日本エンギス List of Products and Services

At Japan Engis, which offers a full range of wrapping and polishing equipment, we are currently giving away our "Comprehensive Catalog," which includes the latest products, for free! Notably, we have the 'Bore Finish System' for the automotive and hydraulic industries. This new product improves inner diameter dimensional accuracy compared to traditional honing machine finishes! It significantly enhances production efficiency and reduces costs. Additionally, we have a wide variety of consumables listed, including slurries, brushes, and polishing cloths. ◎ We are currently accepting "live demonstrations" at our lab! Please contact us through "Inquiries." 【Contents Included】 ■ Precision wrapping equipment ■ Multifunctional polishing system "Trinity-Y" ■ Precision large wrapping/polishing equipment ■ Precision grinding machine series ◎ Other items listed include wrapping accessories, diamond slurries, polishing slurries, polishing cloths, wrapping plates, diamond pastes, and polishing materials for mold finishing, among many others!

The ultra-precision single-sided lapping machine 'EJW-400I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ380 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine 'EJW-460I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ460 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine 'EJW-610I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ610 mm】 <Features> - Can be used for polishing various materials by selecting different plates (lapping plates) - Can be equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping device 'EJW-710I' is a highly versatile machine that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ710 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Can be equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping device 'EJW-910I' is a highly versatile machine that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ910 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Can be equipped with a facing device (automatic plate correction device) - Standard water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine "EJW-1200IN" is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ1200 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standardly equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The compact tabletop automatic wrapping machine EJ-200I minimizes the installation space with its compact body. It is a tabletop wrapping device that can meet a wide range of needs, not only for research and development applications such as sample polishing and polishing of various small parts, but also for full-scale precision polishing processing. <Features> - Automation of precision mirror surface processing - Compact design for space-saving installation

The "Facing Unit" can be mounted on the ultra-precision single-sided lapping device "EJW Series." Models equipped with the Facing Unit allow anyone to easily correct the flatness of the lapping plate in just a few minutes. <Features> - High-precision plate correction is possible for anyone with ease. - In higher models (GNC), spiral groove machining on the plate is also possible.

The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.

The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.

The multi-layout multifunctional wrapping system "Trinity-Y" is a device developed to accommodate next-generation materials such as wide-gap semiconductors. It allows for the flexible selection of mechanisms optimal for various new materials, consolidating these functions into a single unit to achieve space-saving design and build a highly functional processing system without waste. For more details, please contact us or download the catalog.

The ALMET metal wrapping plate is a base plate made by mixing special metals with tin. It is ideal for precision finishing of various composite materials and more. <Product Lineup> - ALMET-510D - ALMET-515D - ALMET-518D - ALMET-5111D - ALMET-825D

The materials of the high-pressure composite wrapping plates are a composite of polymer and metal powder, possessing a certain degree of flexibility and elasticity, which uniformly retains and fixes the diamond for grinding. <Product Lineup> - HYPREZ Iron: For rough processing - HYPREZ Copper: For intermediate finishing - HYPREZ Ceramic: For intermediate finishing - HYPREZ Tin TX-10: For finishing processing

There are various types of polishing liquids.

The ultra-precision single-sided lapping machine 'EJW-460IF' is a highly versatile device equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ460 mm】 <Features> - Can be used for polishing various materials by selecting different plates (lapping plates) - Equipped with a facing device (automatic plate correction device) - Standard water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine 'EJW-610IF' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ610 mm】 <Features> - Can be used for polishing various materials by selecting different plates (lapping plates) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine 'EJW-710IF' is a highly versatile device equipped with a facing unit. The model with the facing unit allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that thoroughly pursue precision, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ710 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate). - Capable of equipping a facing unit (automatic plate correction device). - Standard equipped with a water cooling mechanism (cooling device required separately). - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping device 'EJW-910IF' is a highly versatile machine equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ910 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The ultra-precision single-sided lapping machine 'EJW-1200IF' is a highly versatile device equipped with a facing unit. The model with the facing unit allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that thoroughly pursue precision, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ1200 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of equipping a facing unit (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

The tabletop one-sided wrapping device 'EJ-380' is a tabletop model wrapping device that enables the automation of mirror surface processing. 【Usable table plate outer diameter: Φ380 mm】 <Features> - Can be used for polishing various materials by selecting the table plate (wrapping plate). - Automation of polishing is possible by combining the minimizer (slurry supply device) and the auto-stirrer (slurry stirring device). *Please feel free to contact us if you have any requests.

