レスター Product Lineup

We would like to introduce the "NearStack 100 Ohm Connector," designed as a compact package compatible with Molex's BiPass I/O that we handle. Utilizing 34AWG Twinax cables, we offer high-speed jumper products in variations of 8 differential pairs and 16 differential pairs. Please feel free to contact us when you need assistance. 【Features】 ■ Designed for applications requiring 100 ohm impedance ■ Compatible with 34 AWG Twinax ■ Production ■ Built with a modular wafer/bay structure *For more details, please download the PDF or feel free to contact us.

We would like to introduce NearStack's "On-the-Substrate Connector," designed as a direct two-chip solution that we handle. The NearStack connector is placed directly on the chip substrate, enabling the "connectorization" of ASIC packages. High-speed transmission signals from the chip are output through a 0.50mm SMT plug and thin cable assembly without passing through the PCB. 【Features】 ■ 56 Gbps PAM-4 / 112 Gbps PAM-4 ■ Direct two-chip substrate wiring on the substrate connector ■ Direct placement of PCB plugs on the substrate surface *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "NearStack ExT Connector" that we handle. The ExT application realizes an "External Topology" with a cable-to-cable interface on the chassis panel. It utilizes NearStack's direct-to-contact Twinax technology within a high-density 20DP port. The robust mechanical design consistently ensures stability and reliability through external mating. 【Features】 ■ 56 Gbps PAM-4 / 112 Gbps PAM-4 ■ Utilizes NearStack technology to enable system interfaces from internal to external ■ Does not require PCB for the system *For more details, please feel free to contact us.

In a high-speed communication environment of data centers, the stability of signals and the maintenance of transmission quality are required. Particularly within server racks, where density is increasing, efficient wiring in limited space and reliable connections are essential. Inadequate connector systems can lead to signal loss and increased noise, potentially resulting in a decline in overall system performance. Our "OCP-compliant NearStack 100 Ohm Connector" addresses these challenges with a compact package that is compatible with Molex's BiPass I/O. 【Usage Scenarios】 - Interconnection between servers in data centers - High-speed data transmission between network devices - High-density wiring environments

In the telecommunications infrastructure industry, high-speed and stable signal transmission is required. Particularly in data centers and network equipment, it is important to prevent signal degradation and maintain the overall performance of the system. Inadequate connector systems can lead to increased signal noise and transmission errors, potentially resulting in a decline in communication quality. Our "NearStack 100 Ohm Connector" is compatible with Molex's BiPass I/O and addresses these challenges in a compact package. 【Usage Scenarios】 - Network equipment requiring high-speed data transmission - Server backplanes where signal stability is crucial - Infrastructure development within data centers 【Benefits of Implementation】 - Optimization of system performance - Improvement of signal quality - Achievement of reliable connections

In the AI/ML field, transferring large amounts of data quickly and reliably is crucial for maximizing system performance. Particularly in the training and inference of complex models, bottlenecks in data transfer can impact processing speed. Our "OCP-Compatible NearStack 100 Ohm Connector" is designed as a compact package compatible with Molex's BiPass I/O to address these data transfer challenges. Utilizing 34AWG Twinax cables, we offer high-speed jumper products in variations of 8 differential pairs and 16 differential pairs, contributing to improved data transfer performance in AI/ML systems. 【Use Cases】 - High-speed data transfer for AI/ML systems - Data integration between servers - Connection with storage systems 【Benefits of Implementation】 - Improved system performance - Stabilization of data transfer - Enhanced installation efficiency through space-saving design

In 5G/6G communication systems, achieving low latency requires minimizing signal loss and ensuring high-speed, stable data transmission. Particularly in infrastructure such as base stations and data centers, high-density implementation and reliable connections are essential. Improper connectors can lead to signal degradation and delays, potentially resulting in a decrease in overall system performance. Our OCP-compliant NearStack 100-ohm connector is designed to address these challenges. 【Usage Scenarios】 - 5G/6G base station infrastructure - Intra-data center networks - Connections between high-speed communication devices 【Benefits of Implementation】 - Improved signal quality - Reduced system latency - Support for high-density implementation

In a cloud computing environment, system scalability is required to handle the increasing volume of data and traffic. In particular, fast and stable data transfer directly impacts the reliability and performance of service delivery. Insufficient connectivity can lead to delays and data loss, potentially resulting in a decline in user experience and an increase in operational costs. Our OCP-compliant NearStack 100 Ohm connector provides an optimized direct-to-cable connector system that maximizes system performance in response to such challenges. 【Usage Scenarios】 - Interconnection between servers in data centers - High-speed data transfer between network devices - Collaboration with storage systems 【Benefits of Implementation】 - Improved scalability through high-speed data transfer - Optimization of overall system performance - Stabilization of operations through reliable connectivity

