KITZ SCT Corporation Product Lineup

The "TBN Series" is a leak-free, clean, lightweight, and compact resin welded joint. It has no sliding parts on the inner surface of the connection, which excels in particle characteristics, and provides a complete seal through butt welding of the joint and tube end faces, eliminating the need for re-tightening and concerns about liquid leakage. Additionally, by extending the tube section, it allows for direct installation of sleeve press-fit type joints, achieving reduced construction time and compact piping design. 【Features】 ■ Leak-free, clean, lightweight, and compact ■ Easy to achieve the shortest welding ■ Direct press-fitting of sleeves possible ■ "Piping kits" with TBN joints and PFA tubes are available *KITZ SCT offers various solutions for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

The "PFM Series" inherits the conventional specifications such as improved workability, a wide range of applications, and ease of use, while incorporating new features such as a new heater and button options for safety measures, enhancing welding quality, durability, operability, and safety. 【Features】 ■ Adopts a high-performance heater with rapid heating and uniform temperature, maintaining performance equivalent to the initial state even after long-term use. ■ Enables the shortest welding by using our PFA welding fittings TBN series. ■ Option to select a double switch mechanism for safety measures. ■ Easy operation following the operation guide displayed on the touch panel, with the ability to register multiple welding conditions. ■ Wide range of applications. ■ Various other options available. ■ Welding targets: TBN fittings, PFA tubes: 1/4” to 1-1/2”. ■ Power specifications: AC200-220V 50/60Hz 660VA. *KITZ SCT offers various proposals for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.

This is a technical document summarizing the valves used for each piece of equipment and facility in semiconductor manufacturing plants. It includes examples of our products and the conditions required for valves in various processes, from process equipment such as deposition systems, etching systems, and cleaning systems, to facilities like cylinder cabinets, gas purification systems, liquid supply systems, VMB, exhaust systems, and utility piping. Please feel free to use this as a reference for product selection. [Contents (partial)] ■ Products used in deposition systems (single wafer/batch/vertical) ■ The role of etching systems and the valves used ■ The role of cleaning systems and the valves used ■ Valves used in equipment and systems supporting the deposition process *For more details, please download the PDF or feel free to contact us.