利昌工業 Product Lineup

Electronic materials for heat dissipation design include high thermal conductivity materials that feature a high thermal conductivity insulating layer on the surface of aluminum or copper plates, as well as products such as copper foil laminated materials and white printed circuit board materials that excel in UV discoloration resistance and heat discoloration resistance. We support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors. *For more details, please download the catalog or contact us directly.

The insulation layer contains glass cloth, which provides excellent insulation reliability. The breakdown voltage is... 5kV for an insulation layer thickness of 60μm 7kV for an insulation layer thickness of 120μm ...that is.

In addition to excellent thermal conductivity, it has flexibility that is so great it can bend like a crane, making it easy to handle.

Excellent thermal conductivity

It was developed to incorporate LED components. It is a printed circuit board material that is white and has excellent thermal conductivity (1.3W/mk). It has obtained UL94/V-0 certification.

This is a highly thermally conductive printed circuit board material designed to accommodate components that emit high heat during operation, such as high-brightness LEDs and power semiconductors. It has been on the market for 20 years, and the lineup has been enriched, receiving many adoptions.

The heat emitted by high-brightness LEDs and power devices destabilizes their operation and accelerates the degradation of surrounding materials such as substrates and encapsulating resins. Therefore, substrate materials are required to efficiently transfer heat to the casing and heat sinks. High thermal conductivity printed circuit board materials support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors, with a thermal conductivity that is ten times greater than that of standard printed circuit board materials (FR-4). ------------------------------【Features】--------------------------------- ■ Achieves a thermal conductivity of 3.0 W/mK with glass cloth ■ Can be made thin, thus supporting thermal management from the aspect of "reducing thermal resistance" ---------------------------------------------------------------------------

It is an adhesive thermal conductive material with high thermal conductivity and insulation reliability.

When surface mount components are soldered onto an aluminum base printed circuit board, the aluminum plate repeatedly expands and contracts due to heat, causing stress to accumulate at the solder joints, leading to fatigue failure (solder cracks). The insulation layer of AC-7302 is very soft (low elasticity), which can help alleviate the stress on the solder joints.

Glass fabric substrate epoxy resin printed circuit board materials are referred to as FR-4 in the industry. The thermal conductivity of standard FR-4 is about 0.3 W/mK. In contrast, Risholite high thermal conductivity FR-4 offers a lineup with thermal conductivities of 1.8 W/mK, which is six times that of standard products, and 3 W/mK, which is ten times higher. Since heat dissipation substrates can be manufactured using existing equipment, we have received many adoptions.