ゼストロンジャパン Product Lineup

We would like to introduce our reflow furnace component and pallet cleaning agent, 'ATRON SP 300'. With just a 30-minute immersion, the cleaning power makes the pallets clean. The running costs can be reduced by about 20-30%, and with 50L of cleaning solution, you can clean over 10 lines of reflow furnace components or more than 1000 pallets. Additionally, using ultrasonic cleaning will further enhance the cleaning power. 【Features】 ■ Excellent cleaning performance ■ No need for rinsing or special drying ■ Excellent material compatibility ■ Low VOC content and low odor ■ Long lifespan and low cost ■ Manual concentration measurement *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the evaluation methods for cleanliness after flux cleaning. As for existing mainstream evaluation methods, after passing reliability assessments, actual manufacturing processes determine product defects through appearance inspections using AOI. However, there is a growing trend of defects occurring after product inspections. We introduce the factors contributing to such occurrences and effective analytical methods other than appearance inspections, so please take a moment to read through it. [Contents] ■ An era where post-cleaning evaluation is questioned, just like cleaning technology ■ Diversification of flux residue components ■ Separation and analysis methods for complex components ■ Future prospects and added value of cleaning *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the challenges of flux cleaning in 5G. It highlights the promising outlook of 5G and introduces "power semiconductors," which are essential for the future world. It includes the characteristics of power semiconductors required under 5G, the importance of the "cleaning process," and efforts to address cleaning challenges. We encourage you to read it. 【Contents (partial)】 ■ Introduction ■ Outlook for 5G ■ Characteristics of power semiconductors required under 5G ■ Importance of the "cleaning process" for power semiconductors ■ Efforts to address cleaning challenges in power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the relationship between sintering bonding and cleaning, as well as the effects of cleaning. It introduces "sintering," which is gaining attention as a new bonding technology in the power semiconductor field. It discusses how sintering bonding and cleaning are related and what effects can be achieved through cleaning. Please take a moment to read it. 【Contents (partial)】 ■ What is "sintering" ■ Methods of sintering bonding ■ Why "sintering" is needed ■ Challenges in sintering bonding ■ An era where new considerations for cleaning methods are necessary *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

This document explains the types and selection methods of cleaning agents and cleaning methods that are important when considering flux cleaning. It includes points to consider when examining flux cleaning methods, as well as discussions on the cleaning and rinsing processes and the drying process, providing a foundational understanding of flux cleaning. This is a useful resource for those who want to switch flux cleaning agents or are looking to start flux cleaning. 【Contents】 ■ What is flux cleaning? ■ Types and selection methods of cleaning agents - Water-based cleaning agents - Solvent-based cleaning agents *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

This document introduces case studies on root cause analysis of quality issues and support for the implementation of cleaning processes. It includes examples of quality troubles where foreign substances adhered to the workpieces after cleaning in the operational process, leading to requests for corrective actions from our customers' clients. Please note that the catalog provided is a sample version. If you would like the complete version, feel free to contact us. [Example of Contents] ■ Customer's Concerns ■ Background ■ Zestron's Support Details *The downloadable PDF document is a sample version. Please contact us if you would like the complete version.

• Cleaning agents

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

This document introduces the key points for reducing organic solvents in the cleaning field and specific case studies of initiatives. It explains the progress of organic solvent reduction, points for substituting organic solvents, and the potential of MPC cleaning agents. Additionally, it includes examples of successful organic solvent substitutions using MPC cleaning agents. We encourage you to read it. 【Contents】 ■ Progress of organic solvent reduction ■ Regulations surrounding organic solvents ■ Points for substituting organic solvents - cost and drying properties - ■ Potential of MPC cleaning agents ■ Examples of organic solvent substitution using MPC cleaning agents ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

We provide a wide range of cleaning process solutions for high-end industries such as aerospace, military, automotive, telecommunications, and medical, where reliability is essential. Additionally, leveraging our unique comprehensive cleaning capabilities, we contribute to the entire electronics manufacturing industry for cleaning applications in SMT and semiconductor packaging products. Through our global network, local process engineers offer comprehensive cleaning support to help you achieve your business goals. 【Solutions】 ■ Cleaning Tests ■ Analytical Services ■ Process Services ■ Zestron Academy *For more details, please refer to the PDF materials or feel free to contact us.

