日本合成化工 List of Products and Services

"VX-3528A/VX-3528B" is a liquid epoxy resin formulation for insulated casting. It excels in the balance of electrical and mechanical properties, making it suitable for a wide range of applications. It possesses high electrical insulation properties derived from epoxy resin. Additionally, it is a two-component type consisting of a base agent and a hardener, allowing for transportation at room temperature. It is a heat-curing type, with recommended curing conditions of 80°C for 3 hours. 【Features】 ■ Heat-curing type, recommended curing conditions are 80°C for 3 hours ■ High electrical insulation properties derived from epoxy resin ■ Excellent balance of electrical and mechanical properties, suitable for a wide range of applications ■ High thermal conductivity, applicable for applications requiring heat dissipation ■ Flame retardant equivalent to V-0 (3.2mm) ■ Two-component type of base agent and hardener, allowing for transportation at room temperature ■ Compliant with RoHS2.0 directive *For more details, please refer to the PDF document or feel free to contact us.

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"U-365A/U-365B" is a liquid urethane resin formulation for insulated casting. It is flame-retardant V-2 (6.4mm) and is a two-component type consisting of a main agent and a hardener. It has flexibility at low temperatures and excellent heat shock resistance. It is a heat-curing type, with recommended curing conditions of 80°C for 4 hours. Additionally, it possesses high electrical insulation properties derived from urethane. 【Features】 ■ Heat-curing type, recommended curing conditions are 80°C for 4 hours ■ Low viscosity, excellent workability ■ High electrical insulation properties derived from urethane ■ Flexibility at low temperatures and excellent heat shock resistance ■ Flame-retardant V-2 (6.4mm) ■ Two-component type with a main agent and hardener, can be stored at room temperature ■ Compliant with RoHS2.0 directive *For more details, please refer to the PDF document or feel free to contact us.

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The "OR-40 Magnetic Property Improved Grade" is a magnetic powder blended epoxy resin molding material. It exhibits excellent heat resistance due to its high glass transition temperature. Additionally, it is highly filled with magnetic powder, resulting in good magnetic properties. Please feel free to contact us when you need assistance. 【Features】 ■ Exhibits excellent heat resistance due to its high glass transition temperature ■ Highly filled with magnetic powder, resulting in good magnetic properties ■ Applicable for both compression molding and transfer molding, adaptable to various molding equipment *For more details, please refer to the PDF document or feel free to contact us.

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The "ER-6700FA/ER-6700B" is a liquid epoxy resin formulation for insulated casting. It is a heat-curing type, with recommended curing conditions of 80°C for 3 hours or 80°C for 3 hours plus 150°C for 3 hours. It excels in the balance of electrical and mechanical properties, making it suitable for a wide range of applications. Additionally, it has excellent heat shock resistance. 【Features】 ■ Heat-curing type, recommended curing conditions are 80°C for 3 hours or 80°C for 3 hours plus 150°C for 3 hours ■ High electrical insulation properties derived from epoxy resin ■ Excellent balance of electrical and mechanical properties, suitable for a wide range of applications ■ Excellent heat shock resistance ■ Flame retardant equivalent to V-0 (1.6mm) ■ Two-component type with base agent and hardener, can be stored at room temperature ■ Compliant with RoHS2.0 directive *For more details, please refer to the PDF document or feel free to contact us.

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The "ER-6506FA/ER-6506B" is a liquid epoxy resin formulation for insulated casting. It has high electrical insulation properties derived from epoxy resin. It maintains flexibility even at low temperatures and excels in heat shock resistance. It is a heat-curing type, with recommended curing conditions of 80°C for 5 hours. It is a two-component system consisting of a main agent and a hardener, and can be stored at room temperature. 【Features】 ■ Heat-curing type, recommended curing conditions are 80°C for 5 hours ■ High electrical insulation properties derived from epoxy resin ■ Maintains flexibility even at low temperatures and excels in heat shock resistance ■ Can be used on the surface of rigid epoxy to prevent surface cracking ■ Flame retardant equivalent to V-0 (4.0mm) ■ Two-component system consisting of a main agent and a hardener, can be stored at room temperature ■ Compliant with RoHS2.0 directive *For more details, please refer to the PDF document or feel free to contact us.

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The "DP-3300" is a diacrylate phthalate resin molding material with good mechanical properties due to its fiberglass composition. Recommended molding methods are transfer molding and injection molding. It has high electrical insulation properties derived from diacrylate phthalate resin. Please feel free to contact us when you need assistance. 【Main Components and Properties】 ■ Main Component: Diacrylate Phthalate Resin ■ Color: Black ■ Cured Density: 1.85 to 1.95 *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces functional resins used in vehicles. Functional adhesives are used in applications such as door mirrors and wire harnesses, while molding materials are utilized in power modules and headlights, among various other examples. The content is designed to be a helpful reference when selecting functional resins suitable for specific applications. 【Examples of Applications (Partial)】 ■Functional Adhesives - Door Mirrors ■Molding Materials - Power Modules ■Insulation Protection Sealants - Electronic Control Units *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the thermosetting resin products that we handle. We offer products made from "liquid formulated resins" such as epoxy resins and urethane resins, as well as products made from "powder materials" such as epoxy resins and phenolic resins. Additionally, based on our long-standing achievements, we provide solutions for realizing advanced materials and enhancing quality, develop materials to meet user needs, and offer various proposals for small-batch production of diverse varieties. 【Product Lineup (Partial)】 ■ Liquid Formulated Resins - High-flow Insulating Encapsulant - Ultra-Heat-Resistant Polyurethane Encapsulant - High-Performance Liquid Epoxy Resin Encapsulant *For more details, please refer to the PDF materials or feel free to contact us.