In real-time processing of edge computing, it is essential to minimize data transmission delays and enhance system responsiveness. In particular, the fast and stable transmission of sensor data and control signals is crucial for real-time decision-making and execution. Transmission loss and noise can lead to processing delays and malfunctions, potentially affecting the overall performance of the system. Our OCP-compliant NearStack 100 Ohm connector addresses these challenges by providing a direct-to-cable connector system compatible with Molex's BiPass I/O in a compact package. 【Use Cases】 - High-speed data communication between edge devices - Building real-time control systems - High-density wiring within data centers 【Benefits of Implementation】 - Improved overall system response speed - Ensured stability of data transmission - Increased flexibility in equipment placement due to space-saving design

In the field of high-performance computing (HPC), parallel processing requires the transmission of large amounts of data quickly and reliably. In particular, maintaining signal quality and low latency is crucial to avoid becoming a bottleneck in computational processing. Our OCP-compliant NearStack 100-ohm connector is designed to meet these demands and contributes to the overall performance improvement of the system. 【Use Cases】 - Large-scale scientific and technical calculations - AI/machine learning training and inference processing - Inter-server connections within data centers 【Benefits of Implementation】 - Reduced processing time through high-speed data transmission - Improved computational accuracy by maintaining signal quality - Optimization of overall system performance

In autonomous driving systems, high-precision data integration from numerous sensors is required. In particular, impedance matching in signal transmission between sensors directly affects the accuracy of the data and the overall reliability of the system. Improper impedance can lead to signal degradation and noise interference, potentially resulting in malfunctions of the autonomous driving system. Our OCP-compliant NearStack 100-ohm connector is optimized for applications requiring 100-ohm impedance, ensuring stable signal transmission in high-density sensor integration. 【Use Cases】 - Sensor harnesses for autonomous vehicles - ECU connections for ADAS (Advanced Driver Assistance Systems) - Inter-sensor communication for LiDAR, cameras, radar, etc. 【Benefits of Implementation】 - Improved reliability of sensor data - Stabilization of overall system performance - Efficient use of wiring space

In the field of IoT platforms, there is a demand for stable and high-speed connections for a large number of devices. In particular, the reliability and efficiency of data transmission are directly linked to the overall performance of the platform. Inadequate connections can lead to data loss and communication delays, potentially resulting in a decline in the functionality of the entire system. Our OCP-compliant NearStack 100-ohm connector provides a solution to these challenges, offering compatibility with Molex's BiPass I/O in a compact package. 【Use Cases】 - Aggregation of IoT devices - High-speed communication within data centers - Edge computing environments 【Benefits of Implementation】 - Improved system performance - Reliable data transmission - Space-saving design

In the broadcasting and media industry, high-quality transmission requires minimizing signal degradation and achieving stable data transfer. Particularly when handling large-capacity data such as high-resolution video and multi-channel audio, the impedance matching of connectors and the quality of connections with cables can directly lead to issues like video distortion and audio dropouts. To address these challenges, our "NearStack 100 Ohm Connector" is optimized for applications requiring 100-ohm impedance, featuring a compact package compatible with Molex's BiPass I/O. 【Usage Scenarios】 - High-quality video transmission - Interconnection between devices in the studio - Signal transmission during live broadcasts 【Benefits of Implementation】 - Maintenance of signal quality - Stable data transfer - Improved system performance

In the field of medical devices, particularly in imaging diagnostics, high-resolution data transmission and stable signal quality are essential. Deterioration of fine signals can impact diagnostic accuracy, making reliable data transfer indispensable. Our "OCP-compliant NearStack 100 Ohm Connector" is designed to meet these demands. It is compatible with Molex's BiPass I/O and achieves high-speed data transmission in a compact package. 【Application Scenarios】 - High-resolution imaging diagnostic devices - Real-time image processing systems - Data loggers 【Benefits of Implementation】 - Faithful transmission of image data - Support for improved diagnostic accuracy - Enhanced overall system reliability

