JFE商事エレクトロニクス Product Lineup

The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "CSX-400 Series" is an ultrasonic cutting device that cuts a wide range of materials, including difficult-to-cut materials and composites such as SiC, LTCC, glass, and resin, with high quality, achieving high productivity and cost performance through improved blade life. ■ Features - Achieves high-quality and quick cutting thanks to ultrasonic effects! - Easy operation for anyone with a user-friendly interface! - Various cutting methods available, including pitch-cut and staggered-cut! - Reduced processing time with auto-alignment! (60% reduction compared to Takada Industrial) - Reduced daily maintenance time with a large front door! - Options for semi-auto (CSX-400) and full-auto (CSX-401)! - Standard equipped with a cleaning unit (CSX-401)! * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "CSX501" is an ultrasonic cutting device equipped with a dual-end support mechanism that enables high-speed cutting, enhancing productivity and adding new functionalities. With the addition of equipment monitoring capabilities, it is now possible to recover from unexpected troubles with minimal equipment downtime through remote support. ■Features - Achieves high-speed, high-quality cutting of a wide range of materials, from difficult-to-cut materials like SiC, alumina, and PZT to composites such as glass and resin! - By adding ultrasound to blade cutting, it significantly reduces blade wear! - The development of a unique spindle and special ultrasonic blade that maximizes ultrasonic effects enables mass production-level cutting of SiC wafers at an 80µm street! *Demo units are available for sample evaluation. *We can also propose the semi-auto type "CSX-400." *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

The prototype research device "TWPm Series" has the following features: ■ Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate small quantities of various types and fluctuations in production volume - Enhanced quality and yield through sheet processing (realization of precise processing without cross-contamination and improved uniformity and control within the plane) - Unique jet lift-off mechanism with high peeling performance - Achieved reduced footprint through compact size - Maintenance-free structure from the back - Functions inherited from conventional products - Dedicated device for one chamber * There is also a mass production "TWP Series." https://www.ipros.jp/product/detail/2000745622 * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. We offer a variety of devices, including wafer (RCA) cleaning equipment, precision parts cleaning equipment, ingot cleaning equipment, etching equipment, and IPA dryer equipment. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

The "TFC Series" uses jets to remove tape adhesive and fingerprints attached to the dicing frame used in the wafer cutting (dicing) process. Since there are no contact items like brushes, there is no degradation of cleaning performance due to secondary adhesion of adhesives. ■ Features - Non-contact cleaning mechanism that employs a unique jet nozzle with high cleaning performance → Since it does not use brush cleaning or cloths like wipes, there is no decrease in cleaning power due to clogging or re-adhesion. - Chemical cleaning method using organic solvents - High recovery rate of cleaning solution achieved through a vertical rotating mechanism - Compact size of 1,000mm × 1,500mm × 2,000mm - UV irradiation unit and tape removal unit can be installed (optional) *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. The 'TID Series' device cleans and dries wafers in an IPA (isopropyl alcohol) vapor atmosphere and is equipped with an IPA quality control system and various safety systems. ■ Features - Clean drying using high-purity IPA is possible regardless of the material or shape, including devices, wafers, glass, and components. - Comprehensive safety measures including gas monitoring, N2 purging systems, automatic fire extinguishing systems, and emergency water injection systems in case of emergencies. - Clean drying using high-purity IPA is possible regardless of the material or shape. - The use of all stainless steel eliminates the risk of breakage. - Divided into paper zones and dry zones to reduce the use of IPA. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

【Low Thermal Expansion Material】 - Ultimate Zero Thermal Expansion (LEX ZERO) - OK down to minus 50°C (LEX ZERO NEXT) - Space-Compatible (LEX-STAR) - High Rigidity Plus Low Thermal Expansion (LEX-35E+) 【High Strength Cast Steel Material】 (TNCM-α) 【New Vibration-Damping Cast Steel】 (ETA-BF1) Compatible with cast and forged products. Capable of manufacturing from small to super large items (from 10 grams to 15 tons), with quick response using block material in stock (400X400X150 mm), and can be cut to your desired size. Supports complex shapes, with high near-net shape capability for sand molds and lost-wax cast products. Test pieces for trial use are available upon request, please inquire. Surface treatments: Electroless Ni plating, black electroless Ni plating, black chrome plating, etc. It also features good machinability (ease of cutting) compared to super alloys.

• alloy

Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)

• alloy
• Other optical parts
• Resin mold