ゼストロンジャパン Product Lineup

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 190A" is a water-based alkaline cleaner specifically designed for spray equipment. Based on MPC technology, it reliably removes flux residues from lead frames, discrete components, power modules, power LEDs, printed circuit boards, and especially from low stand components from below. It also demonstrates excellent effectiveness on severely oxidized or heavily soiled copper surfaces, ensuring superior material compatibility in subsequent processes such as wire bonding, adhesive bonding, and molding. 【Features】 ■ Reliably removes flux residues ■ Prepares copper surfaces in a clean state, activating them for bonding connections ■ Maintains an activated copper surface for an extended period without re-oxidation ■ Particularly excellent material compatibility with dies, without damaging passivation ■ Excellent rinsing properties, does not foam *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 305N" is a neutral aqueous cleaning agent (MPC) developed for power electronics. It effectively removes flux residues from high-reliability, high-temperature solder pastes and excels in removing copper oxide films. It is suitable for cleaning power modules after soldering (such as die attach and heat sink soldering). 【Features】 ■ Excellent effectiveness in flux removal ■ Suitable for cleaning after sintering ■ Activates copper surfaces without staining ■ Well-suited for use in complex power module manufacturing ■ Does not affect passivation ■ Does not require explosion-proof equipment due to having no flash point *For more details, please refer to the PDF materials or feel free to contact us.

ZESTRON FA+ is a solvent-based cleaner developed to wash away all types of flux residues from electronic components, ceramic composite substrates, power modules, and lead frames. It features excellent cleaning performance and a high contamination tolerance, resulting in an exceptionally long liquid lifespan. 【Features】 ■ Excellent cleaning power and long cleaning liquid lifespan ■ Halogen-free and biodegradable ■ Improves the quality of wire bonding/molding for power modules, lead frame-based discretes, and power LEDs ■ Achieves void-free underfill by completely removing sticky flux from flip chips and CMOS, enhancing image resolution *For more details, please refer to the PDF document or feel free to contact us.

ZESTRON VD is a solvent-based cleaning agent. It can remove flux residues from electronic components, ceramic composite substrates, and lead frame-based discretes in a closed-system single-chamber vacuum cleaning machine. 【Features】 ■ Excellent cleaning performance for a wide variety of solvent-based fluxes ■ Distillation regeneration is possible, compatible with single-chamber vacuum distillation and steam rinse processes ■ Immersion cleaning and rinsing can be performed with a single solution ■ Free of surfactants ■ Contains no halogen compounds such as chlorine, fluorine, or bromine *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Cleaning Test" conducted by Zestron Japan Co., Ltd. From our technical center, you can choose a device that meets your requirements from our inline and batch-type spray, jet, and ultrasonic equipment, and try cleaning workpieces under conditions equivalent to those in a production environment using spray or immersion processes (ultrasonic or jet). Our engineers will propose suitable cleaning equipment, and while conducting the cleaning test, we will analyze the cleanliness at our analysis center. 【Test Flow (Partial)】 ■1. Hearing ■2. Cleaning Test ■3. Cleanliness Analysis ■4. Report Submission *The PDF document is a company brochure.

As electronic devices become more advanced and compact, the importance of fine solder paste in high-reliability fields such as power semiconductors, automotive, and industrial equipment is increasing. However, the growing demand for reduced electrode spacing, fine pitch, and low stand-off mounting has brought to light the risks associated with flux residue after soldering, which previously did not pose a problem, affecting insulation reliability and the quality of subsequent processes. For these reasons, there is an increasing number of situations where a decision must be made regarding whether or not to perform flux cleaning from the perspective of ensuring reliability, making the cleaning of high-performance solder paste and flux a new challenge. In this study, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine bonding" developed by the company, examining the cleaning characteristics in fine bonding and verifying the usefulness of evaluation through FT-IR and SEM-EDS based on chemical analysis. *For detailed content of the article, please refer to the related link. For more information, feel free to download the PDF or contact us directly.*

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean soldering technology, sintering bonding is fundamentally designed for "no-clean" processes. However, the currently mainstream sintering bonding methods are performed under high temperature and high pressure conditions, which can lead to residues generated and adhered during the bonding process that may affect subsequent processes and long-term reliability. Cleaning is one potential solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

We would like to introduce the "Flux Cleaning Agent" that we handle. This water-based cleaning agent selectively removes flux residues and supports the quality and reliability of electronic devices. While general solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, our product simultaneously exhibits two actions: peeling and dissolving, thanks to its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent *For more details, please download the PDF or feel free to contact us.