In the field of industrial automation, it is essential to maintain stable signal quality that is resistant to noise in control signal transmission. Particularly in control systems that require real-time performance, delays or degradation of signals can directly lead to malfunctions or decreased productivity. Therefore, a connector system that achieves both high reliability and high-speed transmission is indispensable. Our "OCP Compliant NearStack 100 Ohm Connector" has been developed to meet such needs. 【Usage Scenarios】 - Control lines for industrial robots - Sensor connections in automated production lines - Communication between PLCs (Programmable Logic Controllers) 【Benefits of Implementation】 - Improved system reliability through stable control signal transmission - Enhanced production efficiency through high-speed data transfer - Space-saving design due to compact packaging

In the data center industry, there is a demand for faster and more efficient signal transmission due to the increasing density of servers. Maintaining performance in limited space directly impacts the reliability of equipment and operational efficiency. Inadequate signal transmission can lead to decreased performance and become a bottleneck for the entire system. Our OCP-compliant NearStack Substrate connector achieves connectorization of ASIC packages by placing them directly on the chip substrate, providing a direct-to-chip solution that bypasses the PCB. 【Usage Scenarios】 - High-density server implementation - Equipment requiring high-speed data transfer - Improvement of space efficiency 【Benefits of Implementation】 - Enhanced signal transmission efficiency - Optimization of implementation space - Improved system performance

In the communications infrastructure industry, high-speed and low-latency data transmission is required. Particularly in systems where real-time performance is demanded, signal delays can directly impact performance and potentially lead to a decline in service quality. Therefore, optimizing signal paths and minimizing transmission loss becomes crucial. Our OCP-compliant NearStack Substrate connector addresses this challenge by directly outputting high-speed transmission signals from the chip without going through the PCB. 【Use Cases】 - High-speed network equipment - Communication within data centers - 5G/6G base station equipment 【Benefits of Implementation】 - Reduction of signal delay - Improvement of transmission performance - Overall acceleration of the system

In the AI/ML field, computational power is required to process vast amounts of data at high speeds. Particularly in advanced processing such as deep learning, the data transmission speed between chips significantly affects the overall performance of the system. Wiring through conventional PCBs can lead to unavoidable signal delays and attenuation, potentially becoming a bottleneck for high-speed processing. Our OCP-compliant NearStack Substrate connector addresses this challenge by directly outputting high-speed transmission signals from the chip without going through the PCB, using a 0.50mm SMT plug and a thin cable assembly. 【Use Cases】 - High-speed data transfer for AI/ML chipsets - High-performance computing systems - Data center infrastructure 【Benefits of Implementation】 - Increased signal transmission speed and reduced latency - Improved system performance - Space-saving and enhanced design flexibility

In the field of edge computing, as decentralization progresses, there is a demand for miniaturization of devices and improvements in high-speed data processing capabilities. In particular, minimizing signal transmission delays is crucial for enabling real-time data analysis and decision-making. However, traditional PCB wiring is susceptible to signal attenuation and noise, which can become a bottleneck for high-speed transmission. Our OCP-compliant NearStack Substrate connector addresses these challenges by allowing high-speed signals to be output directly on the chip substrate, bypassing the PCB. 【Use Cases】 - Distributed edge servers - IoT gateways - Real-time data processing systems 【Benefits of Implementation】 - Increased speed and reduced latency of signal transmission - Miniaturization and space-saving of the entire system - Reduction in power consumption

In autonomous driving systems, it is essential to process vast amounts of data from sensors in real-time and make quick decisions. In particular, high-speed signal transmission between in-vehicle ECUs is a critical factor that affects the system's responsiveness and safety. Traditional PCB wiring may raise concerns about signal delays and noise interference. Our OCP-compliant NearStack Substrate connector enables direct chip-to-chip connections by placing it directly on the chip substrate, eliminating the need for PCBs and reducing delays and noise in high-speed transmission signals. This contributes to enhancing the real-time processing capabilities of autonomous driving systems. 【Use Cases】 - High-speed data communication between in-vehicle ECUs - Sensor fusion processing - Real-time control of ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Faster decision-making due to improved real-time capabilities - Enhanced overall system response speed - Compatibility of high-density implementation and signal quality

In the field of IoT connectivity, high-speed and stable data transmission between devices is essential. In particular, real-time exchange of sensor data and control signals directly impacts the responsiveness and reliability of the system. Traditional PCB wiring is susceptible to signal attenuation and noise, which can become a bottleneck for high-speed operations. Our OCP-compliant NearStack Substrate connector addresses these challenges by allowing high-speed signals to be output directly on the chip substrate, bypassing the PCB. 【Use Cases】 - Edge computing devices - High-density implementation boards - High-speed data communication modules 【Benefits of Implementation】 - Improved signal quality - Reduced footprint - Enhanced overall system performance

