ティー・ケイ・エス List of Products and Services

We handle the 'Star.500-EOSS(R)' from the German company FHR. The 'Star.500-EOSS(R)' is a magnetron sputtering system designed for optical filter film deposition. To minimize particles during film deposition, a sputter-up method is employed. It accommodates flat and curved substrates up to 200mm in diameter, and a substrate heating mechanism can also be integrated. 【Features and Benefits】 ■ Outstanding reproducibility of optical multilayer films ■ Excellent film thickness uniformity ■ Improvement in film quality and defect-free deposition achieved through the combination of a cylindrical sputter cathode and sputter-up ■ Long target life and minimized variations in deposition rate due to cylindrical targets ■ Fully automated process control *For more details, please download the PDF or contact us.

We will demonstrate our capabilities in the stable production of high-performance optical filters that require multilayering and high reproducibility, such as LiDAR applications, which are expected to see significant demand in the future. - Film formation that eliminates the effects of film quality changes due to target wear using a cylindrical cathode - Stable film formation of oxide films using a reactive ion source - Film formation of a wide range of multilayer films with up to four cathodes This is a device specialized for high-quality optical thin film deposition. Features: ■ Outstanding reproducibility of optical multilayer films ■ Excellent film thickness uniformity ■ Improvement of film quality and defect-free deposition through the combination of cylindrical cathodes and sputter-up ■ Continuous monitoring of the film formation state through in-situ monitoring ■ Fully automated process control *For more details, please refer to the PDF document or feel free to contact us.

The "DSU Series" is a sublimation purification device for high-purity organic materials developed based on "QUANTIpure Technology," which was created from accumulated process data in organic electronics research. It achieves both high yield and ultra-high purity through a unique purification system born from the redefinition of the sublimation purification process. Once the raw materials are loaded, the entire operation is controlled automatically, and no operator intervention is required until the purification is complete. We offer models that can handle not only small-scale purification of 5g but also large-scale purification of 10kg. All background tasks, such as preparation for operation and product recovery, can be completed by a single operator. 【Features】 ■ Wide range of needs from development to mass production ■ Temperature and pressure control through auto process control ■ Purification from 5g suitable for experiments and development to 10kg/run for mass production ■ Purity of 99.99% and yield of 98% (after the second purification) ■ Space-saving vertical design for installation ■ All tasks can be completed by one operator * You can view the product documentation (in English) via "PDF Download." Please feel free to contact us with any inquiries. * Related product videos can also be viewed at the bottom of this screen.

The "FHR.STAR-400x300SALD" is a high-speed deposition ALD (Spatial ALD) system designed for film deposition on substrates and textiles ranging from 200mm wafers to 400x300mm. It enables uniform film deposition on three-dimensional shapes up to 10mm thick for 400x300 substrates. Due to its faster deposition compared to conventional thermal ALD methods, it can be used for mass production of devices and is designed to accommodate in-situ ellipsometers and transmission spectrometers, allowing for more precise process control. With a cluster-compatible design, it can integrate transport chambers, load locks, and other process chambers as needed. We also offer equipment compatible with small-diameter wafers, so please inquire for more information. 【Features】 ■ Uniform film deposition on three-dimensional shapes up to 10mm thick (for 400x300 substrates) ■ Faster deposition compared to conventional thermal ALD methods ■ Usable for mass production of devices *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

Achieving both stable film formation and cost reduction. This is a high-performance, high-quality "Magnetron Sputter Cathode" manufactured by American Angstrom Science. By adopting the patented Shaped Magnet technology, it utilizes a wide area of the target, making it less likely for changes in the sputtering state due to erosion to occur, thus achieving stable film formation and cost reduction for target replacement. 【Features】 ■ Shaped Magnet high-efficiency technology cathode: Achieves high film formation efficiency and stability ■ Reusable targets: Allows for the reuse of your existing targets, reducing costs ■ Balancing stable film formation and cost reduction: Minimal changes in sputtering state due to erosion, reducing target replacement costs ■ Compatible with existing sputtering equipment from various manufacturers: Can be adapted to other companies' equipment ■ High vacuum compatible: Usable in high vacuum environments suitable for a wide range of applications ■ Compatible with target sizes from φ1 inch to φ12 inches: Flexible selection of target sizes ■ Abundant optional features: Various options available, including shutters and tilt angles *For more details, please refer to the PDF document or feel free to contact us.

