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Testing, Analysis and Measurement
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マーポス

EstablishmentJune 1970
addressTokyo/Ota-ku/5-34-1 Nambakome, Mapos Building
phone03-3772-7011
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last updated:Jul 30, 2025
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マーポス List of Products and Services

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For the EV industry (electric drive units and battery components) For the EV industry (electric drive units and battery components)
For the processing industry For the processing industry
For the machine tool industry For the machine tool industry
For the forging, rolling, pressing, and die casting industries. For the forging, rolling, pressing, and die casting industries.
For the semiconductor industry For the semiconductor industry
For the healthcare industry For the healthcare industry
Monitoring system for working machinery Monitoring system for working machinery
Non-contact measuring device Non-contact measuring device
Leak test and functional inspection Leak test and functional inspection
Manual gauge Manual gauge
Industrial Computer Software Industrial Computer Software
Measurement component Measurement component
Measuring bench and machine Measuring bench and machine
Non-destructive testing (NDT) using eddy currents Non-destructive testing (NDT) using eddy currents
For

For the semiconductor industry

This is an introduction to solutions for semiconductor manufacturing process control.

Optical Interference Measuring Instrument 'NCG'

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

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High-precision non-contact gauge for measuring nano-layer film thickness 'NCG-R'

Thickness measurement is possible from thick wafers to ultra-thin wafers (less than 1μm).

Non-contact measurements with high precision are achieved without damaging the measured object. Thickness measurements can be performed with extremely high resolution on all types of surfaces and materials, including highly reflective surfaces. The NCG-R system, equipped with a dedicated optical sensor, is designed with high protection performance (such as an enclosure compliant with IP standards), making it suitable for a wide range of applications from post-manufacturing inspections to in-process inspections. Thickness measurements of thin films, coatings, and nano-layers are the standout features of the NCG-R system, demonstrating exceptional performance. The NCG-R controller (visible light type) is compatible with all types of sensor heads, achieving optimized performance tailored to the measurement range and operating environment (such as working distance and spot size).

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Interferometer Controller "HORIZON"

Using interferometric (interferometer) technology, it is possible to measure the thickness of transparent and opaque films.

This is a series of controllers designed to measure thickness and distance in conjunction with optical sensor heads. Utilizing interferometric (interferometer) technology and a dedicated data processing software package, it provides a solution for accurate measurements even in situations where contact with the target area is not possible. With high precision and stability at the sub-micron level, it guarantees reliable measurements with excellent repeatability and accuracy. Additionally, it supports inline process control with real-time monitoring, contributing to improved production efficiency.

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Dicing Machine Sensor "VBI (Blade Inspection System)"

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

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Contact/Non-contact Hybrid Thickness Measurement Application 'P3CF'

Realizing non-contact thickness measurement of various materials that transmit white light.

The P3CF is a measurement system that combines traditional contact probes with a non-contact probe using confocal technology (hybrid measurement). It can directly measure the distance of various materials and the thickness of transparent materials in white light. The thickness of thin and delicate materials (such as ceramics, semiconductor wafers, and epoxy resin mold compounds for packaging) requires precise measurement in the finishing process, but it is challenging to measure with contact methods. The P3CF, which employs confocal technology, measures the thickness non-contact by determining the distance from the reference plane to the work surface. *For more details, please refer to the PDF document or feel free to contact us.*

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Chromatic confocal technology, non-contact measurement for thickness measurement.

It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.

Sensors and controllers using chromatic confocal measurement technology. We offer various options tailored to your work and environment. They are utilized in industries such as automotive, semiconductor, and glass worldwide. <Advantages> - Non-contact technology suitable for measuring soft or opaque materials (e.g., aluminum rolls, copper rolls, lithium-ion battery separators) - Capable of measuring layer thickness from 5µm - Wide measurement range suitable for inline use - High sensitivity and high precision (the reproducibility range of total thickness in actual applications is within 1µm) - Provision of measurement forks or a complete set of gauging equipment - Quick-SPC software option enables statistical processing and data transfer If you have the following challenges, please download the PDF and consult with us. - Variations in work or environment - Synchronization using multiple sensors - Mechanical alignment (tilt or misalignment) - Detailed understanding of measurements - Special applications requiring customization *For more details, please refer to the PDF document or feel free to contact us.