In the field of 5G/6G communications, there is a demand for wider bandwidth and faster signal transmission to accommodate the increasing data traffic. In particular, optimizing the signal path is essential to maximize the performance of next-generation communication systems. Wiring through conventional PCBs raises concerns about signal attenuation and noise interference, which can impose limitations on bandwidth expansion. Our OCP-compliant NearStack Substrate connector addresses these challenges by directly placing the connector on the chip substrate, allowing for high-speed signal output without going through the PCB, thereby achieving increased bandwidth and improved signal quality. 【Use Cases】 - Next-generation base station equipment - High-performance servers - Data center infrastructure 【Benefits of Implementation】 - Realization of high-speed, large-capacity communication - Improvement of signal quality - Miniaturization and high-density of the entire system

In the cloud gaming industry, high responsiveness is required to minimize latency in player controls and provide a comfortable gaming experience. In particular, fast and stable data transmission is essential for real-time processing of video and audio within games. Wiring through conventional PCBs may raise concerns about signal delay and noise interference. Our OCP-compliant NearStack Substrate connector addresses this challenge by being placed directly on the chip substrate, allowing for high-speed signal output without going through the PCB. 【Use Cases】 - High-speed data transfer between game servers and GPUs - Real-time rendering with low latency - Improved responsiveness of cloud gaming platforms 【Benefits of Implementation】 - Enhanced response speed to player controls - Qualitative improvement in gaming experience - Optimization of overall system performance

In the AR/VR field, high real-time video processing and low-latency data transmission that follows user movements are essential for an immersive experience. Particularly when dealing with high-resolution images and complex interactions, bottlenecks in signal transmission can greatly affect the quality of the experience. Delays and noise can undermine immersion and reduce user comfort. Our OCP-compliant NearStack Substrate connector addresses these challenges by directly outputting high-speed signals from the chip without going through the PCB. 【Use Cases】 - High-resolution AR/VR headsets - Real-time motion capture systems - Development of interactive VR content 【Benefits of Implementation】 - Smooth video display due to reduced latency - Enhanced immersion through improved signal quality - Increased design flexibility for devices due to compact and thin form factor

In the construction and operation of smart city infrastructure, advanced data processing capabilities and reliable communication are essential. Particularly, to enhance the efficiency of the entire city, high-speed and stable signal transmission between sensor networks and control systems is indispensable. Traditional PCB wiring is prone to signal loss and delays, which can affect the overall performance of the system. Our OCP-compliant NearStack Substrate connector addresses these challenges by enabling direct chip-to-chip connections placed directly on the chip substrate, bypassing the PCB, and facilitating high-speed signal transmission. This contributes to the efficiency and reliability of data transmission in smart cities. 【Use Cases】 - Real-time data communication in smart grids - Aggregation and control of sensor data in transportation systems - High-speed data transfer in urban infrastructure monitoring systems 【Benefits of Implementation】 - Enhanced real-time capabilities due to improved data transmission speeds - Increased response speed and efficiency of the entire system - Potential reduction in infrastructure operation costs

In the field of industrial automation, stable operation under harsh environments and high reliability are required. Particularly in systems that require high-speed data transmission, minimizing signal degradation and the effects of noise is essential for maintaining the overall performance of the equipment. Improper connections and wiring can lead to malfunctions and data errors, potentially resulting in production line stoppages and a decline in product quality. The OCP-compliant NearStack Substrate connector achieves direct chip-to-chip connections by being placed directly on the chip substrate, bypassing the PCB, and enabling stable transmission of high-speed signals. This contributes to improved reliability in industrial automation systems. 【Usage Scenarios】 - Industrial robots requiring high-speed data processing - Automation lines demanding high precision control - Manufacturing sites with vibrations or temperature changes 【Benefits of Implementation】 - Reduction of malfunctions due to stabilization of signal transmission - Improvement of overall system reliability - Reduction of maintenance costs

In the field of medical technology, the accurate transmission of fine signals is essential for devices that require high precision and reliability. Particularly in areas directly related to patient safety, such as diagnostic devices and treatment equipment, data loss or delays are unacceptable. In response to these challenges, our OCP-compatible NearStack Substrate connector enables high-precision and high-speed signal transmission through direct chip-to-chip connections without going through a PCB. This enhances the responsiveness of medical devices and allows for more detailed data acquisition, contributing to improved diagnostic accuracy and optimized treatment effects. 【Application Scenarios】 - High-resolution imaging diagnostic devices - Precise biosignal monitoring systems - Advanced surgical assistance robots 【Benefits of Implementation】 - Improved diagnostic accuracy - Rapid treatment support due to enhanced real-time capabilities - Contribution to miniaturization and high-density integration of devices

