ニデックアドバンステクノロジー List of Products and Services

"Pulse EYE" is a support tool for the analysis of Power semiconductor testing and waveforms. It features various modes such as "Waveform Analyze," which allows for graph display and manipulation of arbitrary signals, cursor display, selection of analysis position display, and locus graph display functionality, as well as "Dual File View," which enables easy comparison display by overlaying graphs from two files. Please feel free to contact us if you have any inquiries. 【Features】 ■Improved work efficiency/time reduction ■Displays all waveforms in 2-3 seconds with one click ■Analysis position information display ■Comparison of multiple file displays ■Waveform display with black and white inversion *For more details, please download the PDF or feel free to contact us.

• Other network tools

The "TDAS-Series" is a device designed for performance and durability testing of onboard drive motors for EVs/HEVs, as well as E-Axles (integrated motor, inverter, and gear). With original measurement, control, and analysis software and GUI, it allows for simple operation to conduct various tests, including constant torque operation, constant speed operation, and tests tailored to driving patterns such as WLTC. Additionally, it enables real-time monitoring of images and data via a live camera, and remote monitoring through the TDAS monitoring system. 【Features】 ■ Capable of constructing 3-axis/4-axis test benches ■ Capable of constructing test benches for inverters ■ Measurement, control, and analysis possible with simple and easy operation ■ Compatible with TDAS remote monitoring system ■ Supports ultra-high speed of 36,000 rpm *For more details, please download the PDF or feel free to contact us.

• Testing Equipment and Devices

We would like to introduce our IGBT/SiC power module testing equipment, the 'NATS Series'. We offer the automatic testing device "NATS-1000," which achieves low LS values and supports high-precision testing for insulation, static characteristics, and dynamic characteristics, as well as the manual testing device "NATS-1630/1730," which can be integrated with external PCs and upper data management systems such as the cloud. Please feel free to contact us when you need assistance. 【Features】 <NATS-1000> ■ Insulation testing (ISO) ■ Static characteristics testing (DC) ■ Dynamic characteristics testing (AC) ■ High-temperature testing up to 175°C (up to 200°C) ■ High throughput of up to 144 UPH (25 seconds/unit) *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our high-density substrate compatible 2D/3D inspection equipment, the 'RSH Series'. It supports the miniaturization of bump diameter/pitch. We have a diverse lineup tailored to your needs. Please feel free to contact us when you need assistance. 【Features】 ■ Ultra-fast and high-precision inspection ■ Simultaneous measurement system for 2D/3D ■ Supports miniaturization of bump diameter/pitch *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our 3D measurement device compatible with glass substrates, the 'NSAT Series.' It supports a depth of 5μm and a line space of 2/2. It offers various measurement functions such as Trace, Anchor, Overlay, and Film. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports depth of 5μm and line space of 2/2 ■ Thickness measurement of SR and ABF using transmission measurement method ■ Technical capability and reliability compatible with glass cores *For more details, please download the PDF or feel free to contact us.

• Circuit Board Inspection Equipment

We would like to introduce our product, the "NS Probe." This is a product for inspection systems for printed circuit boards and semiconductor package substrates. It has achieved miniaturization and diversification of advanced shapes using MEMS processes. We offer two types of Probe: "Flat" and "Point." Please feel free to contact us when you need assistance. 【Features】 ■ Flat-Type - Improved dimensional accuracy ■ Point-Type - Material selection is possible *For more details, please download the PDF or feel free to contact us.

• probe

We would like to introduce our "high-precision inspection jigs" that we handle. Products for printed circuit board and semiconductor package inspection systems. They are compatible with fine conductors and electrode pads. We are also developing probes with diameters of 7um and 10um. Please feel free to contact us when needed. 【Features】 ■ One-touch jig ■ Probes with diameters of 7um and 10um in development ■ Four-terminal jig for measuring micro-resistance *For more details, please download the PDF or feel free to contact us.

• Inspection fixture

We would like to introduce our continuity/insulation testing tester 'RZ-1207'. This advanced tester, compatible with flat cables, incorporates a wealth of optional features that can be added as needed. It is well-suited for testing circuit patterns on bare boards and flex circuits, as well as for harness inspections. Please feel free to contact us if you have any inquiries. 【Features】 ■ High speed and high precision ■ Scanner card ■ Up to 16k test points ■ 4W testing ■ μOPEN testing * For more details, please download the PDF or feel free to contact us.

• Tester

The "R-700 Series" is a compactly designed AC/DC MULTI TESTER that offers high speed and high precision. It can inspect various products such as thin-film RF filters, automotive DC modules, acceleration sensors, and MEMS devices. We offer a lineup including the "R-730 Standard," "R-780 High Insulation," and "R-770 AC Dynamic." 【Features】 ■ Ultra high insulation ■ High speed and high precision ■ Compact design ■ Maximum inspection points: 512 pins ■ High resolution for small capacitance measurement ■ 4W low resistance measurement: 0.1mΩ～ *For more details, please download the PDF or feel free to contact us.