"HYPREZ Diamond Gel" is a gel-type abrasive that is ideal for polishing molds. Since "HYPREZ Diamond Gel" does not need to be diluted like diamond paste, it eliminates the hassle of dilution and ensures uniform polishing power. Additionally, being in gel form, it does not run off, providing excellent workability. 【Features】 ■ The gel effect retains the tool, allowing highly dispersed diamond abrasives to exhibit high polishing performance. ■ Suitable for various applications and materials as a hand wrap. ■ Available in both water-based and oil-based options. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

The "Wrapping Stick" comes in three types: Hard, Soft, and Very Soft. - Hard Wood Stick: Laminated boards combined based on the direction of the wood grain are high-pressure compressed and fully bonded with resin. It is easy to shape and maintains its form well. Detailed hand processing allows for precise diamond wrapping in the mold. - Soft Wood Stick / Very Soft Wood Stick: These sticks are designed for intermediate or final finishing. They can be used with fine diamond compounds to achieve a mirror finish.

This is a concentrated slurry formulated for mold polishing that requires a large amount of stock removal. Despite the high diamond concentration, it has excellent dispersion, ensuring that the amount of abrasive supplied to the mold polishing surface remains consistently stable, which maintains a uniform polishing precision.

The "Polishing Brush" comes in three types: straight, wheel, and cup. The brushes use natural hair. They have a long lifespan, and the hard bristles retain diamond compound for an extended period, enhancing the cutting ability of the diamond.

The hand-polishing abrasive "High Press Diamond Paste" comes in three types: W, OS, and L, tailored for different applications. ■ W Type Diamond Paste - A water-soluble paste that can be easily cleaned after polishing. - Ideal for tasks that are difficult with oil-based compounds. - If adding a lubricant, please use W type lubricant. ■ OS Type Diamond Paste - An oil-based, so-called oily paste. - Oil-based lubricants facilitate rapid cutting during lapping. It contains more lubricating material and has a self-lubricating effect. - If adding a lubricant, please use OS type lubricant. ■ L Type Diamond Paste - Suitable for wire drawing dies and heading dies. - Wire drawing carbide dies and heading dies require extremely dense diamond compounds. It is important to supply lubricant to the lapping area as needed according to the cutting cycle. - Also used for flat lapping of hard tools, mechanical seals, and other applications with significant material removal.

The ultra-precision single-sided lapping machine 'EJW-400IF' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ380 mm】 <Features> - Can be used for polishing various materials by selecting different plates (lapping plates) - Equipped with a facing device (automatic plate correction device) - Standard water cooling mechanism (additional cooling equipment required) - Compatible with various options* *Please feel free to consult us if you have any requests.

Engis, which developed diamond slurry based on the demands of the electronics industry, supplies a variety of ultra-precision slurries.

"HYPREZ Diamond Gel" is a gel-type abrasive that is ideal for polishing molds. Since there is no need to dilute it like diamond paste, it saves the hassle of dilution and ensures uniform polishing power. Additionally, because it is in gel form, it does not run off, providing excellent workability. 【Features】 ■ The gel effect allows the tool to hold the highly dispersed diamond abrasives, demonstrating high polishing performance. ■ Suitable for various applications and materials as a hand wrap. ■ Available in both water-based and oil-based options. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

Nihon Engis Co., Ltd. has an in-house lab capable of developing cutting-edge polishing processing technologies and new materials. Since its founding in 1983, the company has consistently worked to improve wrapping technology through the development of advanced wrapping machines and diamond slurries. We are currently offering the latest handbook titled "Fundamentals of Wrapping & Polishing" created by Nihon Engis for free! 【Contents】 - Positioning of polishing - What is the difference between wrapping and polishing? - Types of wrapping and processing mechanisms - Types and properties of diamond abrasives - Types and characteristics of slurries - What is the principle of classification? - About wrapping devices - Types of wrapping plates - What is Preston's law? - What is the Twyman effect? - Processing examples Additionally, we are offering the latest handbook "Fundamentals of Polishing Processing & Wrapping," which includes various data and processing images related to polishing, for free! *If you are interested, please download it from the link below.

The tabletop CMP polishing machine 'EJ-380IN-CH-D' features a compact body that minimizes the installation space. It is a versatile tabletop lapping device that can meet a wide range of needs, from polishing sample pieces and small quantities of various parts for research and development purposes to full-scale precision polishing. <Features> - Automation of precision mirror surface processing - Body design with excellent chemical resistance 【Usable platen outer diameter: Φ380 mm】 Additionally, this device will be exhibited at the 27th Monozukuri World [Osaka] held at Intex Osaka from October 2 (Wednesday) to October 4 (Friday), 2024. Booth number: Hall 6, 38-5* We sincerely look forward to your visit. *Please feel free to consult us if you have any requests.

Engis Corporation's vertical grinding machine is a grinding system designed for hard and brittle materials, equipped with a high-rigidity and high-precision spindle (Engis HVG model). It achieves low-cost and high-precision wafer processing through semi-automatic control. Optional features include an auto-dressing mechanism for the grinding wheel, various thickness sensors for endpoint control of wafer thickness, and in-process thickness measurement technology. This equipment will be exhibited at SEMICON JAPAN 2024, held at Tokyo Big Sight from December 10 (Wednesday) to December 13 (Friday). We sincerely look forward to your visit. *Please feel free to contact us if you have any requests.