As data centers become more densely packed, a stable interface from the system's interior to the exterior is increasingly required. In particular, reliable connections in limited spaces are directly linked to the overall reliability of the system. Our "OCP-compliant NearStack ExT Connector" addresses these challenges by providing consistent stability and reliability through robust mechanical design and external mating. 【Usage Scenarios】 - Cable-to-cable interface on chassis panels - High-density implementation environments - Utilization of NearStack's direct-to-contact Twinax technology 【Benefits of Implementation】 - Improved space efficiency through a design that does not require PCBs in the system - Stable connections through external mating - Assurance of high reliability

In the telecommunications infrastructure industry, high-speed and stable data transmission is required, and low latency, in particular, is a crucial factor directly linked to service quality. In the interfaces between network devices, signal degradation and delays can lead to reduced communication speeds and poor responsiveness. In response to these challenges, our "OCP-compliant NearStack ExT Connector" realizes an "external topology" with a cable-to-cable interface on the chassis panel, utilizing NearStack's direct-to-contact Twinax technology to enable stable high-speed communication at high-density ports. This contributes to reducing overall system latency and improving the reliability of communication infrastructure. 【Usage Scenarios】 - Interconnection between servers in data centers - High-speed interfaces between network devices - Telecommunications equipment requiring high-density wiring 【Benefits of Implementation】 - Reduced latency in data transmission - Improved overall system stability - Space-saving due to high-density implementation

In the AI/ML field, there is a demand for processing vast amounts of data quickly and reliably. In particular, the speed and reliability of data transfer between computing resources are directly linked to the overall performance of the system. Insufficient connectivity and slow data transfer can lead to delays in training time and processing errors, potentially reducing the efficiency of research and development. Our OCP-compliant NearStack ExT connector leverages NearStack's direct-to-contact Twinax technology to achieve high-speed data transfer with a high-density interface. [Use Cases] - Interconnection between servers in AI/ML training systems - High-performance computing clusters - High-speed data transfer within data centers [Benefits of Implementation] - Reduction in training time - Improvement in overall system processing capability - Reduction of errors through stable data communication

In the field of edge computing, the decentralization of systems is progressing, and stable data communication and highly reliable interfaces are required at each location. In particular, when connecting with external systems, it is essential to have strong resistance to environmental changes and reliable signal transmission. Inadequate connections can increase the risk of data loss and system downtime. Our "OCP-compliant NearStack ExT Connector" consistently achieves stability and reliability in external mating through robust mechanical design and NearStack's direct-to-contact Twinax technology, addressing these challenges. 【Use Cases】 - Data collaboration between distributed edge devices - System construction in outdoor or harsh environments - Applications requiring high-density port configurations 【Benefits of Implementation】 - Improved stability and reliability in external connections - Enhanced flexibility in system construction - Simplified system design due to the absence of PCBs

In autonomous driving systems, it is essential to transmit vast amounts of data in real-time and reliably between sensors inside and outside the vehicle and control units. Particularly at the interface with the outside, maintaining reliable communication even in harsh environments is crucial for the safe operation of the system. Our "OCP-Compatible NearStack ExT Connector" consistently achieves stability and reliability through robust mechanical design and NearStack technology, meeting these demands. 【Usage Scenarios】 - Connection between in-vehicle sensors and external control units - Systems requiring real-time data transmission - Stable interfaces in harsh environments 【Benefits of Implementation】 - Realization of high real-time data transmission - Improvement of overall system reliability - Assurance of stability and durability in external connections

Connectivity in the IoT field is essential for smooth data collaboration between devices and the stable operation of the entire system. In particular, systems with interfaces to external environments require reliable connectivity and long-term dependability. Inadequate connectivity increases the risk of data loss and system downtime, which can impact the performance of IoT systems. Our "OCP-compliant NearStack ExT Connector" addresses these challenges with robust mechanical design and NearStack technology, achieving a stable system interface. 【Usage Scenarios】 - Data communication between IoT devices - System integration with external equipment - Reliable connections in high-density ports 【Benefits of Implementation】 - Stabilization of data communication - Improvement of system reliability - Simplification of external interfaces

