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This document explains the definition of water-based cleaning agents and the technical challenges of solvent-based cleaning agents. From the perspective of the technical trends in solder and flux, it focuses on "ionic residues" and introduces the technical relevance to "water-based cleaning agents." This technical document is recommended for those who want to learn about water-based cleaning agents or the recent compositions of solder and flux. [Contents (partial)] ■ Introduction ■ Challenges during cleaning from the perspective of solder and flux composition ■ Why can water-based cleaning agents be considered effective for removing ionic residues? ■ Examples of cleaning agent classifications - Issues in Japan ■ Effects of moisture content differences and technical challenges *For more details, please refer to the PDF document or feel free to contact us.

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

This document explains the cleaning and post-cleaning analysis methods for advanced electronic components. Focusing on the contamination cleaning after joining, led by the flux cleaning process, it discusses the nature of "cleaning" that can ensure the performance of advanced electronic components, which are a collection of various technologies, as well as future prospects. Please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ The role of no-clean technology in enhancing functionality ■ Why cases requiring cleaning can occur ■ The challenges of cleaning advanced electronic components ■ Post-cleaning analysis *For more details, please refer to the PDF document or feel free to contact us.

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the key points for reducing organic solvents in the cleaning field and specific case studies of initiatives. It explains the progress of organic solvent reduction, points for substituting organic solvents, and the potential of MPC cleaning agents. Additionally, it includes examples of successful organic solvent substitutions using MPC cleaning agents. We encourage you to read it. 【Contents】 ■ Progress of organic solvent reduction ■ Regulations surrounding organic solvents ■ Points for substituting organic solvents - cost and drying properties - ■ Potential of MPC cleaning agents ■ Examples of organic solvent substitution using MPC cleaning agents ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

This document introduces case studies on root cause analysis of quality issues and support for the implementation of cleaning processes. It includes examples of quality troubles where foreign substances adhered to the workpieces after cleaning in the operational process, leading to requests for corrective actions from our customers' clients. Please note that the catalog provided is a sample version. If you would like the complete version, feel free to contact us. [Example of Contents] ■ Customer's Concerns ■ Background ■ Zestron's Support Details *The downloadable PDF document is a sample version. Please contact us if you would like the complete version.

This document explains the relationship between sintering bonding and cleaning, as well as the effects of cleaning. It introduces "sintering," which is gaining attention as a new bonding technology in the power semiconductor field. It discusses how sintering bonding and cleaning are related and what effects can be achieved through cleaning. Please take a moment to read it. 【Contents (partial)】 ■ What is "sintering" ■ Methods of sintering bonding ■ Why "sintering" is needed ■ Challenges in sintering bonding ■ An era where new considerations for cleaning methods are necessary *For more details, please refer to the PDF document or feel free to contact us.

This document explains the challenges of flux cleaning in 5G. It highlights the promising outlook of 5G and introduces "power semiconductors," which are essential for the future world. It includes the characteristics of power semiconductors required under 5G, the importance of the "cleaning process," and efforts to address cleaning challenges. We encourage you to read it. 【Contents (partial)】 ■ Introduction ■ Outlook for 5G ■ Characteristics of power semiconductors required under 5G ■ Importance of the "cleaning process" for power semiconductors ■ Efforts to address cleaning challenges in power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

This document explains the evaluation methods for cleanliness after flux cleaning. As for existing mainstream evaluation methods, after passing reliability assessments, actual manufacturing processes determine product defects through appearance inspections using AOI. However, there is a growing trend of defects occurring after product inspections. We introduce the factors contributing to such occurrences and effective analytical methods other than appearance inspections, so please take a moment to read through it. [Contents] ■ An era where post-cleaning evaluation is questioned, just like cleaning technology ■ Diversification of flux residue components ■ Separation and analysis methods for complex components ■ Future prospects and added value of cleaning *For more details, please refer to the PDF document or feel free to contact us.

This document explains how to choose flux cleaning agents. It provides specific examples of key points to consider when selecting a flux cleaning agent and highlights the aspects to focus on. It also includes important considerations for water-based cleaning agents, such as controlling evaporation loss and variations in water content, as well as examples of non-cleaning type flux cleaning cases, so please take a moment to read it. [Contents (partial)] ■ Key points when choosing flux cleaning agents ■ Types of flux cleaning agents ■ Important considerations when examining water-based cleaning agents ■ Examples of non-cleaning type flux cleaning *For more details, please refer to the PDF document or feel free to contact us.

This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. We encourage you to download it and read through it. 【Contents】 ■ Introduction ■ What are ionic residues? ■ Analysis of ionic residues remaining on electronic substrates ■ Case study - Cleaning efficacy of surfactants - ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

This document provides a detailed explanation of evaluation methods and added value in flux cleaning. It introduces "cleanliness analysis in flux cleaning," as well as "substances to be analyzed," "the impact of residual organic matter," and "the pathways and effects of ion contamination." Additionally, it includes an introduction to Zestron and examples of analytical methods. We encourage you to read it. 【Contents (partial)】 ■ Introduction to Zestron ■ Cleanliness analysis in flux cleaning ■ Substances to be analyzed (flux residues) ■ Substances to be analyzed (residues during sintering) ■ Impact of residual organic matter *For more details, please download the PDF or feel free to contact us.

