ゼストロンジャパン Product Lineup

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

"HYDRON SE 230A" is a one-phase type water-based cleaning agent for immersion processes. It reliably removes flux residues generated during die attach from various semiconductors such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Additionally, it excels in removing oxide films from copper substrates in post-processes such as wire bonding and molding. 【Features】 ■ Activates copper substrates without staining and maintains the activated surface for a certain period ■ Excellent material compatibility with highly sensitive materials ■ Superior flux removal after wafer bump formation ■ Easy process management due to its one-phase structure, demonstrating excellent performance in immersion processes ■ Good rinsing properties with ion-exchanged water, leaving no residues *For more details, please refer to the PDF document or feel free to contact us.

ZESTRON FA+ is a solvent-based cleaner developed to wash away all types of flux residues from electronic components, ceramic composite substrates, power modules, and lead frames. It features excellent cleaning performance and a high contamination tolerance, resulting in an exceptionally long liquid lifespan. 【Features】 ■ Excellent cleaning power and long cleaning liquid lifespan ■ Halogen-free and biodegradable ■ Improves the quality of wire bonding/molding for power modules, lead frame-based discretes, and power LEDs ■ Achieves void-free underfill by completely removing sticky flux from flip chips and CMOS, enhancing image resolution *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Cleaning Test" conducted by Zestron Japan Co., Ltd. From our technical center, you can choose a device that meets your requirements from our inline and batch-type spray, jet, and ultrasonic equipment, and try cleaning workpieces under conditions equivalent to those in a production environment using spray or immersion processes (ultrasonic or jet). Our engineers will propose suitable cleaning equipment, and while conducting the cleaning test, we will analyze the cleanliness at our analysis center. 【Test Flow (Partial)】 ■1. Hearing ■2. Cleaning Test ■3. Cleanliness Analysis ■4. Report Submission *The PDF document is a company brochure.