In the field of automation in manufacturing, reliable data transmission between systems and stable operation in harsh environments are required. Particularly, as devices become smaller and more densely packed, the design of reliable interfaces is essential for the stable operation of the entire production line. Improper connections or cable management can lead to communication errors or equipment shutdowns. Our OCP-compliant NearStack ExT connector consistently achieves stability and reliability in external connections through robust mechanical design and NearStack technology. 【Usage Scenarios】 - System interfaces for automation equipment - Devices requiring high-density mounting - Systems needing cable connections to external sources 【Benefits of Implementation】 - Improved reliability of the entire system - Realization of stable data communication - Enhanced maintainability

In the healthcare industry, particularly in telemedicine, the safety of patients and the reliable transmission of medical data are essential. Remote diagnostics and monitoring require stable connections between devices and highly reliable data communication, as even minor interruptions or noise in communication can lead to delays in diagnosis or misdiagnosis. Our "OCP-Compatible NearStack ExT Connector" addresses these challenges by providing consistent stability and reliability through robust mechanical design and advanced NearStack technology, supporting the realization of safe and reliable telemedicine. 【Use Cases】 - Connection between remote diagnostic devices and central servers - Integration of patient monitoring devices with data collection systems - High-density interfaces between medical devices 【Benefits of Implementation】 - Improved diagnostic accuracy due to stabilized communication - Reduced medical errors through enhanced data transmission reliability - Increased flexibility in system construction

In the financial industry, systems that handle highly confidential information require high security and stable communication. Particularly in data integration with external parties and system expansion, a reliable interface is essential. Inappropriate connections or unstable communication can increase the risk of information leakage or lead to system downtime. Our OCP-compliant NearStack ExT connector consistently achieves stability and reliability through robust mechanical design, supporting the security and stable operation of financial systems. 【Use Cases】 - Data integration with external systems - Interfaces during system expansion - Reliable connections with high-density ports 【Benefits of Implementation】 - Maintenance and improvement of security levels - Reduction of system downtime risks - Realization of stable data communication

In the entertainment industry, especially for streaming applications, high-density and stable data transmission is essential. Delays or interruptions in video and audio data can directly impact the viewing experience and potentially diminish the value of the content. Therefore, a reliable interface design is crucial. Our "OCP-compliant NearStack ExT Connector" consistently achieves stability and reliability through robust mechanical design and NearStack's direct-to-contact Twinax technology, addressing these challenges. 【Use Cases】 - Infrastructure for high-quality audio and video streaming services - Backend systems for live streaming platforms - Video production and editing environments requiring large-capacity data transfer 【Benefits of Implementation】 - Improved viewing experience through stable data transmission - Reduced system downtime - Space-saving through high-density implementation

In the construction and operation of smart city infrastructure, stable data communication between diverse devices and the ability to accommodate future scalability are essential. Particularly, to efficiently manage and operate the entire city's systems, a highly reliable interface is indispensable. Our "OCP-Compatible NearStack ExT Connector" consistently achieves stability and reliability through robust mechanical design, contributing to the efficiency of system integration in smart cities. 【Use Cases】 - Urban infrastructure monitoring systems - Traffic management systems - Energy management systems 【Benefits of Implementation】 - Stable data communication between systems - Accommodation for future system expansions - Streamlined operational management

In research and development settings, flexibility in system construction during experiments and stability in data transmission are essential. Particularly in experiments that require interface construction between different systems or high-speed data communication, reliable connections are indispensable. Inadequate connections can lead to decreased reliability of experimental data and loss of valuable experimental time. Our OCP-compliant NearStack ExT connector addresses these challenges by utilizing NearStack's direct-to-contact Twinax technology to achieve an external mating interface that does not require PCBs in the system. 【Usage Scenarios】 - Experiments requiring high-speed data transmission - Construction of cable-to-cable interfaces between systems - External connections on chassis panels 【Benefits of Implementation】 - Improved experimental accuracy through stable data transmission - Enhanced flexibility in system construction - Realization of reliable external interfaces

This document is a catalog that summarizes products and solutions for data centers and cloud services. It includes high-performance rack servers, storage servers, networking, and power supplies for data centers. We also introduce high-speed connectors suitable for various applications, so please take a moment to read through it. 【Contents】 ■ Portfolio for data centers and cloud services ■ 224Gbps ■ High-performance rack servers ■ Performance improvements for storage server connectors ■ Networking ■ Power supplies for data centers *For more details, please download the PDF or feel free to contact us.