アズサイエンス List of Products and Services

Japan Electronics Co., Ltd. IB-19530CP Cross-Section Polisher Sample Preparation Device has adopted a multi-purpose stage to meet the diversifying market needs, achieving multifunctionality by exchanging various functional holders. By selecting functional holders according to the application, it can expand its capabilities not only for cross-section milling but also for planar milling, ion beam sputter coating, and more. 〇Features - Automatic processing program - Multi-purpose stage *For more details, please download the PDF or feel free to contact us.

Nihon Denshi Co., Ltd. has developed the "IB-10500HMS High Throughput Milling System," which incorporates a newly developed ion source into the cross-section sample preparation device cross-section polisher "IB-19530CP, IB-19520CCP." With the installation of HMS, a cross-section milling rate of 1.2mm/h has been achieved (2.4 times compared to conventional models). *Options for IB-1530CP, IB-1520CCP 〇Features - High throughput processing - Wide area planar milling *For more details, please download the PDF or feel free to contact us.

This is a device for measuring the peeling strength and shear strength of bonded materials. By moving the cutting edge at a speed of um/sec, it enables not only the measurement of physical properties such as shear strength but also groundbreaking observations of the state near the interface of dissimilar materials, analysis of dispersion states such as uniformity and non-uniformity through the observation of cutting surfaces in the depth direction of coatings and mixed materials, and tracking the degradation state from the surface layer to the inner surface after weather resistance testing.

This device, called SAICAS (pronounced "saikas"), which stands for Surface And Interfacial Cutting Analysis System, is used to measure the peeling strength and shear strength of substrates. In addition to the functions of SAICAS EN-W, this model is equipped with the capability to automatically produce specified thickness slices for wet analysis.

This is an ultra-precision model that consolidates the know-how cultivated by SAICAS over many years, enabling SAICA testing on ultra-thin films at the nanometer (sub-micron order) level by driving the cutting edge at a speed of nm/sec.