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Sartec provides comprehensive support in the field of "thin film processing," which underpins the functionality of electronic products, from the design of film specifications and optimization of process conditions to mass production management. Researchers and developers involved in product development, do you have any concerns such as: "I don't know which film materials to use to meet the required functions." "I want to consider special combinations like film deposition on flexible substrates." "I want to evaluate small lot prototypes, but I don't know where to turn to." At Sartec, we propose optimal film compositions, material selections, and deposition methods to help bring your product's objectives and completion image closer to reality, and we support the establishment of a stable mass production system. Leveraging the expertise in fine structure design, material knowledge, and mass production know-how cultivated in flexible substrate design, we will work alongside you from the initial concept stage to promote manufacturing together.

• Other semiconductors

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

• Printed Circuit Board
• Circuit board design and manufacturing
• EMS

Our company offers proposals for the prototyping and mass production of flexible substrates, not only through etching and plating technologies for printed circuit boards but also through various thin film deposition processes for metal conductors using vacuum deposition and sputtering techniques, applying technologies across different industries. We support not only circuit formation using subtractive methods but also fine wiring with the Modified Semi-Additive Process (MSAP). Primarily focusing on circuit formation on flexible substrates such as transparent flexible substrates, we also provide patterning processes for glass, film ITO, and metal films, combining thin film formation technology, etching technology, and plating technology in our proposals. Additionally, we accommodate fine pattern processing for the formation of micro and narrow pitch bumps, as well as redistribution layers (RDL) for wafer-level packages (WLP).

• Processing Contract
• Circuit board design and manufacturing
• EMS

We support the realization of further development capabilities through the creation of system environments such as core systems and infrastructure development. With the recent diversification of customer needs, the tasks faced by our development clients have become varied. We believe it is our mission at Sartec to not only support circuit board development but also to propose labor-saving solutions that encompass surrounding tasks. By promoting DX (digital transformation) through proposals for core systems and support for infrastructure development, we believe we can contribute to enhancing our customers' development environments and further improving their development capabilities. We share the management challenges and issues faced by our customers in executing their operations. We are confident that actively making proposals is essential to being close to our valued customers.

• server
• Storage Backup
• Other security

■Areas of Expertise / Technologies Held - Java Software Development - Oracle Software Development - Citrix Presentation Server META Development - IoT Development (e.g., Raspberry Pi) - Handheld Terminal Development - Microsoft .NET Development - Web Application Development - Apple Objective-C (iPhone/iPad) Application Development - Android Application Development (Java) - Microsoft Kinect Development - Microsoft Windows Software Development - Other General Legacy System Development Flexible Circuit Boards, Flex Boards, FPC, Flex, Rigid-Flex Flexible Circuit Boards, Flex, FPC, Printed Circuit Boards Flexible Circuit Boards, Flex Boards, FPC, Flex Circuit Design, Software, Hardware Electronic Circuit Design, Stretchable Boards, Transparent Polyimide Software Contract Development, Firmware/Embedded, FPGA (PLD) Contract Development Core Systems, Production Management Systems, Order Management Systems

• Embedded applications for mobile phones and PDAs
• SFA/Sales Support System
• EAI/ETL/WEB application server

■System proposals for business efficiency and rationalization ■System improvement proposals for increasing sales and profits ■Establishment of an information sharing environment ■Support for effective utilization of existing software assets ■Proposals for management strategy support systems ■Construction of in-house servers and networks Flexible substrates, flex PCBs, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible substrates, flex, FPC, printed circuit boards, Flexible substrates, flex PCBs, FPC, flex, SMD mounting, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide MEMS, semiconductors, wearables, Contract software development, firmware/embedded, FPGA (PLD) contract development, Core systems, production management systems, order management systems

• Other core systems
• Integrated operation management
• Production Management System

"Proactive Sales Proposals through Strong Partnerships Made Possible by Satech" Satech is involved in cutting-edge technology and the latest electronic devices, but we hold the fundamental belief of "learning from the past to understand the new" and "the fusion of analog and digital." The experience we have accumulated is an asset. Even if we invest heavily in creating an environment, it is meaningless if it is not utilized. We engage deeply with our customers, gather information, conduct current situation surveys, and based on the analysis results, budget, and constraints, we propose and design the optimal system for our customers. Amid the diversification and complexity of system environments due to rapid technological innovation, we support the realization of stable and high-quality system operation environments.

• Embedded Board Computers
• Embedded system design service
• Other embedded systems (software and hardware)

At Satec, we handle everything from investigating the chemical substances contained in used parts to creating environmental impact data for products. We conduct survey requests to suppliers (agents/manufacturers) on behalf of our customers and create chemSHERPA data. We assist developers in reducing their workload, which they manage alongside their primary tasks (circuit design and operation verification). FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards, Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide, MEMS, chemSHERPA

• Circuit board design and manufacturing
• Other contract services
• Catalog and manual creation

●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC

• Prototype Services

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC

• Circuit board design and manufacturing
• Printed Circuit Board
• Contract manufacturing

We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin

• Circuit board design and manufacturing
• Printed Circuit Board
• Contract manufacturing

- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

■ JTAG Boundary Scan Test - Debugging work efficiency is dramatically improved. - The area required for test pads can be reduced, allowing for miniaturization. - Electrical inspection and failure analysis of high-density mounted boards (with BGA) can be performed. ■ Benefits of Implementation - Inner layer signals of multilayer boards can be visualized. - The status of terminals on the backside of BGA can be visualized in real-time. - Terminals of FPGA and CPU can be manipulated freely. - There is no need to rewrite programs just to move I/O. - Physical contact with probes is not necessary. - Debugging can be done without software, so when problems occur, there is no need to verify whether the issue is with software or hardware. - Initial investments in fixtures and other equipment can be significantly reduced.

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification

• Circuit board design and manufacturing
• Contract manufacturing
• Contract Analysis

- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC

• Circuit board design and manufacturing
• Printed Circuit Board
• Contract manufacturing

- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC

• Printed Circuit Board
• Circuit board design and manufacturing
• Contract manufacturing