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Laser Micromachining Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Laser Micromachining Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  2. ナラサキ産業 メカトロソリューション部　機能材料課 Tokyo//Manufacturing and processing contract
  3. リプス・ワークス Tokyo//Manufacturing and processing contract
  4. アルプスエンジニアリング Shizuoka//Industrial Machinery
  5. 5 シーエステック Kyoto//Resin/Plastic
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Laser Micromachining Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ultrafine! Introduction to Laser Processing ナラサキ産業 メカトロソリューション部　機能材料課
  2. Examples of dimple processing for punches リプス・ワークス
  3. Laser microprocessing: carbide chip breaker (groove) processing 光機械製作所 HIKARI LASER LAB.
  4. 【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】 光機械製作所 HIKARI LASER LAB.
  5. Laser microfabrication: Glass hole processing, fine holes 光機械製作所 HIKARI LASER LAB.

Laser Micromachining Product List

16～27 item / All 27 items

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"Laser Micromachining" *Materials with case studies will be provided.

"Laser Micromachining" *Materials with case studies will be provided.

Achieving high-quality precision processing with optical systems tailored to materials and shapes. Consistent support from prototyping to mass production.

Our company conducts prototyping and mass production using "laser microprocessing." Leveraging our knowledge and experience from selling laser processing equipment, we propose optical systems and oscillators that match the materials and processing requirements. Additionally, we can provide comprehensive support in-house for combined processing that incorporates machining and micro-blasting, addressing a wide range of needs from prototyping to mass production. ★ You can view materials showcasing processing examples from the "PDF Download." 【Examples Listed (Excerpt)】 ◎ Laser Drilling Multi-hole processing on ceramics, drilling on tempered glass, and through-hole drilling and counterboring on glass substrates. ◎ Cutting, Grooving, Drilling, Thin Film Removal Grooving on SiC substrates, free-form cutting of polyimide, and cutting out carbon sheets. *Please feel free to contact us with any inquiries.

  • Processing Contract
  • Other processing machines

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Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.

【Processing Specifications】 Plate Thickness: 0.1mm Hole Dimensions (Incident Surface): 0.3×0.3mm Pitch: 0.6mm Processing Range: 45×45mm You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers. Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.

  • Processing Contract

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Laser microprocessing: carbide chip breaker (groove) processing

Laser microprocessing: carbide chip breaker (groove) processing

Laser microprocessing: carbide chip breaker (groove) processing

Grooves were processed at the tip of a carbide cutting tool using an ultra-short pulse laser. This improves the discharge of "chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as PCD (polycrystalline diamond) and CBN (polycrystalline cubic boron nitride). In this way, by applying fine processing with a laser, it is also possible to enhance functionality. Material: Carbide

  • Processing Contract
  • Other machine tools
  • Drive system parts

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Laser microprocessing: Chip breaker (groove) processing

Laser microprocessing: Chip breaker (groove) processing

Micro chip breaker (groove) processing for PCD (polycrystalline diamond sintered body)

The tip of the PCD cutting tool was grooved using an ultra-short pulse laser. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as carbide and CBN (cubic boron nitride). Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600 μm

  • Processing Contract
  • byte
  • Other cutting tools

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Laser microfabrication, water repellency, release properties, surface modification, metal, resin.

Laser microfabrication, water repellency, release properties, surface modification, metal, resin.

Surface modification: Hydrophobicity can be imparted through nano-patterning processing.

【Laser Micromachining Hydrophobicity Release Properties Surface Modification Metal Resin】 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has been modified using ultrashort pulse laser micromachining to impart hydrophobicity to the metal surface. It is also referred to as functional processing, which adds functionality and enhances the product's performance. While hydrophobicity has been added this time, applications such as "hydrophilicity," "friction reduction," and "sliding properties" are also possible, contributing to the improvement of product functionality. It is a technology that utilizes the lotus effect. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Engine parts
  • Drive system parts

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Laser microfabrication, glass marking, application in the medical industry.

Laser microfabrication, glass marking, application in the medical industry.