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Since our founding in 1930, we have been responding to product development needs for various applications, including advanced materials for electronics, as experts in functional resins, utilizing our advanced mixing and dispersion technology. We introduce the fusion of resins and functional additives through our blending and mixing technology. Additionally, we undertake various mass production processes, such as mixing high-viscosity resins in paste form and dispersing and mixing liquids and powders. 【Examples of mass production processes we undertake (partial list)】 ■ Mixing high-viscosity resins in paste form ■ Dispersing and mixing liquids and powders ■ Processing liquids with thixotropic properties ■ Mixing low-viscosity liquid chemicals ■ Processing resin products such as adhesives *For more details, please refer to the PDF document or feel free to contact us.

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"U-659A/B" is a low dielectric polyurethane sealing material that achieves a reduction in radio wave loss, which was difficult with conventional sealing materials. It is suitable for sealing high-frequency band sensors and can be used in communication devices and sensor sealing. In addition, while general sealing materials have a high radio wave loss with a relative permittivity of 3.9, this product has a lower dielectric material, resulting in a relative permittivity of 2.7 and reduced radio wave loss. [Features] - Low dielectric - Moisture resistance - Flexibility *For more details, please refer to the PDF document or feel free to contact us.

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The "KT-17C20" is an epoxy resin molding material for low-temperature, low-pressure molding that enables molding in temperature ranges that were difficult with conventional molding materials. It can be molded at around 120°C, and due to its low-pressure molding capability and high fluidity, productivity is improved without the need for a case. Additionally, since the molding pressure and temperature are low, there is no deformation or damage to the mounted components, making it suitable for the molding and sealing of mounted components that are sensitive to heat and stress. 【Features】 ■ Molding possible at around 120°C ■ Low-pressure molding capability ■ High fluidity ■ Low-temperature curing ■ Ultra-low-pressure sealing *For more details, please refer to the PDF document or feel free to contact us.

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"U-7605A/B" is a UL-746B certified ultra-heat-resistant polyurethane encapsulant. It excels in flame retardancy, heat resistance, and heat dissipation, making it suitable for substrate encapsulation. Additionally, the ultra-heat-resistant polyurethane encapsulant "U-634A/B" is excellent in heat resistance, moisture resistance, and flexibility, and is used for film capacitor potting encapsulation. 【Features】 ■U-7605A/B - UL-746B certified (RTI: 130°C) - Flame retardant (V-0 certified) - Excellent heat resistance - Excellent heat dissipation (0.8W/m·K) - Excellent cold-heat cycle resistance - Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

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The "TM-250" is an injection molding epoxy resin material suitable for parts requiring sub-micron level precision. It is applicable for precision mechanical components, resin cases, and device encapsulation. We also offer molding materials such as "TM-261," which enables high dimensional accuracy, and "YD8000T," characterized by ultra-low shrinkage. 【Features】 ■TM-250 ・Can be molded under low pressure ■TM-261 ・High dimensional accuracy ■YD8000T ・Ultra-low shrinkage *For more details, please refer to the PDF document or feel free to contact us.

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"VX-3657A/B" is a liquid epoxy resin formulation designed to meet the high heat resistance requirements associated with the advancement and miniaturization of electronic products. Due to its characteristics of high heat resistance, high fluidity, and low stress, it is applicable in power modules and similar applications. Additionally, because of its low linear expansion and low shrinkage rate, it is also used for high heat-resistant substrate encapsulation. 【Physical Property Data (Partial)】 ■ Curing Conditions ・100℃×1h + 180℃×2h ■ Glass Transition Temperature ・200℃ ■ Linear Expansion Coefficient α1 ・14ppm *For more details, please refer to the PDF document or feel free to contact us.

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We offer high heat-resistant epoxy resin molding materials applicable to electric vehicles and home appliances. We have a variety of products including precision mechanical components, packaging, injection molding materials, and high heat-resistant, heat shock-resistant sealing materials. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Precision mechanical components, packaging, injection molding materials ■ High heat-resistant, heat shock-resistant sealing materials ■ Base resin for magnetic material formulations (for molding materials) ■ For high voltage components *For more details, please download the PDF or contact us.

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We offer metal material composite resins that can be used for various magnetic device applications. We will propose suitable materials according to various molding methods and production processes, such as compression, transfer, and liquid molding. Please feel free to contact us if you have any requests. [Purpose of Use] ■ High Strength: Improved impact resistance ■ High Fluidity: Resin filling in narrow gaps is possible ■ High Density: Provision of high magnetic properties (high filling of metal powder is possible) *For more details, please download the PDF or contact us.

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Our company manufactures various functional liquid encapsulants, primarily for applications such as control board encapsulation and sensor module sealing, as well as high heat-resistant and heat shock-resistant encapsulants that have a proven track record in various power module applications. We offer a wide range of products, including heat-resistant, waterproof, insulating, and flame-retardant types. Please feel free to contact us if you have any inquiries. 【Purpose of Use】 ■ Protection from external environments such as humidity ■ Fixation of components ■ Improved heat dissipation and prevention of internal heat accumulation ■ Insulation protection ■ Prevention of stress from impacts, friction, and vibrations *For more details, please download the PDF or contact us.

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