Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
16～30 item / All 45 items
With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.
Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology
![[Exhibition Report] We exhibited at NEPCON Japan 2025!](https://image.mono.ipros.com/public/product/image/c7a/2001510480/IPROS11956591292795024490.jpg?w=280&h=280)
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
Newly developed material.
◆FPC (Flexible Printed Circuit Board)◆ ~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ FPC manufacturing requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High precision outline processing ±50μm, diverse tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
![[Exhibition Report] We exhibited at JPCAshow 2025!](https://image.mono.ipros.com/public/product/image/91f/2001532950/IPROS2732163172441887632.png?w=280&h=280)
I would like to briefly introduce the successful exhibition content of FPC.
◎Introducing Our Company's "Strengths" in the Processing Engineering >> There are multiple important processing steps in FPC manufacturing. Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. We have introduced the "strengths" we have cultivated over many years in each process: <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Processing> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision contour processing ±50μm, a variety of tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing >> Normally, there are no opportunities to see anything other than the finished product, but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. *Through-hole drilling, exposure/development, etching, contour processing, etc.
I would like to introduce the "Technical Information" related to FPC.
● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.
Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.
This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.
Flexible printed circuit board (FPC) for high-speed transmission
This product is an FPC designed for high-speed transmission. It uses a special liquid crystal polymer as the base film, featuring stable impedance control. We can also accommodate component mounting and procurement for FPCs, as well as supply components from customers. We offer total proposals from pattern design to mass production. We can also provide various environmental documentation. CMI is an FPC manufacturer with over 15 years of history in Taiwan. We have numerous achievements with domestic manufacturers in Japan, realizing high quality, low cost, and short delivery times based on our advanced technology and track record.
Short delivery times and small lot sizes! Supports high-quality and high-performance specifications such as high flexibility and impedance control.
Asunics collaborates with Taiwanese FPC manufacturers to provide high-quality and short-lead-time FPCs. We support high-quality and high-performance specifications such as high flexibility and impedance control. We provide speedy support from component mounting, bump and Gerber data creation assistance, to prototyping and mass production. 【Features】 ■ Materials: Polyimide / Liquid Crystal Polymer, etc. ■ High-speed signal support: LVDS / HDMI / USB / MIPI ■ Short lead time / Small lot *For more details, please download the PDF or feel free to contact us.
Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.
Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝
Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!
The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.
The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.
It can suppress discoloration during heating. Here are the test results using a double-sided panel.
The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.
When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.
The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.
