JFE商事エレクトロニクス List of Products and Services

This is a case study of Sanwa Electronics, which has adopted the "Smart Reel Rack" that realizes improvements in production efficiency and space-saving through the automation of electronic component reel inventory management. A must-see for customers interested in or considering the automation of electronic component reel inventory management!!! ■ Sanwa Electronics Co., Ltd. Address: 208 Kamishiro, Tsuyama City, Okayama Prefecture Business: Manufacturing and assembly of circuit board mounting, and manufacturing of assembly transport jigs and finished products https://www.sanwa-electronics.com/ *For more details, please refer to the PDF document or feel free to contact us.

• Other mounting machines
• Other electronic parts
• Production Management System

Many of the customers who inquire about the electronic component reel management system "Smart Reel Rack" are those who are considering or have previously considered a tower-type automated warehouse. In this case study, you can see why a customer who was operating a tower-type automated warehouse switched to the "Smart Reel Rack." Customers looking to improve the efficiency and space-saving of electronic component reel management should definitely take a look! *For more details, please refer to the PDF materials or feel free to contact us.

• Other mounting machines
• rack
• Racks and Cases

The smart reel rack system provided by our company is an intelligent solution for storing electronic component reels supplied to electronic circuit board assembly lines, significantly improving the overall production efficiency of the electronic circuit board manufacturing line. This smart reel rack performs smooth and fast inbound and outbound operations of electronic component reels while dramatically reducing the burden on operators and minimizing operational errors by collaborating with upper systems and assembly machines. It has been particularly well-received by customers who manage many reels manually in small lots of various types. 【Features】 ■ Automatically generates outbound lists based on production plans and remaining parts information ■ Equipped with a first-in, first-out function for outbound operations from older reels ■ Shortens work pathways and improves work efficiency through free location management ■ Issues an alarm when a reel without an LED indicator is taken, preventing incorrect outbound operations ■ Can be linked with customers' upper systems and certain manufacturers' assembly machines ■ Reduces the time required for model switching, thereby decreasing operational errors ■ Can be linked with certain manufacturers' assembly machines *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Mounter

The "PSP7" (1344) is a smart reel rack for warehouses with 6 shelf levels. The dimensions are W2260×D400×H1710mm. The weight is 123KG. Based on your requirements, we will propose the optimal shelf specifications. If you have any requests, please feel free to contact us. 【Specifications】 ■ Size: W2260×D400×H1710mm ■ Weight: 123KG ■ Capacity (number of reels): 1344 (reel size 7") ■ Number of shelf levels: 6 ■ Input power: 100V–240V ■ Output power: 12V ■ Peak power: 350W *For more details, please refer to the PDF document or feel free to contact us.

• Mounter
• Substrate transport device (loader/unloader)
• Circuit board processing machine

The "PSP13"/15" (144)" is an intelligent mobile rack with 3 shelves. The dimensions are W1380×D400×H1350mm. The weight is 57KG. Additionally, we also offer a high-capacity model "PSP7" (512)" with dimensions W1380×D400×H1350mm and a capacity of 512 (reel size 7"). 【PSP13"/15" (144) Specifications】 ■ Size: W1380×D400×H1350mm ■ Weight: 57KG ■ Capacity (number of reels): 144 (reel size: 13"/15") ■ Number of shelves: 3 ■ Power supply: rechargeable battery 12v 30ah *For more details, please refer to the PDF document or feel free to contact us.

• Mounter
• Substrate transport device (loader/unloader)
• Circuit board processing machine

The "Smart Reel Rack" is a rack system that digitizes and informs the IC chip reel storage shelves supplied to electronic circuit board assembly lines, significantly improving the production efficiency of electronic circuit board manufacturing lines. Based on your requirements, we will propose suitable shelf specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Reduction of inbound and outbound time ■ Reduction of warehouse space ■ Quality assurance through FIFO ■ Visualization of inventory ■ Provided with suitable shelf specifications *For more details, please refer to the PDF document or feel free to contact us.

• Mounter
• Substrate transport device (loader/unloader)
• Circuit board processing machine

In recent years, we have often heard from circuit board assembly companies that with the increase in the quantity of electronic components handled, the chip counting time has also increased, and there is a need to improve work efficiency. The 'iNsight-2000' provided by JFE Shoji Electronics supports 7-15 inch reels, counting 4 reels simultaneously in 6-9 seconds for 7-inch reels, achieving a significant reduction in your chip counting time! *For detailed specifications and features, please refer to the basic information section or the PDF materials, or feel free to contact us.