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Collision monitoring and machine protection module 'GEMCMS'

When a collision occurs, the stop signal is activated within 1 ms! It minimizes damage as much as possible.

"GEMCMS" is a highly efficient tool designed to minimize damage caused by collisions. It reduces crash detection time to under 1ms, allowing for valuable time savings and enabling the execution of stop commands in an even shorter time. Additionally, special sensors detect any slight μ-range distortions within the machine structure caused by forces acting on each axis of the spindle. [Features] ■ Minimizes subsequent damage due to programming, setup, and operational errors ■ Reaction time is under 1ms, faster than any NC overload device ■ Capable of detecting both severe collisions and non-impact (quasi-static) collisions ■ Extends machine lifespan ■ Increases machine operating rate *For more details, please refer to the PDF document or feel free to contact us.

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Probe Card Inspection "AOP-PCI"

High-precision 3D surface measurement to meet the demands of complex surface measurements.

AOP-PCI (Probe Card Inspection) is a multifunctional, non-contact, non-destructive inspection tool designed to comprehensively check probe cards. By combining an air bearing stage with state-of-the-art sensors and vision systems, it can obtain high-precision data on the tips, head shapes, and PCB surfaces of full-size square direct dock probe cards. Additionally, dedicated measurement algorithms enable seamless execution of both data acquisition and analysis routines. *For more details, please refer to the PDF materials or feel free to contact us.*

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Optical 3D Surface Roughness and Shape Measurement Device 'VIKING'

Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.

SOLARIUS VIKING is a compact and lightweight optical 3D surface roughness and shape measurement device. By using sensors for measurement, it allows for a different approach compared to traditional microscopes. It is particularly suitable for customers facing challenges in measuring the surface roughness and thickness of materials that are thin, soft, and prone to scratches, such as wafers and lithium-ion battery separators. Utilizing advanced sensor technology, it quickly provides 3D surface topography maps and measurement results compliant with international standards. Additionally, its compact design saves space. With easy setup and high operability, it allows for quick configuration of the 3D optical inspection process, contributing to a reduction in operator workload. More measurements can be conducted in a shorter time. 【Suitable for customers with the following challenges】 - Looking to improve visual tasks or manual measurements - Wanting user-friendly equipment for anyone - Needing machine alignment (tilt or misalignment) - Seeking detailed understanding of measurements and data management - Searching for special applications that require customization *We also welcome inquiries regarding sample measurements. Please feel free to contact us.

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CCD camera-equipped non-contact tool measurement system 'VTS SF-45'

Achieved significant miniaturization while maintaining top-class repeatability and measurement performance. Can be installed in limited spaces such as mold processing machines and precision machining equipment.

The "VTS SF-45 Compact" is a non-contact imaging camera tool setter for CNC machines that adapts to limited space within the machine. It has achieved significant miniaturization while maintaining previous measurement performance. An air shutter covers and protects the optical lens, designed with harsh machine environments in mind. *For more details, please refer to the PDF document or feel free to contact us.*

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CCD camera-equipped non-contact tool measurement system 'VTS WF'

Expanding the measurement area while maintaining top-class repeatability and measurement performance. Ideal for measuring grinding tools and special-shaped tools, as well as wear management.

The "VTS WF (Wide Field)" is a non-contact imaging camera tool setter optimized for measuring special tools that are crucial for ultra-high precision machining on CNC machines. It is specifically designed for applications in high-precision turning centers and lathes. Depending on the frame range size, it can measure tools with a diameter of up to 2.9 mm for double-sided and up to 80 mm for single-sided. An air shutter covers and protects the optical lens, designed with consideration for harsh machine environments. The camera tool setter can also be used to measure complex-shaped tools and grinding tools, such as grinding wheels, which are difficult to measure with other tool setters. It enables the measurement and management of tools that require high quality and machining precision, which have previously been challenging to automate (unmanned), contributing to increased production efficiency and reduced labor. *For more details, please refer to the PDF document or feel free to contact us.*

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