レスター Product Lineup

The "MiniCirc Round Connector" is a product that features IP68 grade protection, a compact design, vibration resistance, and tactile feedback upon full mating. It provides a compact and highly reliable high-performance interconnect solution for high signal applications with space constraints. With a small plug diameter of 6.00mm, it supports up to 6 circuits within a short body. 【Features】 ■ Excellent electrical connection with stability ■ Robust mating structure ■ Sophisticated compact design ■ Secure and reliable mechanical locking ■ Easy integration and cable routing *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "VersaBeam Expanded Beam Connector and Cable" that we handle. The innovative expanded beam connector option integrates 12, 16, or 144 fibers into a single connector, simplifying cable wiring, accelerating deployment to data centers, and reducing total ownership costs. Additionally, by utilizing easily installable connectors and expanded beam technology that reduces inspection frequency, maintenance requirements are minimized. 【Features】 ■ Improved fiber density with blind-mate EBO backplane connectors ■ Enhanced performance for high-speed applications ■ Increased reliability and simplified maintenance ■ Versatility and scalability with up to 144 fibers ■ Simplified cleaning and inspection *For more details, please download the PDF or feel free to contact us.

We would like to introduce the Molex "OCP ORv3 Busbar" that we handle. Developed in accordance with the definitions of the OCP (Open Compute Project) regarding power rack infrastructure. It is an excellent connection solution for power distribution that balances flexibility to meet the demands for space, thermal, and power efficiency, as well as high capacity. 【Features】 ■ Fully customizable and scalable ■ Supports a wide range of power densities and layouts ■ Meets various electrical, mechanical, and thermal requirements ■ Optimized for high density and high-temperature environments ■ Designed to achieve consistent electrical performance ■ Accommodates diverse applications *For more details, please download the PDF or feel free to contact us.

The operation of data storage, management, and computational processing has been accelerating from traditional standalone servers to data centers, and the demand for high-speed data processing and computation is increasing daily. Additionally, handling high-speed and large-capacity data has made addressing issues related to power consumption and heat generation increasingly important. Furthermore, activities aimed at standardizing the architecture used in data centers are gaining momentum through the Open Compute Project (OCP), led by the United States. This has led to a trend where data centers can be designed with "scalability," allowing for flexible specification changes according to requirements. Regarding these trends, we will introduce the respective challenges and solutions. We have released a video of the webinar, so please check it out through the related link below. *For more details, please download the PDF or feel free to contact us.

With the standardization of data center architecture by the Open Compute Project (OCP), the structure has been defined as an Open Accelerator Module (OAM), which allows for the replacement of SoCs (ASICs) and is designed to be separable as a SoC board, providing scalability. Molex's MirrorMezz has been adopted as the standard mezzanine connector for this purpose in the reference model. We have released a webinar video, so please check it out through the related link below. **Main Features of the MirrorMezz Series** - Gender-neutral shape advantageous for high-speed transmission - High-density connector utilizing solder mounting technology with BGA - Terminal arrangement designed for high-speed transmission *For more details, please download the PDF or feel free to contact us.*

Traditionally, separate power supply units (PSUs) were installed for each function, supplying power to each card via a backplane or power cables. However, we faced the following major challenges: Challenges: - Limitations in power routing on the backplane due to increased current capacity - Increased costs from having separate power units for each function - Increased labor hours due to complicated routing with cables The OCP's proposed ORV3 (Open Rack v3) Rack aims to standardize power supply using large busbars, and the applicable connection connectors are also defined. We have released a video of the webinar, so please check it out through the related link below. *For more details, please download the PDF or feel free to contact us.

The heat generated during O/E conversion within optical modules has been a significant issue that cannot be overlooked. However, by equipping the cage that houses the module with a heat sink for natural air cooling, or in cases of high heat generation, a heat sink for forced air cooling using a fan, this issue has been addressed. Nevertheless, the conventional method of simply installing a heat sink has become inadequate in resolving the heat generated due to the enormous amounts of data handled in today's data centers. We have released a video of the webinar, so please check it out via the related link below. 【Future from Conventional Technology】 ■ Conventional: Installation of heat sinks for natural air cooling or forced air cooling ■ Future: Forced air cooling with efficient heat sinks, forced cooling with water cooling *For more details, please download the PDF or feel free to contact us.