• X-ray inspection equipment
• Defect Inspection Equipment
• Other electronic parts

We have received requests from users of our highly praised electronic component reel inventory automation system, "Smart Reel Rack," to reduce the time taken for accurate counting of parts during the storage of electronic component reels. In response to such requests, we have released the X-ray electronic component counter, "iNsight-2000"! By introducing "iNsight-2000" alongside "Smart Reel Rack," we aim to further enhance the efficiency of your inventory operations! *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other electronic parts
• Circuit Board Inspection Equipment

In our office, we handle laser devices manufactured by HGTECH, which offer overwhelming cost performance. The LCB series (double-sided type) and LCD series (single-sided type) laser marking machines for substrates can perform fine marking on various materials such as paper, resin, and metal, and support simultaneous processing on both sides with dual heads! We also offer the LBB series (inline machines) and LBA series (standalone machines) for substrate laser cutting, with the capability for short delivery times. 【Features】 ■ Substrate Laser Marker Model: LCB-10C - Supports fine marking with a size of 0.5mm - Easy software setup, capable of printing various codes - Can be equipped with a shutter for opening and closing sections and can be integrated with existing systems ■ Substrate Laser Cutting Machine Model: LBA-15U - Enables high-precision cutting with minimized damage 【Others】 - Proposals are also available in Japan, China, Thailand, Malaysia, and Vietnam. - Actual machine viewing and evaluation are possible in Japan, China, and Thailand. *If you are interested, please feel free to contact us through the "Contact Us" section. *For more details, please download the PDF or feel free to reach out to us.

• Laser marker
• Other markings
• Circuit board processing machine

With the recent surge in demand for semiconductor components, the demand for wafers such as silicon has also increased rapidly. In response to this background, HGTECH has released a wafer marking machine as a "custom product"! It has received high praise from many customers for its overwhelming cost performance. *For more details, please feel free to contact us.

• Wafer
• Laser marker
• Circuit board processing machine

The "MR2535H2T" manufactured by Meibun Technica is a high-performance turntable circuit board cutting machine capable of high-speed processing. Since it allows for the setup of the next workpiece in parallel during circuit board processing, it eliminates waiting time during board exchanges. Additionally, it shortens cycle times, thereby improving productivity without increasing the number of operators. With the turntable positioned at the front, it allows for robot access and can be applied to general inline specifications. 【Features】 ■ Equipped with two tables for automatic turn setup that allows for parallel preparation ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time by setting Z-axis height for each router location ■ Improved operational efficiency by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector achieves compact device size *For more details, please download the PDF or contact us. ★ Free seminar here▽ 　http://www.mtco-web.co.jp/products/web_seminar.html

• Circuit board processing machine
• Circuit Board Inspection Equipment
• Printed Circuit Board

The "MR2535H2" is a substrate cutting machine that achieves high-efficiency division and low running costs for a large number of small, complex-shaped substrates. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. Leveraging the experience cultivated at the Mitsubishi Electric Nagoya Works, we support your company's productivity and quality improvement! 【Features】 ■ Achieves high rigidity, high quality, and low running costs! ■ Cuts unnecessary parts of complex shapes of printed circuit boards after mounting using a router bit. ■ Improves setup efficiency by widening the opening width of the equipment's access door. ■ Realizes space-saving by integrating a dust collector into the bottom of the equipment. ■ Significantly improves productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models). ■ Allows for Z-axis position settings for each cutting point, enabling takt time reduction. ■ Supports image teaching functions, allowing for quick setting of cutting points for various types of substrates. * Inline and turntable types are also available. * For more details, please refer to the PDF document or feel free to contact us.

