures above 350°C. The base material can be selected from aluminum or copper. 【Features】 ■ The COB mounting section has an insulation withstand voltage of 2kV at 80μm ■ White ink with light resistance and reflectivity of over 90% ■ Covers a wide range of near-ultraviolet wavelengths from 360 to 740nm ■ Withstands temperatures above 350°C due to inorganic materials ■ Patent pending *For more details, please request materials or view the PDF data available for download.

  • Printed Circuit Board
  • Other electronic parts
  • substrate

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