• Cleaning agents

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON EFM" is a hand-wipe cleaning agent that effectively cleans and dries quickly. It significantly reduces the working time for hand-wipe cleaning, with some cases showing a reduction to less than half the time. It is also effective on no-clean solder. It can be used for rework and repair cleaning as well. It is a halogen-free organic solvent that dries quickly and leaves no residue. Furthermore, it is non-corrosive and compatible with most polymers. Please feel free to contact us for inquiries. *For more details, please refer to the PDF document or feel free to reach out to us.

• Cleaning agents

VIGON RC 303 is a spray bottle type water-based flux cleaner designed for non-removable areas (such as the fracas chain, around internal devices like transport claws, inside reflow/flow ovens (walls), and fracas boxes). By switching from a solvent to VIGON RC 303, the maintenance frequency has decreased from once a week to once a month, and the amount of maintenance work has been reduced to one-fourth. Additionally, being water-based, it is non-flammable and not subject to applicable regulations. Please feel free to consult us when needed. 【Features】 ■ High cleaning performance and long lifespan ■ Time-saving as it can be cleaned before the equipment cools down ■ Difficult to volatilize due to being water-based *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

VIGON SC 200 is a room temperature water-based cleaning agent developed for cleaning metal masks. It is suitable for spray and ultrasonic cleaning machines and can also be used for cleaning test print circuit boards. Depending on the type of flux, it can be used on printed circuit boards that have already been soldered on one side due to printing errors. 【Features】 - It can separate and remove flux from the cleaning solution, extending the life of the cleaning solution and reducing costs. - No need to replace the cleaning solution, which simplifies maintenance. - Improved workability and environmental conservation achieved through low odor, low VOC, and environmentally friendly components. - Safe line management due to no flash point. - Excellent cleaning performance at room temperature (25°C). - Superior cleaning ability for Pb-free, halogen-free, and eutectic solders. *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

VIGON SC 202 is a water-based cleaning agent that reliably removes cream solder and SMT bond in metal mask cleaning. It is also excellent for cleaning printed circuit boards with printing errors. It is recommended for use with spray cleaning machines and ultrasonic cleaning machines. 【Features】 ■ Effectively removes resin, adhesives, inks, solder paste, and flux residues ■ No flash point due to being a water-based cleaning agent, no explosion-proof specifications required ■ Can clean and rinse with a single solution ■ Free of surfactants ■ Contains no halogen compounds *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

ATRON SP 300 is a water-based alkaline surfactant developed specifically for removing baked-on flux from reflow furnace components, pallets, and more. 【Features】 ■ Suitable for cleaning adhered flux from pallets and reflow furnace parts ■ Reduction in costs and replacement efforts due to the long lifespan of the liquid, and stabilization of cleaning performance ■ Improvement of the working environment due to low volatility and low odor ■ ATRON SP 300 (diluted product) is non-flammable due to its water-based nature, enhancing work safety ■ Contribution to environmental conservation due to low VOCs *For more details, please refer to the PDF materials or feel free to contact us.