• Circuit board processing machine

Automatically cuts various printed circuit boards inline while maintaining the manufacturing line. This achieves labor reduction by eliminating the need to constantly have an operator at the board cutting machine. 【Features】 ■ Monitors the usage distance of the bits and automatically replaces them to improve operational efficiency. ■ Waste boards are automatically collected into a waste board box located at the bottom of the device. ■ Selecting a twin spindle allows for simultaneous cutting, achieving high productivity. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board processing machine
• Circuit Board Inspection Equipment

The substrate marking device is a laser-based substrate marking machine capable of directly marking serial numbers, origins, and 2D codes or characters for process management using a laser marker. The laser marking devices from Meibishi Technica, 'ML-PM20F3' and 'ML-PM30C3', are models compatible with M-size substrates. In addition to being equipped with a variety of functions, there are also many options available that enable the development of a traceability system. Leveraging the experience gained at the Mitsubishi Electric Nagoya Works, we support your company's productivity and quality improvement! 【Features】 ■ High-speed marking of fine characters, 2D codes, and shapes at any position on the printed circuit board ■ Stable print quality compared to stamp methods ■ Print data can be centrally managed on a server ■ Print programs can be created in parallel with production at your desk away from the substrate manufacturing line using Excel * The computer is connected via LAN cable ■ Capable of traceability management by connecting to your higher-level production system ■ Supports double-sided marking with the optional built-in reversing mechanism * For more details, please download the PDF or contact us.

• Laser marker
• Printed Circuit Board
• Circuit board processing machine

The Janome JR-3000 series circuit board cutting machine is a tabletop model that allows for the outer shape processing of circuit boards using a router cutting method. It offers two types of dust collection methods: upper and lower. 【Main Features】 ■ No need for dust collection equipment, reducing initial costs! ■ Space-saving design with a tabletop model! ■ High-performance robot CP control enables cutting of curves and straight lines! ■ Minimal stress on the circuit board, achieving clean cutting surfaces! ■ == New feature of lower dust collection type == - Router bits last several times longer - Reduced maintenance frequency for spindle motors ■ Convenient feature allowing for blade replacement settings (time) ■ Janome's original easy teaching - Determine cutting positions from CAD drawings, with drawing and editing capabilities (optional) - USB camera teaching (optional) ■ Teaching pendant supports 11 languages * For more details, please refer to the PDF document or feel free to contact us.

• Circuit board processing machine
• SCARA Robot
• Other mounting machines

The Janome 'JR3000AP-D Camera Equipped Coating Specification' has been packaged to meet the needs of work requiring precise coating, combining the high rigidity and accuracy of the "JR3000 Series" with a "CCD camera, laser displacement meter, and needle adjuster" into one package. 【Features】 ■ All-in-One Package Robot To accommodate work requiring precise coating, we have combined the "JR3000 Series" with a "camera, laser displacement meter, and needle adjuster" suitable for machine vision into one package. ■ High-Precision Coating with Three Types of Correction Functions - X and Y position correction using a camera - Z height correction using a laser displacement meter - Nozzle tip position deviation correction using a needle adjuster ■ Positioning for coating can be easily and accurately specified from the CCD camera image displayed on the PC screen. ■ Easy Setup Complicated camera calibration, sensor settings, and teaching can all be easily performed by anyone using a single PC software. ■ Easy Operation The PC screen features a clear interface, making it easy for anyone to operate.

• SCARA Robot
• Other mounting machines
• dispenser

This is an introduction page for the exterior inspection equipment manufactured by Koyon Corporation. Our department has decades of expertise in inspection equipment as an agent for the company’s products, and we are here to assist you in improving the efficiency and yield of your PCB assembly production! 【Introduction of Comprehensive Catalog Equipment (Part 1)】 ■ 3D SPI Inspection Equipment 'KY8030-3' - By providing an inspection speed option of 0.24 seconds per field of view (FOV), we meet the inspection needs of ultra-high-speed production lines! - Elimination of shadow issues through dual projection technology (patented by Koyon Corporation)! - Optimization through real-time PCB warpage correction! ■ 3D AOI Inspection Equipment 'ZENITH UHS' - Achieving high-speed inspection rates! (1.5 times compared to conventional models) - Inspection performance unique to full 3D! - Integration of 3D measurement database and SMT process management system.

• Visual Inspection Equipment
• Other mounting machines
• Circuit Board Inspection Equipment

Our company has a sales record of several decades as an agent for Koyon products. We provide implementation efficiency solutions with cutting-edge technology, such as the 3D SPI inspection device 'KY8030-3' and the 3D AOI inspection device 'ZENITH UHS'.