This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it. 【Contents】 ■ Introduction ■ The formation of contamination and the effects of residues in sintered joining devices ■ Selection of cleaning agents and methods ■ Cleanliness analysis after cleaning ■ Cleaning case studies ■ Conclusion *For more details, please download the PDF or feel free to contact us.

This document explains the types and selection methods of cleaning agents and cleaning methods that are important when considering flux cleaning. It includes points to consider when examining flux cleaning methods, as well as discussions on the cleaning and rinsing processes and the drying process, providing a foundational understanding of flux cleaning. This is a useful resource for those who want to switch flux cleaning agents or are looking to start flux cleaning. 【Contents】 ■ What is flux cleaning? ■ Types and selection methods of cleaning agents - Water-based cleaning agents - Solvent-based cleaning agents *For more details, please refer to the PDF document or feel free to contact us.

This document explains the requirements for electronic devices to achieve the SDGs and how cleaning of electronic devices should be approached from the perspective of the SDGs. It is recommended for those who are concerned about wanting to achieve "cleaning that balances low-risk performance and cleaning performance" or wanting to know "the cleaning technologies required for electronic devices." We have included content on "Cleaning of electronic devices and the SDGs" and "The need for low-risk cleaning agents for electronic devices," so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Cleaning of electronic devices and the SDGs ■ The need for low-risk cleaning agents for electronic devices ■ Cleaning performance required for electronic device cleaning agents ■ "Chemical analysis" to ensure more reliable cleaning *For more details, please refer to the PDF document or feel free to contact us.

This document explains the key points for considering "flux cleaning methods," as well as the examination of "cleaning and rinsing processes," "drying processes," and the evaluation (analysis) of residues. It is recommended for those who want to start flux cleaning and for those who wish to gain a comprehensive understanding from cleaning to analysis. 【Contents (partial)】 ■ What is flux cleaning? ■ The purpose of flux cleaning and the fields where cleaning is required ■ Types of flux cleaning agents/methods and selection methods ■ The importance and methods of residue evaluation (analysis), etc. *For more details, please refer to the PDF document or feel free to contact us.

We are conducting a "360° Virtual Tour" where you can see the site of our cleaning process development, which brings together our achievements and know-how. We will introduce our Technical Center, which "creates" appropriate cleaning processes, and our Analysis Center, which performs "visualization" down to fine residues. After filling out the form available at the related link, we will send you a limited link for viewing. 【Features】 ■ Technical Center - We offer a wide range of cleaning equipment (spray, ultrasonic, immersion, batch, inline, etc.), and our team of specialized engineers will suggest the appropriate combination of equipment and cleaning solutions through cleaning tests. *For more details, please download the PDF or feel free to contact us.

This document systematically organizes the mechanisms behind the deterioration of insulation properties and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. It examines the technical background of why the fundamental aspects of "ensuring insulation" and "resin bonding strength," which should have already been technically resolved, have become issues once again. If you wish to learn about the concepts of surface design to prevent silent kill, please take a moment to read this. 【Contents (partial)】 ■ Introduction ■ A New Frontier in Insulation ■ Technical Challenges Due to High-Functionality Materials ■ Objectives and Effects of Resin Sealing *For more details, please download the PDF or feel free to contact us.

Our company conducts residue analysis to examine contaminants such as flux and sinter. We support the identification of defect causes and the resolution of quality issues in the manufacturing process through our expertise in flux cleaning, analysis, and know-how. We also conduct defect cause investigations to isolate the causes of issues such as assembly defects, as well as cleanliness evaluations to check the cleanliness and residue levels on circuit board surfaces. 【Features】 ■ Residue analysis to identify the presence and type of substances adhered to surfaces ■ Defect cause investigations analyzing foreign substances and causes using analytical equipment and expertise ■ Cleanliness evaluations for process management through regular analysis ■ Proposals for countermeasures and improvements in addition to analysis results ■ Cleanliness analysis is also possible for flux cleaning agents and circuit boards from other manufacturers ■ Cleanliness verification methods compliant with ISO 9455-18:2024 *For more details, please download the PDF or feel free to contact us.

This document explains the basic knowledge of analysis. It details why "analysis" is important now, the residues that are the subject of analysis, and examples of issues caused by these residues. Additionally, it introduces analytical methods such as visual observation, micro-particle analysis, and organic residue analysis. We encourage you to read it. [Contents] ■ Why is analysis necessary after cleaning? ■ ISO standards [ISO 9455-18: 2024] and analytical methods ■ Zestron's analysis services *For more details, please download the PDF or feel free to contact us.

Defects in the circuit board are a serious issue that greatly undermines reliability. In this article, we will discuss 10 common defects that can occur in circuit boards, including issues arising from soldering and assembly processes, as well as defects caused by chemical factors. We will explain the technical background, judgment methods, and countermeasures from the perspective of cleaning. *For detailed content of the column, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*