利昌工業 List of Products and Services

- The bending elastic modulus at high temperatures is very high, reducing warping during reflow. - The handling properties are good when processing thin substrates. - It is a high heat-resistant material while also exhibiting excellent moisture-resistant solder heat resistance. - The composition of the insulating layer is uniform, resulting in good laser processing capabilities. - It is an environmentally friendly substrate material that is halogen-free, phosphorus-free, and free of metal oxides.

With the spread of smartphones and tablet devices, the equipment that makes up broadband systems is required to process large amounts of data at high speeds. Additionally, to enhance "connectivity" and expand coverage areas, the installation and upgrading of base stations are being advanced. In response to this, Rishou Industry has prepared printed circuit board materials that have a fast signal propagation speed (low dielectric constant) and a function to minimize transmission loss (low dielectric loss tangent).

The substrate glass fabric uses general-purpose E-glass, which offers excellent cost performance.

Reduces warping during reflow.

It is a black printed circuit board material that does not transmit or reflect light, even with a thickness of only 0.1mm. It absorbs not only visible light but also light from sensors, commonly used in the red to near-infrared range (wavelengths of 650 to 1310 nanometers). The glass transition temperature is 250°C, with a UL flammability rating equivalent to 94/V-0, and the coefficient of thermal expansion below the glass transition temperature is 34ppm/°C, making it a high-performance printed circuit board material.

Power devices, which are semiconductors for power conversion, and high-brightness LEDs generate significant heat, so they are mounted on printed circuit boards based on aluminum plates. In this case, when the aluminum plate expands or contracts due to heat, it puts stress on the solder joints of the components. If this stress accumulates, it can lead to "solder cracks." The newly developed 7303 series resin remains very flexible even after curing, allowing it to absorb dimensional changes caused by the expansion and contraction of the aluminum plate. As a result, the stress on the solder joints is alleviated, helping to prevent the occurrence of cracks.

This is a printed circuit board material (copper-clad laminate) developed for electronic devices related to the rapid advancement of automotive electrification and electronic control. It is a printed circuit board material equipped with the necessary performance for various in-vehicle devices, such as LED lamps, engine control units, power control units, and millimeter-wave radars.

The printed circuit board materials for millimeter-wave radar substrates require the performance of "low transmission loss," which has led to the prevalence of expensive PTFE (polytetrafluoroethylene) and LPC (liquid crystal polymer) based materials. CS-3379M is based on the more affordable PPE (polyphenylene ether) and achieves low transmission loss. It is expected to offer low transmission loss performance comparable to PTFE substrates while being available at about half the price.

This is a printed wiring board material (copper-clad laminate) developed for electronic devices related to the rapid advancement of automotive electrification and electronic control. It is a printed wiring board material equipped with the necessary performance for various in-vehicle devices such as LED lamps, engine control units, power control units, and millimeter-wave radars. [Contents] - High thermal conductivity copper-based printed wiring board material for inverter/converter substrates [CC-7210] - Long-term high heat resistance CCL for engine control unit substrates [CS-3305A] - Low transmission loss CCL for millimeter-wave radar substrates [CS-3379M] - Solder crack resistant aluminum-based substrate material for LED headlight substrates [AC-7303] - High heat-resistant black CCL that does not transmit light for optical sensor substrates [CS-3667B] - High thermal conductivity white CCL for LED substrates [CS-3945] - High thermal conductivity adhesive sheet/copper foil with resin For more details, please download the PDF or contact us.

It is a substrate material that experiences minimal signal attenuation and speed reduction even when high-frequency signals flow through the circuit of a printed circuit board. 5G communication exchanges large amounts of data using high-frequency signals such as 28 gigahertz. Substrates used in devices like antennas, servers, and switches require this characteristic of "low transmission loss."

This product consists of a thermosetting resin blended according to its intended use, stretched to approximately 120 micrometers, and provided sandwiched between release films. This material is intended for printed circuit board manufacturers and is not something that can be adhered at room temperature and atmospheric pressure like commercially available double-sided tape. The resin is delivered in a semi-cured (B-stage) state. Depending on the season, thermal curing may begin due to outdoor or room temperatures, so we may deliver it using a so-called "cool delivery" service after consulting with the customer.

●Dk=3.01 / Df=0.0019 @80GHz ●High resin fluidity and excellent circuit embedding properties ●Composite substrate with PTFE substrates or MPI substrates is possible ●Can be laminated at a relatively low temperature of 180°C due to thermosetting properties ●Suitable for skew prevention without including glass cloth ☆This material is for manufacturers of printed circuit boards.

This is an FR-4 type printed circuit board material with a white appearance designed to accommodate LED elements and LED components.

This is a printed circuit board material with high dielectric constant (Dk=11.3) and low dielectric loss tangent (Df=0.003). It is a type reinforced with glass cloth using PPE resin (polyphenylene ether), allowing the use of existing machinery and know-how for processing glass epoxy type printed circuit boards (FR-4). We also have prepreg for multilayering (ES-3346) and interlayer adhesive sheets (AD-3396).