• Other mounting machines

The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "CSX-400 Series" is an ultrasonic cutting device that cuts a wide range of materials, including difficult-to-cut materials and composites such as SiC, LTCC, glass, and resin, with high quality, achieving high productivity and cost performance through improved blade life. ■ Features - Achieves high-quality and quick cutting thanks to ultrasonic effects! - Easy operation for anyone with a user-friendly interface! - Various cutting methods available, including pitch-cut and staggered-cut! - Reduced processing time with auto-alignment! (60% reduction compared to Takada Industrial) - Reduced daily maintenance time with a large front door! - Options for semi-auto (CSX-400) and full-auto (CSX-401)! - Standard equipped with a cleaning unit (CSX-401)! * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "CSX501" is an ultrasonic cutting device equipped with a dual-end support mechanism that enables high-speed cutting, enhancing productivity and adding new functionalities. With the addition of equipment monitoring capabilities, it is now possible to recover from unexpected troubles with minimal equipment downtime through remote support. ■Features - Achieves high-speed, high-quality cutting of a wide range of materials, from difficult-to-cut materials like SiC, alumina, and PZT to composites such as glass and resin! - By adding ultrasound to blade cutting, it significantly reduces blade wear! - The development of a unique spindle and special ultrasonic blade that maximizes ultrasonic effects enables mass production-level cutting of SiC wafers at an 80µm street! *Demo units are available for sample evaluation. *We can also propose the semi-auto type "CSX-400." *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

The prototype research device "TWPm Series" has the following features: ■ Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate small quantities of various types and fluctuations in production volume - Enhanced quality and yield through sheet processing (realization of precise processing without cross-contamination and improved uniformity and control within the plane) - Unique jet lift-off mechanism with high peeling performance - Achieved reduced footprint through compact size - Maintenance-free structure from the back - Functions inherited from conventional products - Dedicated device for one chamber * There is also a mass production "TWP Series." https://www.ipros.jp/product/detail/2000745622 * For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. We offer a variety of devices, including wafer (RCA) cleaning equipment, precision parts cleaning equipment, ingot cleaning equipment, etching equipment, and IPA dryer equipment. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

The "TFC Series" uses jets to remove tape adhesive and fingerprints attached to the dicing frame used in the wafer cutting (dicing) process. Since there are no contact items like brushes, there is no degradation of cleaning performance due to secondary adhesion of adhesives. ■ Features - Non-contact cleaning mechanism that employs a unique jet nozzle with high cleaning performance → Since it does not use brush cleaning or cloths like wipes, there is no decrease in cleaning power due to clogging or re-adhesion. - Chemical cleaning method using organic solvents - High recovery rate of cleaning solution achieved through a vertical rotating mechanism - Compact size of 1,000mm × 1,500mm × 2,000mm - UV irradiation unit and tape removal unit can be installed (optional) *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. The 'TID Series' device cleans and dries wafers in an IPA (isopropyl alcohol) vapor atmosphere and is equipped with an IPA quality control system and various safety systems. ■ Features - Clean drying using high-purity IPA is possible regardless of the material or shape, including devices, wafers, glass, and components. - Comprehensive safety measures including gas monitoring, N2 purging systems, automatic fire extinguishing systems, and emergency water injection systems in case of emergencies. - Clean drying using high-purity IPA is possible regardless of the material or shape. - The use of all stainless steel eliminates the risk of breakage. - Divided into paper zones and dry zones to reduce the use of IPA. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• High pressure cleaner

【Low Thermal Expansion Material】 - Ultimate Zero Thermal Expansion (LEX ZERO) - OK down to minus 50°C (LEX ZERO NEXT) - Space-Compatible (LEX-STAR) - High Rigidity Plus Low Thermal Expansion (LEX-35E+) 【High Strength Cast Steel Material】 (TNCM-α) 【New Vibration-Damping Cast Steel】 (ETA-BF1) Compatible with cast and forged products. Capable of manufacturing from small to super large items (from 10 grams to 15 tons), with quick response using block material in stock (400X400X150 mm), and can be cut to your desired size. Supports complex shapes, with high near-net shape capability for sand molds and lost-wax cast products. Test pieces for trial use are available upon request, please inquire. Surface treatments: Electroless Ni plating, black electroless Ni plating, black chrome plating, etc. It also features good machinability (ease of cutting) compared to super alloys.

• alloy

Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)

• alloy
• Other optical parts
• Resin mold