KITZ SCT Corporation Product Lineup

This product is a valve that can automatically open and close the bypass valve using air drive. It is equipped with an emergency shut-off function, allowing the bypass valve to automatically shut off in case of an emergency. It enables switching between large flow and small flow with a single valve, contributing to space-saving in applications such as chemical filling lines. 【Features】 ■ The bypass valve can also be automatically opened and closed using air drive. ■ Switching between large flow and small flow is possible with a single valve. ■ Helps save space in applications such as chemical filling lines. ■ In case of an emergency, the bypass valve can also be automatically shut off. *KITZ SCT offers various solutions for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

This product is a valve with a suck-back function that prevents liquid dripping from the nozzle tip when the fluid is stopped. We offer a "suck-back valve single valve" with only the suck-back function, and a "suck-back valve + ON/OFF automatic valve integrated" for liquid ON/OFF and suck-back function. It helps improve metering accuracy in coating processes and chemical filling processes. 【Features】 ■ With suck-back function ■ Prevents liquid dripping from the nozzle tip when the fluid is stopped ■ Helps improve metering accuracy in coating processes and chemical filling processes # Suck-back valve *KITZ SCT provides various proposals for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

The "FCDN series" is a valve that is clean, easy to use, and has high sealing performance against back pressure. The "automatic valve with flow adjustment" allows for arbitrary setting of the full open flow rate. Valve sizes available are 1/4", 3/8", 1/2", 3/4", and 1", with fluid temperatures ranging from 5 to 100°C and ambient temperatures from 0 to 60°C. 【Specifications (excerpt)】 ■ Fluid temperature: 5 to 100°C ■ Ambient temperature: 0 to 60°C ■ Pressure resistance: 1.0 MPa ■ Seat leakage: 0 cm3/min (under water pressure) ■ Drive method: N.C./N.O./double acting *KITZ SCT offers various proposals for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

The "FCDN series" is a valve that is clean, easy to use, and has high sealing performance against back pressure. The "automatic valve with bypass" prevents fluid stagnation through the bypass flow path even when the valve is closed, and allows for water saving by adjusting the bypass valve opening. Valve sizes available are 1/4", 3/8", 1/2", 3/4", and 1", with fluid temperatures ranging from 5 to 100°C and ambient temperatures from 0 to 60°C. 【Specifications (excerpt)】 ■ Fluid temperature: 5 to 100°C ■ Ambient temperature: 0 to 60°C ■ Pressure resistance: 1.0MPa ■ Seat leakage: 0cm3/min (under water pressure) ■ Drive method: N.C./N.O./double acting *KITZ SCT offers various proposals for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

The WET series resin valve "FCDN series" is a clean and easy-to-use valve with high sealing performance against back pressure. The "automatic valve with flow adjustment + bypass" is a composite valve that serves three functions: flow setting, air-driven opening and closing, and ensuring a bypass flow path. Valve sizes are available in 1/4", 3/8", 1/2", 3/4", and 1", with fluid temperatures ranging from 5 to 100°C and ambient temperatures from 0 to 60°C. 【Specifications (excerpt)】 ■ Fluid temperature: 5 to 100°C ■ Ambient temperature: 0 to 60°C ■ Pressure resistance: 1.0 MPa ■ Seat leakage: 0 cm3/min (under water pressure) ■ Drive method: N.C./N.O./double acting *KITZ SCT offers various proposals for fluid-related concerns in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

The "FCDN Series" is a valve that is clean, easy to use, and has high sealing performance against back pressure. It includes a range of products such as "manual valves and automatic valves with manual operation" made of fluororesin, which are compatible with ultra-pure fluids, as well as "automatic valves with flow adjustment" and "automatic valves with bypass" that allow for customizable full flow rates. Please choose according to your application. 【Product Lineup (Excerpt)】 ■ FCD Manual Valve ■ FCD Automatic Valve ■ FCD Automatic Valve (with various functions) - Automatic valve with flow adjustment - Automatic valve with bypass - Automatic valve with flow adjustment + bypass *KITZ SCT offers various solutions for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

"FCDT" is a WET-type valve that can handle fluids at 200°C. The automatic valve comes standard with an indicator (open/close display), while the manual valve features a LOTO (lock) mechanism for safety measures. Additionally, the manual valve adopts a step toggle operation method that allows for three levels of opening settings, enabling not only full open but also intermediate openings (two levels). [Features] ■ Compatible with fluids at 200°C ■ Automatic valve comes standard with an indicator (open/close display) ■ Manual valve features a LOTO (lock) mechanism for safety measures ■ Manual valve adopts a step toggle operation method that allows for three levels of opening settings, enabling not only full open but also intermediate openings (two levels) *KITZ SCT offers various proposals for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF document or feel free to contact us.

This is a technical document summarizing the valves used for each piece of equipment and facility in semiconductor manufacturing plants. It includes examples of our products and the conditions required for valves in various processes, from process equipment such as deposition systems, etching systems, and cleaning systems, to facilities like cylinder cabinets, gas purification systems, liquid supply systems, VMB, exhaust systems, and utility piping. Please feel free to use this as a reference for product selection. [Contents (partial)] ■ Products used in deposition systems (single wafer/batch/vertical) ■ The role of etching systems and the valves used ■ The role of cleaning systems and the valves used ■ Valves used in equipment and systems supporting the deposition process *For more details, please download the PDF or feel free to contact us.