• Chemicals

ATRON SP 200 is a water-based alkaline surfactant cleaning agent developed for the removal of baked-on flux for pallets and flux recovery devices. It is also capable of removing cream solder from metal masks. It is suitable for use with spray, ultrasonic, and air bubbling equipment. 【Features】 ■ Ideal for cleaning adhered flux on pallets and reflow oven components ■ Reduction of costs and replacement efforts due to extended liquid lifespan, stabilization of cleaning performance ■ Improvement of working environment due to low volatility and low odor ■ Non-flammable due to being water-based, enhancing work safety ■ Low VOC content contributes to environmental conservation *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

VIGON RC 303 can remove all types of baked-on flux residues from reflow ovens and solder baths. It effectively removes accumulated flux and emissions from substrates. 【Features】 ■ Excellent cleaning performance ■ Residue-free composition ■ Highly safe water-based cleaner ■ Suitable for cleaning applications in reflow ovens, chains, and conveyor claws ■ Ideal as a substitute for IPA *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

ZESTRON Flux Test indicates the presence of carboxyl groups in flux activators through a color reaction. It allows for easy detection of invisible residues and serves as an important complementary test for ion contamination measurement. Additionally, it can visualize how contamination is distributed, leading to improvements in component reliability assessment. 【Features】 ■ Space-saving ■ No investment costs ■ Usable anywhere in the factory ■ Low cost per test *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

VIGON N 600 is a neutral water-based flux cleaning agent. It has been developed for inline and batch spray, as well as immersion methods. Its neutral pH and excellent cleaning ability allow it to remove a wide variety of flux residues from substrates, making it an unprecedented cleaning agent. Additionally, because it is neutral, this cleaning agent has high material compatibility with metals and polymers that are highly sensitizing. 【Features】 ■ Excellent material compatibility due to neutral pH ■ Superior cleaning ability for various types of flux ■ Flux is expelled from the system via a filter, resulting in a long liquid life ■ Low VOC, environmentally friendly cleaning agent *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

"VIGON UC 160" is a water-based cleaning agent specifically designed for use in printing machines to remove cream solder that adheres to the backside of metal masks. It demonstrates stable cleaning performance due to appropriate wettability, contributing to the stabilization of the printing condition and the suppression of various printing defects. Furthermore, it excels in safety and is suitable as a replacement for IPA. We are providing samples to confirm the cleaning ability and usability of this product. Please feel free to contact us. 【Features】 ■ Excellent cleaning ability + cleaning design that minimizes the impact on solder formation even if residues remain ■ High safety water-based cleaning agent (IPA alternative) ■ Optimized wettability, reducing the consumption of cleaning solution and paper *For more details, please download the PDF or feel free to contact us.

• Chemicals

ZESTRON VD is a solvent-based cleaning agent. It can remove flux residues from electronic components, ceramic composite substrates, and lead frame-based discretes in a closed-system single-chamber vacuum cleaning machine. 【Features】 ■ Excellent cleaning performance for a wide variety of solvent-based fluxes ■ Distillation regeneration is possible, compatible with single-chamber vacuum distillation and steam rinse processes ■ Immersion cleaning and rinsing can be performed with a single solution ■ Free of surfactants ■ Contains no halogen compounds such as chlorine, fluorine, or bromine *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

ZESTRON FA+ is a solvent-based cleaner developed to wash away all types of flux residues from electronic components, ceramic composite substrates, power modules, and lead frames. It features excellent cleaning performance and a high contamination tolerance, resulting in an exceptionally long liquid lifespan. 【Features】 ■ Excellent cleaning power and long cleaning liquid lifespan ■ Halogen-free and biodegradable ■ Improves the quality of wire bonding/molding for power modules, lead frame-based discretes, and power LEDs ■ Achieves void-free underfill by completely removing sticky flux from flip chips and CMOS, enhancing image resolution *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals

VIGON US is a water-based cleaning agent specifically designed for ultrasonic, spray, and centrifugal cleaning devices. It removes all types of flux residues from electronic substrates, flip chips, and CMOS. 【Features】 - Excellent flux cleaning performance with ultrasonic and spray methods - Low VOC and environmentally friendly due to being water-based - Proven performance in cleaning flip chips and BGAs - Long-lasting cleaning solution due to effective flux separation and removal - No flash point, ensuring high operational safety *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals