セムテックエンジニアリング List of Products and Services

■ Increase the product quality assurance level from PPM (1/1,000,000) to PPB (1/1,000,000,000) for the contamination rate of coarse particles in product particles. ■ These particles are used in spacers for liquid crystal panels and in anisotropic conductive films (ACF) for high-density circuit connections in liquid crystal panels. ■ Samples were prepared to confirm classification accuracy. These particles exhibited good sphericity and extremely low particle size variation, so a small amount of coarse particles was added. Next, a super micro sieve (screen/filter) with a cut line of Φ5μm was used, and the images obtained during classification were analyzed with the FPIA-3000. ■ Contract Services Semtech Engineering offers contract classification services (for a fee). 1. Contract classification using wet classification equipment S-100W-D with solvent... distilled water. 2. Particle image analysis using FPIA-3000.

• Sieve/Shaker

■ Main Causes of Coarse Particle Contamination - Contamination from coarse particles or agglomerates of the same material from the classification device - Contamination from coarse particles of different materials around the classification device - Contamination from unspecified locations in the manufacturing process by coarse particles and dust ■ Innovative Technology Development 1. Super Micro Sieve 2. Classification Structure Based on Original Principles 3. Know-how for Fine Particle Classification ■ Photo Right: Ultrasonic Tank - This part is equipped with the Super Micro Sieve Photo Left: Desiccator - This part collects the classified particles Ultrasonic Tank: Image analysis of particles before classification using FPIA-3000 Desiccator: Image analysis of particles after classification using FPIA-3000

• Other mounting machines

■ Feature 1: High Reliability "Sieve" ≪Super Micro Sieve≫ Development Equipped with a robust sieve; the hole diameter of the sieve can be freely designed. ■ Feature 2: Developed an Original Classification Principle for High Precision and High-Speed Classification Product particle recovery rate of over 95%; small-scale classification is also possible. ■ Feature 3: Established Innovative Classification Know-How (Details Not Disclosed) Complete removal of coarse particles at the "individual level." Special Note ■ We accommodate small-scale contract classification (for a fee). Classification device: Wet classification device S-100W-D; Solvent: Distilled water. However, we do not accept contracts using solvents for safety reasons.

• Other mounting machines

■ By using this technology, it is possible to manufacture 'ultra-high reliability sieves' with high precision, high aperture ratio, and high strength, similar to SEM images. ■ When producing particles called functional particles with a diameter of less than Φ5μm, it is used to remove trace amounts of coarse particles at the individual level. ■ Example 1: Liquid crystal panel spacers made of plastic particles Example 2: Liquid crystal panel anisotropic conductive film (ACF particles) Application Example 3: Battery sealing materials, IC package sealing materials Application Example 4: Development of applications for functional particles, quality control in particle manufacturing processes, etc. ■ Minimum hole diameter: Φ5μm, pitch: 15μm (sieves can be manufactured from Φ5 to 50μm) ■ Thickness: 50 to 100μm ■ Material: Nickel, hardness HV 500 to 600, very durable

• Other mounting machines

■ Semtech Engineering's "Super Micro Sieve" is used for "classification" when manufacturing "ultra-high reliability particles" to completely remove trace amounts of coarse particles mixed in the product. ■ The central sieve is made using a similar method, but generally has a thinner plate thickness, so care must be taken to avoid damage during use and to prevent hole diameter enlargement when classifying hard materials. ■ Wire mesh sieves are not suitable for applications requiring high classification accuracy, but they are strong and are commonly used for the production of large sieves. (Note) High-precision sieves are referred to as "Super Micro Sieves," but sieves made using the same manufacturing method may also be called "electroformed sieves."

• Other mounting machines

■ The photo in the center shows the dent created when the tip of a flathead screwdriver was dropped from 7 cm above the screen. The "Super Micro Sieve" is a sieve that withstands even formidable damage. ■ The photo on the right shows the condition of a hole that was damaged during use in a typical sieve. "Coarse particles mix into the product from the damaged area." ■ The aspect ratio serves as a guideline for evaluating the technical level of sieves. 1. Our company: Plate thickness (50) ÷ Hole diameter (5) = Aspect ratio 10, high strength. 2. Competitor: Plate thickness (10) ÷ Hole diameter (5) = Aspect ratio 2, thin, risk of damage. Challenge ■ Currently developing Super Micro Sieves with even smaller hole diameters of Φ1 and Φ3. ■ While we anticipate technical challenges, innovative ideas often arise from difficult problems.

