プレテック　静岡製作所 Product Lineup

The "Fine Jet" is a cleaning unit that allows for the selection of various frequencies. It meets a wide range of needs for single wafer cleaning with stable oscillation from low to high output. It is suitable for various applications such as cleaning wafer substrates, magnetic disks, and post-CMP cleaning of wafers. Additionally, there are various nozzle options available, including chemical resistance and metal contamination-free types. 【Features】 ■ Fine output adjustment: Stable output adjustment in 1W increments (PT-010J50) ■ Selection of various frequencies available (400kHz/1500kHz/3000kHz) ■ Variety of nozzle options: Chemical resistance, metal contamination-free ■ Enhanced detection function: Capable of detecting transducer degradation (PT-010J50) ■ Enhanced communication function: Monitoring of oscillator status and external settings (PT-010J50) *For more details, please download the PDF or feel free to contact us.

"Fine Score" is a cleaning unit suitable for FPD substrate cleaning and various wafer substrate cleaning. The cleaning width ranges from 160mm to 2210mm, offering a detailed size variation. Additionally, the maximum output increase contributes to the expansion of the cleaning area and cost reduction. Please feel free to contact us if you have any inquiries. 【Features】 ■ Detailed size variation ■ Cleaning width ranges from 160mm to 2210mm ■ Fine output adjustment: stable output adjustment in 1W increments (PT-150MV) ■ Maximum output increase: expansion of the cleaning area and cost reduction ■ Communication functions: monitoring of oscillator status, external settings ■ Compliance with various standards (FCC, CE, RoHS) *For more details, please download the PDF or feel free to contact us.

"Fine Sonic" is a cleaning unit that achieves uniform sound pressure. It allows for stable output adjustment in 1W increments. It is suitable for cleaning various types of wafer substrates, photomasks, magnetic disks, and more. Additionally, it contributes to the expansion of the cleaning area with maximum output increase. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves uniform sound pressure ■ Various frequencies available for selection [750kHz/(1000kHz)/(1500kHz)/2000kHz] ■ Fine output adjustment: stable output adjustment in 1W increments ■ Maximum output increase: expansion of the cleaning area ■ Communication function: monitoring of oscillator status, external settings (PT-150MV) ■ Compliance with various standards (FCC, CE, RoHS) *For more details, please download the PDF or feel free to contact us.

We offer the "Fine Series Cleaning Units," including a batch cleaning unit that uses 750kHz. The "Fine Sonic (Batch Cleaning Unit)" efficiently transmits sound waves through a specially designed vibrating element, removing sub-micron particles without damaging the workpiece. Additionally, we provide the "Fine Jet (Spray Cleaning Tool)," suitable for cleaning silicon wafers and photomasks, as well as the "Fine Scall (Shower Cleaning Tool)," which sprays ultra-pure water infused with 1.5MHz sound waves for cleaning. 【Features】 < Fine Sonic > ■ Batch cleaning unit using 750kHz ■ Efficiently transmits sound waves through a specially designed vibrating element, removing sub-micron particles without damaging the workpiece ■ Suitable for cleaning silicon wafers, photomasks, and magnetic disks *For more details, please refer to the related links or feel free to contact us.

The "Proximity Type Megasonic PA10-Q60AE-S" is a cleaning unit that emits sound waves at 1.0MHz or 3.0MHz from the nozzle tip. It enables high linearity oscillation from a low output range. Since it cleans very close to the substrate, it can remove sub-micron particles. It allows for liquid supply with a cavitation prevention function and enables a sweeping motion on the substrate, achieving highly reproducible cleaning across the entire substrate. 【Features】 ■ The nozzle material is quartz, which has low particle generation and is durable against chemical solutions. ■ Emits sound waves at 1.0MHz or 3.0MHz from the nozzle tip. ■ Enables high linearity oscillation from a low output range. ■ Cleans very close to the substrate, allowing for the removal of sub-micron particles. *For more details, please download the PDF or feel free to contact us.

Our company offers "Ultrasonic Cleaning Units" that support various precision cleaning applications using advanced ultrasonic technology. The ultrasonic oscillator employs high-performance transistors, allowing for the selection of output and frequency suitable for specific applications, known as "Ultrasonic." Additionally, we provide "Sweep Sonic," which continuously varies the wavelength of standing waves generated by ultrasound to completely clear the intensity of ultrasonic energy. Please contact us for inquiries. 【Ultrasonic Features】 ■ Removes particles through cavitation generated by liquid resonance of ultrasound ■ The ultrasonic oscillator uses high-performance transistors, allowing for the selection of output and frequency suitable for specific applications ■ Effective for removing particles larger than 1μ from silicon wafers, magnetic disks, lenses, cassettes (carriers), etc. *For more details, please refer to the related links or feel free to contact us.