• Tester

The R-5940 is a super tester specialized for IC embedded substrates. It meets the diverse needs of high-precision IC testing with high-speed continuity and short-circuit measurements, μΩ accuracy, high-speed testing with four-terminal measurements, and all-CH LCR measurements. By connecting up to 16 SMUs as power supplies and electronic loads to the DUT, it enables the implementation of power ON/OFF sequences, allowing for DUT measurements with freely combined SMUs. 【Features】 ■ High-speed testing ■ High precision ■ Specialized for IC embedded *For more details, please download the PDF or feel free to contact us.

• Tester

We would like to introduce our high-speed S&R type electric inspection device, the 'STAR REC M6V SW'. It is a space-saving L/UL integrated model that achieves the highest class of speed and precision in the M6 series. We can provide proposals tailored to your specifications for LUL. Please feel free to contact us when you need assistance. 【Features】 ■ Space-saving L/UL integrated model ■ High-speed/high-precision model ■ Compatible with AGV systems *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "STAR REC V5III" is a testing device for printed circuit boards that achieves compatibility with fixtures from the V3/V5 series and is equipped with advanced testing capabilities. It improves inspection accuracy and speed, accommodating the inspection of increasingly miniaturized printed circuit boards. Additionally, as an option, it can read 2D codes engraved on the boards, linking inspection results with 2D code information and outputting the data to an external PC in a specified format. Please feel free to contact us if you have any inquiries. 【Features】 ■ Provision of inspection solutions ■ 2D traceability support (optional) ■ Smart factory compatibility (optional) *For more details, please download the PDF or feel free to contact us.

• Circuit Board Inspection Equipment

We would like to introduce our conduction insulation inspection device for large HDI boards, the 'GATS-8350'. It supports both Step & Repeat inspection for multi-panel boards and batch inspection for large boards. Additionally, LUL can provide proposals tailored to your specifications. Please feel free to contact us when you need assistance. 【Features】 ■ High-precision inspection device for large HDI ■ Supports up to 64K points for both upper and lower sides ■ Compatible with both Step & Repeat inspection for multi-panel boards and batch inspection for large boards *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7862'. The overall alignment accuracy is ±2.5μm, designed for inspection of half/quater panels. It supports large, multi-pin substrates such as chiplets. Please feel free to contact us if you have any inquiries. 【Features】 ■ High-precision inspection equipment for half/quater panels ■ Compatible with large, multi-pin substrates such as chiplets ■ Supports various automation requirements *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7836'. LUL can provide proposals tailored to your specifications. We accommodate large multi-pin substrates such as chiplets and various automation requirements. Please feel free to contact us when you need our services. 【Features】 ■ High-precision inspection equipment for large individual pieces/quarter panels ■ Compatible with large multi-pin substrates such as chiplets ■ Accommodates various automation requirements *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7760'. It supports large, multi-pin substrates such as chiplets. We offer two models: one for individual pieces and one for sheets. Additionally, LUL can provide proposals tailored to your specifications. Please feel free to contact us when you need assistance. 【Features】 ■ High-precision inspection equipment for FC-CSP/large individual piece substrates ■ Compatible with large, multi-pin substrates such as chiplets ■ Two models available: individual piece specification and sheet specification *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our IGBT/SiC power module testing equipment, the 'NSAT Series'. The "NATS-1000" is an automatic testing device for insulation/static characteristics/dynamic characteristics. It can be expanded for automatic lines and complies with IEC60747 measurements. The "NATS-1630/1730" is a manual testing device for dynamic characteristics, capable of interfacing with higher-level data management systems such as external PCs or the cloud. 【NATS-1000 Features】 ■ High-temperature testing up to 175℃ (up to 200℃) ■ High throughput of up to 144 UPH (25 seconds/unit) ■ Low LS of 4.5nH ■ Expandable for automatic lines ■ Complies with IEC60747 measurements ■ AOI/warp inspection/laser marking *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce the "NSAT Series" that we handle. It supports a depth of 5μm and a line space of 2/2. Thickness measurement of SR and ABF is possible using the transmission measurement method. This is an advanced substrate-compatible, high-speed, high-precision 3D measurement device. Please feel free to contact us if you have any inquiries. 【Features】 ■ Depth of 5μm, supports line space of 2/2 ■ Thickness measurement of SR and ABF using the transmission measurement method ■ Technical capability and reliability compatible with glass core *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

The "MEMS Probe" is an ideal MEMS probe for semiconductor wafer testing, including microprocessors and application processors. This product achieves low resistance and low inductance through its unique structure. Additionally, our company manufactures probes with high precision and stable quality, handling everything from the processing of fine MEMS spring probes to inspection, so please feel free to contact us. 【Features】 ■ Unique structure ■ Optimal for semiconductor wafer testing ■ Supports ultra-fine pitch ■ Achieves low resistance and low inductance *For more details, please refer to the catalog or feel free to contact us.

• Spring