• Other mounting machines

■ Since the damage to the sieve has a significant impact on product reliability, we verify quality through rigorous testing. ■ Verification Item 1: Hole diameter accuracy - Is there any dent caused by small impacts? ■ Verification Item 2: Opening ratio - Is there any enlargement of holes due to small impacts? ■ Verification Item 3: Sieve strength - Does the sieve break under small impacts? Special Note ■ The images in the photos were also presented at the "Powder Industry Exhibition." The sieve strength tests can also be viewed in a [video].

• Other mounting machines

■ Coarse particles mixed in unclassified particles are not displayed in the particle size distribution. Even trace amounts of coarse particles are "completely removed" with S-100W-D. ■ This technology includes: Original technology - Super Micro Sieve, Original technology - Wet classification device based on original principles, Classification technology - Know-how for fine particle classification. These technologies are used for classification. ■ Bottom left: The trace amounts of coarse particles mixed in the product "before classification" have been completely removed through classification, significantly improving the reliability of the product. ■ Bottom right: "After classification," the trace amounts of coarse particles, deformed particles, and agglomerated particles that were not displayed in the particle size distribution are completely captured on the sieve at the "count level."

• Other mounting machines

■ Preparation of image analysis samples: This sample uses spherical acrylic particles with a distribution center of 4 μm (ellipsoidal particles have poor accuracy). ■ To confirm the accuracy of the classification device, acrylic particles around Φ7 μm were added as trace experimental particles for classification accuracy verification. ■ The particle diameter used in the classification experiment is assumed to be 'coarse particles' if it is 5 μm or larger. The diameter of the mixed particles was analyzed using the FPIA-3000 device. ■ FPIA-3000 image analysis results: Confirmed coarse particles with a maximum diameter of 7.5 μm. Particles larger than 5 μm were confirmed at a mixing ratio of 8 out of 18,500 particles.

• Other mounting machines

■ Distribution of experimental particles: The cutoff line for coarse particles is set to 5μm due to the 4μm size. A super micro sieve with a diameter of 5.0μm is installed for classification. ■ FPIA-3000 image analysis results: Number of measurements... 0 / 148,000. Maximum particle diameter: 4.27μm. No coarse particles larger than 5μm are present at all. ■ Normally, the image analysis of pass products after classification is conducted with a target measurement count of 200,000 to 300,000 particles × 10 times to verify the reliability of classification accuracy.

• Other mounting machines

■ Understanding the minute amount of "hidden coarse particles" that is not displayed in the particle size distribution is extremely important in particle manufacturing. ■ "Hidden coarse particles" are expected to be contaminated from the following sources: - Contamination from coarse particles or agglomerates of the same material from the classification device - Contamination from coarse particles of different materials around the classification device, affecting process management - Contamination from dust or other materials from unspecified locations in the manufacturing process ■ Installation of a Φ5μm super micro sieve for analysis of on-spec products after classification shows that coarse particles are certainly captured at the particle count level. If high-precision classification is not performed, there is a possibility that coarse particles, as shown in the upper section of the attached document, are mixed into the product. The maximum coarse particle size is φ10.8μm.

• Other mounting machines

- The classification process to ensure uniform particle size has a decisive impact on product quality due to the "quality of the sieve." - Major companies that monopolize the global market for functional particles have been using the "high-reliability super micro sieve" since 2008 to the present. - The attached document contains photos of the results of classifying coarse particles mixed in the sample particles using the wet classification device S-150W. A "trace amount of coarse particles that do not appear in the particle size distribution has been completely removed."

• Other mounting machines

- Functional particles that are essential for high image quality in imaging devices. The first application is as spacers to maintain a uniform gap between two glass substrates. Particles with a diameter of less than 10 μm are used. - By making the gap between the glass substrates narrower and more uniform, "image quality and responsiveness are dramatically improved." - If even one large particle is mixed in, the gap between the glass substrates will widen, causing "color unevenness" in that area. Therefore, "the presence of coarse particles is not allowed, even at a rate of one in ten billion."

• Other mounting machines

- Anisotropic conductive particles with a gold plating on the surface of resin, which is essential for high image quality in imaging devices. - The second application is used for connecting numerous circuits and IC chips provided on a glass substrate. - By applying double-sided tape containing anisotropic conductive particles to the circuit portion of the glass substrate, placing the IC chip on it, and pressing the terminal parts of the IC with a jig, it is possible to connect thousands of terminals in a short time. - Similar to spacer particles, "the presence of coarse particles is not allowed even at a ratio of one in ten billion."

• Other mounting machines