The proximity megasonic cleaning unit "PA10-Q60AE-S" directly irradiates high-frequency sound waves of 1.0MHz or 3.0MHz onto the substrate, efficiently removing fine particles and residues in a non-contact manner. Equipped with a unique liquid supply system, it ensures a uniform cleaning area up to the outer edge of the substrate. It minimizes liquid splatter and energy loss, making it suitable for the precise cleaning of semiconductor wafers and photomask substrates with fine structures. The main body is made of high-purity quartz, which has low dust generation and excellent chemical resistance, allowing for combined cleaning with strong acids and strong alkalis. Its direct irradiation method above the substrate is compatible with single-wafer cleaning devices, enabling flexible design for each process. [Applications] - Removal of fine particles from semiconductor wafers - Cleaning of residues after photoresist stripping - Cleaning after TSV, MEMS structures, and film formation, etc. *Demo units are available for you to check the usability. *For more details, please download the PDF or feel free to contact us.

In the photomask industry, the removal of fine particles during the manufacturing process is a critical challenge that affects product quality and yield. In particular, the cleaning of wafers and photomasks requires the removal of submicron-level contaminants. Inadequate cleaning can lead to decreased device performance and the occurrence of defective products. Our cleaning unit, the "Proximity Megasonic PA10-Q60AE-S," enables cleaning close to the substrate and addresses these challenges by removing submicron particles. [Usage Scenarios] - Cleaning of silicon wafers - Cleaning of photomasks - Cleaning after CMP - Batch cleaning [Benefits of Implementation] - Improved yield due to high cleaning performance - Enhanced product quality - Reduced cleaning time

Precision cleaning in the semiconductor industry is a crucial process that affects product quality and yield. Particularly as miniaturization advances, fine foreign substances and residues adhering to wafers and substrates can lead to decreased device performance and defects. Therefore, high cleaning capability and minimizing damage to substrates are required. Fine jets contribute to solving challenges in semiconductor manufacturing by providing stable oscillation from low to high output, addressing various cleaning needs. 【Usage Scenarios】 - Wafer substrate cleaning - Magnetic disk cleaning - Post-CMP wafer cleaning 【Benefits of Implementation】 - Response to a wide range of cleaning needs - Improved yield through high-quality cleaning - Optimal cleaning through diverse nozzle variations

In the electronics industry, substrate cleaning is an important process for ensuring product quality and reliability. Especially in the case of miniaturized electronic components, thorough removal of foreign substances and residues is required. Inadequate cleaning can lead to decreased product performance or failure. Our cleaning unit, "Fine Jet," responds to a wide range of needs for electronic device substrate cleaning with stable oscillation from low to high output. 【Usage Scenarios】 - Cleaning of various wafer substrates - Cleaning of magnetic disks - Wafer cleaning after CMP 【Benefits of Implementation】 - Compatibility with diverse substrates - Improvement in product quality - Yield enhancement

In the glass surface treatment industry, thorough cleaning of the substrate is essential to achieve high-quality surface treatment. In particular, if foreign substances or oil residues remain, it can significantly impair the quality of subsequent coatings or processing. Inconsistent cleaning or insufficient cleaning power can lead to product defects and reduced yield. FineJet allows for the selection of various frequencies, enabling the setting of optimal cleaning conditions for the characteristics of glass substrates and the surface treatment process. 【Usage Scenarios】 - Post-CMP cleaning of glass substrates - Cleaning of various glass substrates - Pre-treatment before surface processing 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased efficiency of the surface treatment process

In the field of chemistry, there is always a demand for improving the efficiency and accuracy of reactions. In particular, the cleaning of reaction vessels and substrates is crucial for the removal of impurities that can hinder reactions. If proper cleaning is not performed, it can lead to delays in reactions or incomplete combustion, ultimately negatively affecting the quality of the final product. Our cleaning unit, "Fine Jet," provides stable oscillation from low to high output, contributing to the efficiency of chemical reaction processes. [Usage Scenarios] - Cleaning of reaction vessels - Cleaning of substrates - Pre-cleaning before reagent preparation [Effects of Implementation] - Improved reaction efficiency - Stabilization of product quality - Reduction of cleaning time

In the metal processing industry, the removal of burrs after machining is crucial for ensuring quality and safety. Especially in the case of precision parts and complex-shaped metal products, complete removal of burrs is required. If burrs remain, they can lead to product malfunctions and safety issues. The cleaning unit "Fine Jet" meets a wide range of needs for burr removal cleaning in metal processing through stable oscillation from low to high output. 【Usage Scenarios】 * Cleaning after burr removal of metal parts * Cleaning of precision machine parts * Cleaning of parts after cutting processing 【Benefits of Implementation】 * Improvement in product quality through reliable burr removal * Reduction and efficiency of cleaning time * Compatibility with various metal materials