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Industrial Electrical Equipment
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エスペック

EstablishmentJanuary 13, 1954
capital689500Ten thousand
number of employees1520
addressOsaka/Kita-ku, Osaka-shi/3-5-6 Tenshinbashi
phone0120-701-678
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last updated:Mar 13, 2026
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エスペック Product Lineup

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Constant temperature and humidity / Rapid temperature change Constant temperature and humidity / Rapid temperature change
Contract testing Contract testing
Thermal shock Thermal shock
Oven / Heat treatment Oven / Heat treatment
Advanced Materials Evaluation Advanced Materials Evaluation
Advanced

Advanced Materials Evaluation

Introduction to Advanced Material Evaluation

LV124 Part II One-Stop Solution

We will undertake all necessary tests from the 28 items of LV124 Part II in a single package.

The international standard ISO 16750, widely used as a standard for global procurement of automotive equipment and components, and the LV124 standard created by German automobile manufacturers. Our testing laboratory complies with the evaluation tests based on these standards.

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Commissioned Testing and Calibration Certificate

We leverage our years of experience and achievements to provide comprehensive support for our customers' reliability testing.

At Espec, we have not only been involved in the sale of environmental testing equipment but have also conducted research on environmental testing and developed testing methods for many years. Leveraging our extensive experience and achievements, we undertake reliability testing for our customers, from the design of tests to evaluation and analysis, as well as improvement proposals based on evaluation results, either as individual processes or as a total service. Additionally, we have a new lineup of environmental testing equipment, allowing us to respond to various testing needs based on customer requirements. 【Features】 ■ Test design including surrounding systems (consulting) ■ Publicly recognized testing laboratory ■ Years of experience and achievements ■ Comprehensive support for customer reliability testing *For more details, please refer to the PDF materials or feel free to contact us.

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Spot Cooling and Heating Device for Rapid Cooling and Heating with Constant Temperature Air

Added a new "tip heater type" with a temperature change rate of 100°C/min to streamline the temperature characteristic evaluation of semiconductors and electronic devices.

A chamberless system that sprays air adjusted to temperatures ranging from -40 to +180°C, streamlining testing processes. It can be utilized in combination with various measuring instruments and analysis devices for temperature characteristic testing, failure analysis, and quality testing of semiconductors and electronic devices. 【Features】 ■ Improved Testing Efficiency The advanced heater type has a temperature change rate of 100°C/min (air temperature) and reduces the time for temperature cycling and thermal shock testing by compactly enclosing the sample with an attachment at the nozzle tip. This significantly reduces power consumption. ■ Flexibility The advanced heater type allows the nozzle to be positioned exactly where needed using a horizontal and vertical multi-joint arm. The rear heater type employs a flexible hose, enabling the nozzle to follow the movement of the sample or evaluation device. ■ Testing without a Chamber or Door Using a dedicated attachment, it is possible to cool and heat the sample without any obstructions such as observation window glass or metal from a constant temperature chamber. This enables the evaluation of various in-vehicle sensors, including image sensors (cameras) and millimeter-wave radar, as well as combined evaluations with 3D deformation strain measurement systems and infrared thermography, and non-destructive internal observation of secondary batteries, semiconductors, and printed circuit boards in combination with X-ray transmission devices.

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Conductor Resistance Evaluation System

Continuously measure the micro-resistance values of solder joints and connector connections. Efficiently evaluate the reliability of the connection parts.

Under low and high temperature cycling environments, the minute resistance values of solder joints and connector contact conductors are continuously measured. A system for automatic measurement, data recording, and data processing using a computer has been realized. This allows for more accurate and efficient evaluation of connection reliability, including graphing of data and compatibility with spreadsheet software, as well as data processing via LAN. 【Features】 ■ Equipped with a unique multi-scan method and measurement instruments compliant with international standards ■ Two types: DC current application method and AC current application method ■ Two types of fault determination: absolute value judgment method and change rate judgment method ■ Real-time measurement on a computer, with data editing and viewing possible during measurement ■ Significantly improved testing efficiency through integration with a thermal shock device *For more details, please refer to the PDF document or feel free to contact us.

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Semiconductor Characterization System

Support from package level to wafer level.

High-precision voltage and current application, as well as the electrical characteristics and continuous changes of individual FET transistors, can be measured, allowing for centralized management of data collection and monitoring on a single PC.

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Capacitor Temperature Characteristic Evaluation System (Dielectric Property Evaluation)

Automatic recording of capacitor parameters for temperature and frequency characteristics.

Developed a "Capacitor Insulation Degradation Testing System" that enables automatic evaluation of insulation degradation characteristics of capacitors under high temperature and high humidity testing environments. This system applies voltage to capacitors in any high temperature (high humidity) testing environment and captures leakage current caused by insulation breakdown. It is an automatic measurement system equipped with various data processing and analysis functions, including display of leakage current generation due to insulation breakdown, failure detection and calculation, and failure analysis based on cumulative hazard.

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[Information] Lineup of semiconductor-related testing equipment

Heat management is essential for improving semiconductor performance, ensuring reliability, and extending lifespan!

This document presents a product lineup centered around "thermal solutions." It features devices that comply with semiconductor reliability testing standards for constant temperature and humidity tests, allowing you to select the appropriate model from a wide range based on differences in capacity and temperature-humidity ranges. Among the reliability tests, we also introduce dedicated equipment for thermal shock testing, which accelerates the occurrence of cracks in joints by instantly switching between high and low temperatures. [Contents (partial)] ■ Front-end processes ■ Technology trends ■ Back-end processes ■ Inspection ■ Quality trends ■ Our product proposals *For more details, please download the PDF or feel free to contact us.

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