Laser microprocessing: Marking processing on glass surfaces

【Laser Microprocessing Glass Marking Applied to the Medical Industry】 【Material】 Glass 【Industry and Application】 Medical devices and related components 【Processing】 Ultrafast pulse laser processing 【Features】 This product performs fine marking on the glass surface with a Φ0.1mm spot using an ultrafast pulse laser. (Compliant with SEMI format) Since this product uses an ultrafast pulse laser, physical damage and thermal effects are minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of it all. From processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Laser marker
  • Processing Contract
  • Sealing machine

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Microfabrication, trimming process, SUS304, laser, cutting out.

Microfabrication, trimming process, SUS304, laser, cutting out.

Laser microfabrication: trimming process SUS304 laser cutting

【Microfabrication Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microfabrication with a cut width of 0.1mm, and we can also accommodate trimming of irregular shapes. By using ultrashort pulse lasers, we have significantly reduced physical damage and thermal effects, enabling fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Other Auto Parts
  • Other semiconductor manufacturing equipment

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Microfabrication, trimming, micron level, polyimide.

Microfabrication, trimming, micron level, polyimide.

Laser microfabrication: Trimming of polyimide using ultrashort pulse lasers.

【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry and Applications】 Semiconductors Electronic Components 【Material Dimensions】 Plate Thickness: 25μm Remaining Width: 10μm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is made of polyimide material. Trimming processing was performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrashort pulse lasers, physical damage and thermal effects are greatly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor components ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Wafer
  • Processing Contract
  • Other semiconductors

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【QRコード　超短パルスレーザー　ガラス表面・内部改質加工】

【QRコード　超短パルスレーザー　ガラス表面・内部改質加工】

表面マーキング・内部改質加工（QRコード）　超短パルスレーザー

【QRコード　　超短パルスレーザー　　ガラス表面・内部改質加工】 【材質】 ソーダライム（青板ガラス）　厚み：1.3mm 【業界・使用用途】 自動車関連業界 医療機器・医療部品関連業界 半導体微細部品 【材寸】 加工サイズ：上段　表面マーキング　下段：内部改質　 【加工】 超短パルスレーザー加工 【特徴】 こちらの製品は、超短パルスレーザーでガラス表面を傷つけることなく、内部改質加工を 行いました。光の当たり方により虹色に見えます。 上段の白く見えるのがガラス表面にマーキング、下段の虹色に見えるのがガラス内部に マーキングしています。

  • 2D Code Reader

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【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】

【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】

ガラス材への角窓くり抜き加工

材質】 合成石英ガラス　厚み：1mm 【業界・使用用途】 自動車関連業界 医療機器・医療部品関連業界 半導体・電子部品 【材寸】 加工サイズ：角窓寸法　3mm角～0.25mm角　 【加工】 超短パルスレーザー+ウェットエッチング 【特徴】 こちらの製品は、合成石英ガラスを角形状にくり抜きました。 超短パルスレーザーによるレーザー改質とウェットエッチングを組合せる事で角形状のくり抜きも可能となります。

  • Other electronic parts

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Fine cutting processing SUS304 Contract processing Stainless fine processing

Fine cutting processing SUS304 Contract processing Stainless fine processing

Realization of fine cutting processing.

【Material and Processing】 SUS304 Thickness: 0.05mm Cutting Width: 0.1mm Cut-out Processing 【Features】 This product has undergone fine shape processing of thin film materials using ultra-short pulse laser. It is expected to be processed for miniaturization of parts and for incorporation into stacked products.

  • Other electronic parts

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We processed a QR code onto aluminum foil using fine laser processing!

We processed a QR code onto aluminum foil using fine laser processing!

We processed a QR code onto a thin aluminum foil using fine laser machining.

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel parts for medical devices 【Material】 Aluminum foil, thickness: 11μm 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultrashort pulse laser processing 【Features】 This product has a QR code laser-processed onto aluminum foil material. Please try scanning it! Our fine laser processing minimizes thermal impact on thin materials with a thickness of 11μm, allowing for clean processing. Physical damage and thermal effects are significantly reduced, enabling fine processing with minimal burrs.

  • others

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