エスペック Product Lineup

■Achieves significant space-saving By adopting a slim design with a vertical layout of various components, including the control panel and heater, on the upper part of the main unit, the installation area has been reduced by 20.6% (compared to our company’s standards of capacity/installation area). This enhances productivity on the manufacturing line and effectively utilizes research and development space. ■Door interior is made with integrated pressing The molding of the door interior is done with integrated pressing, eliminating heat loss from metal seams. ■Capable of processing large quantities at once By strengthening the load capacity of the floor and shelves, it has become possible to perform large-scale heat treatment at once. Additionally, the shelves are sliding type, making it easy to load and unload samples. ■Constant temperature atmosphere inside the unit even with damper fully open Equipped with a damper for ventilation operations. Due to significant improvements in heating performance, there are no temperature fluctuations inside the unit caused by the damper opening, maintaining a constant temperature at all times. (When the ambient temperature is +20°C)

It is optimal for vacuum heat treatment such as degassing, deairing, curing, and drying. In a vacuum environment, the boiling point and drying temperature are lowered, allowing for the drying of heat-sensitive samples. In addition to high temperature performance, energy savings have been achieved by enhancing the airtightness and thermal insulation of the chamber. It is equipped with advanced features such as automatic control combining pressure and temperature control, as well as programmable operation for ease of use. 【Features】 ■ Thorough energy-saving mechanism ■ Expanded applications for vacuum heating treatment ■ Double structure inside the chamber that exhibits excellent temperature distribution performance ■ Freely programmable pressure operation mode according to application *For more details, please refer to the PDF document or feel free to contact us.

The "PVHC" is a high-performance oven that maintains high cleanliness even during temperature rises and falls. It is effective for thermal processing of samples requiring Class 5 clean air conditions, as well as for drying parts and equipment, and can be selected from suitable models according to the intended use. With a space-saving vertical slim design, instrumentation using large, highly visible LEDs, and operation keys with Japanese display, usability has been further enhanced. 【Features】 ■ Clean thermal processing with cleanliness class 5 ■ Contamination-free airtight structure ■ Achieves high-precision non-oxidizing atmosphere thermal processing ■ Fully automated operation possible throughout the entire thermal processing process ■ Maintains high cleanliness during temperature rises and falls *For more details, please refer to the PDF materials or feel free to contact us.

The compact high-temperature chamber in a desktop type, which is easy to use and more accessible, achieves a temperature distribution performance of +1.5℃ (at +200℃) despite its small size. ■ Compact High-Temperature Chamber: ST-100・120 / STH-120 *For more details, please refer to the PDF document or feel free to contact us.

It is a direct heating vacuum dryer. It is equipped with a gas replacement function, allowing for processing, baking, degassing, and defoaming in an oxygen-free atmosphere using nitrogen and other gases, making it suitable for a wide range of applications. 【Features】 ■ Direct heating type that enables speedy vacuum drying ■ Color LCD touch panel ■ Remote operation via web browser ■ Ability to copy program patterns ■ E-mail notification function *For more details, please refer to the PDF document or feel free to contact us.

The "LC" is a hot air dryer that demonstrates high temperature distribution performance with a hot air circulation oven using a sirocco fan that smoothly stirs the hot air inside the chamber. It features easy temperature setting via key input and is equipped with an upper limit temperature alarm function, enhancing usability and safety. Additionally, there are safety devices such as a leakage circuit breaker for the power supply and temperature fuses. 【Safety Devices】 ■ SSR overload short-circuit protection breaker ■ Upper limit temperature alarm device ■ Watchdog timer ■ Burnout detection circuit ■ Temperature overheat prevention device *For more details, please refer to the PDF materials or feel free to contact us.

The "LKS-3C・4C/HLKS-3C・4C" is a highly versatile large dryer suitable for various thermal processing steps such as drying, baking, and annealing in production lines. To enhance usability for thermal processing applications, a variety of options are available, including dedicated sample carts, ventilation dampers, and variable wind speed devices. It can be used for large-scale thermal processing in production processes as well as for testing and research purposes. 【Features】 ■ Large dryer suitable for mass thermal processing ■ Equipped with dampers for circulation and ventilation operation ■ Adopts a stirring method to enhance temperature distribution performance ■ Wind speed variable function (optional) to match the thermal processing environment of samples ■ Comprehensive safety measures *For more details, please refer to the PDF materials or feel free to contact us.

This document introduces the low-oxygen clean oven "SCO," which supports large panels of 510×515mm and achieves high-precision heat treatment in low-oxygen and clean environments. It explains the main technological elements that support the structure of the device, focusing on their functional significance and structural innovations. Structural diagrams and various data are also included, so please take a moment to read through it. [Contents] ■ High-precision heat treatment for large panels aimed at practical application of PLP (Panel Level Package) ■ Key technologies of the SCO series that support heat treatment quality in advanced packaging fields ■ Unique filters that achieve uniform temperature distribution ■ High sealing performance realized by magnetic fluid seals ■ Particle suppression through thermal expansion countermeasures ■ Improved safety at high temperatures through external water cooling mechanisms *For more details, please download the PDF or feel free to contact us.

The "PVHC-31S" is a heat treatment solution designed to accommodate large workpieces and more precise heat treatment environments. Its unique structure, which places the cooling water flow path outside the furnace, eliminates dust sources within the furnace and ensures high temperature distribution performance through an efficient cooling mechanism and a simple air conditioning structure. Rapid cooling while maintaining a low-oxygen atmosphere contributes to quality assurance and reduced process time. 【Features】 ■ Supports heat treatment of large panel-shaped workpieces in the 600×600mm class ■ Achieves both low-oxygen atmosphere and high cleanliness, providing a stable process environment ■ Realizes safe and clean cooling capabilities by placing the water cooler outside the furnace ■ Compatible with automatic transport, process data management, and centralized equipment management ■ Allows for system configurations tailored to applications, including automatic doors and various interfaces and upper-level communication specifications *For more details, please download the PDF or feel free to contact us.

We would like to introduce our low-oxygen clean oven for semiconductor packaging, the "SCO Series." By placing the cooling water flow path outside the chamber, we have adopted a unique structure that does not retain water inside the chamber. This ensures extremely high safety while reducing installation space and system electrical capacity by 50% compared to conventional models (compared to our own devices). The SCO Series meets the industry's highest levels of temperature control, low oxygen concentration, and high cleanliness required in various thermal processing steps of advanced packaging manufacturing processes. 【Features】 ■ Compatible with large panels of 515×510mm ■ High-precision thermal processing up to 500℃ ■ Achieves low oxygen concentration control below 10ppm ■ Maintains cleanliness class 4 stably ■ Compatible with automatic doors and GEM communication *For more details, please download the PDF or feel free to contact us.