The ion beam etching equipment manufactured by AVP Technology is a production device equipped with an ICP ion source, offering high uniformity, high etching rates, and excellent operational reproducibility and stability. Compared to other companies' IBE devices, it achieves stable operation, which is essential for manufacturing facilities, through its superior control system. The latest drive mechanism minimizes latency time, thereby improving productivity.

This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.

Independent current control is performed for the ion source, target, and substrate. With independent control, not only the sputter rate but also various reactive sputtering processes such as oxide and nitride films can be freely controlled. This device strongly supports advanced material research and process development, enabling the deposition of difficult-to-deposit materials such as ferromagnetic films, Co-sputtering of metal and ceramic targets, and dielectric/insulating films from metal targets. Independent control of ion supply and sputter rate → Control of sputter rate, film quality, and crystal structure → Control of ionization rate of target materials High-directionality film deposition → High-directionality film deposition characteristic of ion beam sputtering Multi-target mechanism → Wide-ranging multilayer film deposition Independent control of multiple targets → Co-sputtering alloy deposition by controlling the sputter rate of each target → Multilayer deposition by switching targets Conformal film deposition through bias application control to the substrate → Conformal film deposition even under adverse conditions such as deep trenches and overhangs.

PlasmaQuest is a reputable company with a 25-year history in the development and sales of helicon-type high-density ion sources and related application products. The gridless helicon plasma source generates high-density plasma and continues to provide OEM supply to many equipment manufacturers. Utilizing this high-quality plasma source as an ion source, the groundbreaking "HiTUS" system applies bias to the target, enabling sputtering under various conditions and with different targets. It allows for sputtering of high magnetic targets and high dielectric targets, which are considered difficult with conventional magnetron sputtering devices, as well as co-sputtering using heterogeneous targets such as metals and ceramics, making it suitable for a wide range of applications. The company is equipped to flexibly respond to both research applications and production-scale equipment.

HiTUS Technology Independent current control is performed for the ion source, target, and substrate. With independent control, it becomes possible to freely control not only the sputter rate but also various reactive sputtering processes such as oxide films and nitride films. We strongly support advanced materials research and process development for applications that have been considered difficult with conventional sputtering equipment, such as ferromagnetic film deposition, co-sputtering of metal and ceramic targets, and dielectric/insulating film deposition from metal targets.

-TKS's Equipment Lifespan Extension Service- Many devices used in domestic semiconductor and electronic device manufacturing have been in operation for over 20 years since their introduction, and many essential devices are still in operation. However, it is not uncommon for modules and parts used in these devices to have already been discontinued. By using current products for the repair and regeneration of worn, degraded, or broken modules, we contribute to the stable operation of the equipment. Additionally, please consult us about domestic production of parts aimed at stable supply and cost reduction. -Extension of Lifespan through Servo Motor and Driver Replacement- Many servo motors are used in operating equipment, but the motor drivers and motors are updated and discontinued every few years even while the equipment is in operation. If a motor driver or motor used in long-operating equipment fails, the only options until now have been to search for used parts or repair them. In such cases, if "no used parts are available!" or "repair is not possible!", the options may be limited to using the equipment within a feasible range or ceasing operation and purchasing new equipment. Our company has sought solutions to such problems and has achieved results.

By using a helicon plasma source as the ion source, this groundbreaking method accelerates high-density ions obtained from it by applying a bias voltage to the target, achieving high-rate and highly directional film deposition. Independent current control for the ion source, target, and substrate allows for precise control of not only the sputtering rate but also various reactive sputtering processes such as oxide and nitride films. It enables high-rate film deposition of materials that are difficult to deposit with conventional equipment, such as ferromagnetic materials and dielectric/insulating films from metal targets. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieves both high-speed sputtering and low contamination Reduces running costs by improving target utilization efficiency Low maintenance due to gridless structure Sputtering while keeping the substrate at low temperatures through remote plasma configuration ■ Single wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality High-directionality ion beams enable uniform film thickness deposition, resulting in excellent step coverage in film formation.