マーポス Product Lineup

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

Non-contact measurements with high precision are achieved without damaging the measured object. Thickness measurements can be performed with extremely high resolution on all types of surfaces and materials, including highly reflective surfaces. The NCG-R system, equipped with a dedicated optical sensor, is designed with high protection performance (such as an enclosure compliant with IP standards), making it suitable for a wide range of applications from post-manufacturing inspections to in-process inspections. Thickness measurements of thin films, coatings, and nano-layers are the standout features of the NCG-R system, demonstrating exceptional performance. The NCG-R controller (visible light type) is compatible with all types of sensor heads, achieving optimized performance tailored to the measurement range and operating environment (such as working distance and spot size).

This is a series of controllers designed to measure thickness and distance in conjunction with optical sensor heads. Utilizing interferometric (interferometer) technology and a dedicated data processing software package, it provides a solution for accurate measurements even in situations where contact with the target area is not possible. With high precision and stability at the sub-micron level, it guarantees reliable measurements with excellent repeatability and accuracy. Additionally, it supports inline process control with real-time monitoring, contributing to improved production efficiency.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

The P3CF is a measurement system that combines traditional contact probes with a non-contact probe using confocal technology (hybrid measurement). It can directly measure the distance of various materials and the thickness of transparent materials in white light. The thickness of thin and delicate materials (such as ceramics, semiconductor wafers, and epoxy resin mold compounds for packaging) requires precise measurement in the finishing process, but it is challenging to measure with contact methods. The P3CF, which employs confocal technology, measures the thickness non-contact by determining the distance from the reference plane to the work surface. *For more details, please refer to the PDF document or feel free to contact us.*

Sensors and controllers using chromatic confocal measurement technology. We offer various options tailored to your work and environment. They are utilized in industries such as automotive, semiconductor, and glass worldwide. <Advantages> - Non-contact technology suitable for measuring soft or opaque materials (e.g., aluminum rolls, copper rolls, lithium-ion battery separators) - Capable of measuring layer thickness from 5µm - Wide measurement range suitable for inline use - High sensitivity and high precision (the reproducibility range of total thickness in actual applications is within 1µm) - Provision of measurement forks or a complete set of gauging equipment - Quick-SPC software option enables statistical processing and data transfer If you have the following challenges, please download the PDF and consult with us. - Variations in work or environment - Synchronization using multiple sensors - Mechanical alignment (tilt or misalignment) - Detailed understanding of measurements - Special applications requiring customization *For more details, please refer to the PDF document or feel free to contact us.

"GEMCMS" is a highly efficient tool designed to minimize damage caused by collisions. It reduces crash detection time to under 1ms, allowing for valuable time savings and enabling the execution of stop commands in an even shorter time. Additionally, special sensors detect any slight μ-range distortions within the machine structure caused by forces acting on each axis of the spindle. [Features] ■ Minimizes subsequent damage due to programming, setup, and operational errors ■ Reaction time is under 1ms, faster than any NC overload device ■ Capable of detecting both severe collisions and non-impact (quasi-static) collisions ■ Extends machine lifespan ■ Increases machine operating rate *For more details, please refer to the PDF document or feel free to contact us.

The "VTS SF-45 Compact" is a non-contact imaging camera tool setter for CNC machines that adapts to limited space within the machine. It has achieved significant miniaturization while maintaining previous measurement performance. An air shutter covers and protects the optical lens, designed with harsh machine environments in mind. *For more details, please refer to the PDF document or feel free to contact us.*

In the semiconductor industry, accurate thickness measurement of wafers and thin films is essential to improve product quality and yield. Particularly as miniaturization progresses, even slight deviations in film thickness can significantly impact product performance, necessitating high-precision measurements. The optical interference measurement device 'NCG' is designed to manage the thickness of various materials such as glass, plastic, and silicon wafers using optical interference technology. 【Application Scenarios】 - Thickness measurement in the wafer manufacturing process - Quality control in the thin film formation process - Quality assurance in semiconductor device manufacturing 【Benefits of Implementation】 - Guarantees processing accuracy within the desired tolerances - Reduces cycle time - Maintains controlled and stable production