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This is a unit that visualizes fine irregularities, scratches, and distortions on the wafer surfaces of materials like Si, SiC, and GaN, which are difficult to detect with the naked eye or under a microscope. It employs Sumix's unique "off-axis optical system" to sensitively detect changes in light reflection (edge reflected light) due to the angle of the surface. 【Defects that can be visualized】 ■ Nano-level surface irregularities and crystal defects ■ Slurry residues and fine scratches ■ Chipping and cracking after dicing It allows for a quick grasp of wide-area "inconsistencies" that are often overlooked in sampling inspections with a microscope, presented as macro images. This helps to eliminate bottlenecks in the inspection process and dramatically improves the accuracy of quality control. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual device. The first sample evaluation will be provided free of charge.

Smix Corporation is a specialized manufacturer of "macro optical inspection" that brings innovation to the inspection processes in the semiconductor industry. We break the industry's common belief that "increasing resolution narrows the field of view and requires longer inspection times" with our unique optical systems and in-house developed line sensor cameras. We have achieved ultra-fast inspection, capturing 12-inch wafers in just 7 seconds, which is four times faster than the industry standard. 【Provided Solutions】 ■ "Dark field optical system" that captures 0.1μm foreign particles on wafers ■ "Off-axis optical system" that visualizes nano-level surface distortions ■ "Measurement correlation technology" that quantifies changes in film thickness and pattern size We offer these advanced optical technologies as "inspection modules" to contribute to the competitiveness of semiconductor and equipment manufacturers. *For more details, please refer to our catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual equipment. The first sample evaluation will be provided free of charge.

In the semiconductor industry, the detection of fine defects on wafer surfaces is a crucial factor that influences product reliability. Nano-level irregularities and scratches, which are often overlooked in visual or microscopic inspections, can lead to reduced yield and product defects. This unit captures these fine defects over a wide area using off-axis optical systems and edge reflection light detection, contributing to the efficiency of the inspection process and improving the accuracy of quality control. 【Usage Scenarios】 - Quality inspection of wafer surfaces - Early detection of abnormalities in the manufacturing process - Inspection tasks in quality control departments 【Benefits of Implementation】 - Reduction in inspection time - Decrease in defective products - Reduction in quality control costs