日本技術産業 List of Products and Services

The "ADT7300 series" is a single-axis dicing saw capable of dicing square-shaped workpieces. The "7302" consists of two options: a broken blade detector (BBD) and a high-output 2-inch spindle with a maximum power of 2.2 kW. The "7304" is a fully automatic dicing saw equipped with a high-output spindle of up to 2.5 kW for dicing hard materials, capable of using blades with a maximum outer diameter of 5 inches, and can cut workpieces up to 10 mm thick. 【Features】 <7302> ■ Composed of two options - Broken blade detector (BBD) - High-output 2-inch spindle with a maximum power of 2.2 kW <7304> ■ Equipped with a high-output spindle of up to 2.5 kW for dicing hard materials ■ Fully automatic 4-inch dicing saw ■ Can be configured with blades with a maximum outer diameter of 5 inches ■ Can cut workpieces up to 10 mm thick *For more details, please refer to the related links or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The ADT Corporation's "8030 Series" is a twin dicing machine capable of cutting semiconductor wafers up to 12 inches in diameter with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high efficiency in processing. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Bridge-type frame - Flexibility – supports hubs with a maximum outer diameter of 3 inches and hubless blades - Dual microscopes, fixed non-contact sensors, and two dress stations - High-output spindles of 1.8kW or 2.2kW - Excellent vision system with continuous zoom magnification - Intuitive operating interface using a large 19-inch touch screen monitor *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

This product is a lithium-ion storage system that uses a high-capacity lithium-ion battery. It is a standalone type that is compact and can be left in unnecessary places. It responds to unexpected power outages with an automatic power outage mode, and by using electricity charged with inexpensive nighttime power during the day, it can reduce electricity costs and keep power consumption peaks low. 【Features】 ■ Two output sockets on the front of the unit ■ Timer control and alarm buzzer included ■ Compact and can be left in unnecessary places, standalone type ■ Responds to unexpected power outages with automatic power outage mode ■ Reduces electricity costs and keeps power consumption peaks low *For more details, please refer to the PDF document or feel free to contact us.

• Lithium-ion battery
• others

The "Bimi Shoku Series" is an LED lighting that deliciously enhances the color "red." Thanks to our unique technology, it emits a natural light color while vividly showcasing the colors of various ingredients at specific wavelengths. With light that highlights the vibrant colors and luster of fresh seafood, as well as the freshness of colorful vegetables and fruits, why not create an atmosphere that makes customers want to eat? 【Features】 ■ Made in Japan ■ No visible dots from the light source ■ Custom orders can be accommodated in small quantities ■ OEM available starting from 1,000 units ■ Customizable according to customer needs In addition, we also offer insect-repellent lighting, the "UV-Cut LED Tube Light," which enhances insect-repellent performance by cutting wavelengths that attract insects while providing a white, natural light color. Please feel free to inquire about general LED lighting as well. *For more details, please refer to the PDF document or feel free to contact us.

• LED lighting

The ADT-made "8020 Series" is a fully automatic dicing machine capable of cutting semiconductor wafers with a diameter of up to 8 inches with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high processing efficiency. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Supports hub/hubless blades up to 3" O.D. - High-power spindles of 1.8kW or 2.4kW - Excellent vision system with continuous zoom - Improved throughput with high-speed automatic alignment and cutting positioning *For more details, please refer to the materials. Feel free to contact us as well.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "AR-927 Water Recycling Device" is a dicing water recycling system that solves the water issues associated with dicing water. It guarantees suitable water quality, temperature, and volume, achieving a reduction in water consumption. Additionally, it reduces industrial waste and operational costs, and offers options such as pure water modules and UV cleaning. 【Features】 ■ Reduction of water consumption ■ Guarantee of suitable water quality, temperature, and volume ■ Reduction of industrial waste ■ Reduction of operational costs *For more details, please refer to the PDF document or feel free to contact us.

• Water treatment equipment
• Other water treatment equipment

The "967 Wafer Mounting Machine" is a compact tabletop semi-automatic die-cutting sheet mounting device. It does not require pre-cut tape and is compatible with all standard tapes. Compared to manual mounting, it saves 25% of tape usage. Additionally, it displays the working mode and alarms on an LCD, ensuring high quality and high reliability. 【Features】 ■ Procedure management and hands-free operation ■ No bubbles ■ Tabletop design ■ Roller pressure adjustment ■ Compatible with all die-cutting tapes up to 8 inches ■ Fast, easy, and user-friendly *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer
• others

The "Resin Bond Blade" is a dicing blade composed of abrasives embedded in a resin bond base. The blade's edge continuously exposes new diamonds, and the speed is controlled to keep the edge sharp, achieving highly accurate cuts with remarkable yield and long blade life. It is suitable for hard and brittle materials such as alumina, glass, and quartz. 【Features】 ■ Self-sharpening base that exposes diamonds ■ Excellent cutting performance ■ Base suitable for hard, durable, and complex materials ■ Highly precise dicing ■ Attractive ownership cost *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment
• Plastic processing machines (cutting and rolling)

The "Nickel Bond Blade" is a dicing blade composed of an abrasive embedded in a nickel bond substrate. It is manufactured using an artistically controlled electronic forming process, ensuring that diamonds are uniformly distributed throughout the nickel layer. This process not only allows the blade to be manufactured with extremely tight tolerances but also enables customization to meet specific customer requirements regarding particle size, hardness, and distribution. 【Features】 ■ Excellent wear resistance with a hard binder ■ Extremely thin blades (down to .0008”) ■ Outstanding durability against high exposure ■ Highly precise dicing ■ Exceptional blade longevity *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment
• Plastic processing machines (cutting and rolling)

The "Metal Sintered Dicing Blade" is a dicing blade composed of abrasives embedded in a metal substrate. Through a unique closed mold sintering process, the particle size of the diamond, the density of the diamond, and the metal binder are optimized to meet specific application precision and blade lifespan according to needs. The metal binder provides an extremely stable, stress-free substrate, and can be customized to meet the hardness and load resistance required for various dicing applications. 【Features】 ■ Various substrates for a wide range of applications ■ Low wear and long blade lifespan ■ High precision in blade dimensions ■ High precision in dicing ■ Attractive ownership cost *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment
• Plastic processing machines (cutting and rolling)

The "7900 Uno" is an automatic, single-spindle dicing device. The "model 7910" consists of a 2" spindle and an 8" size. It features an easy-to-use, intuitive, GUI-based touch screen. It has a small installation footprint, is compact, and easy to maintain. In addition to performing cutting surface inspection, quality analysis, process data collection, and statistical analysis, it also has compatibility technology with the 7900 dual spindle device. 【Features】 ■ Low ownership costs ■ Small installation footprint and compact ■ High reliability and high precision ■ Optimization of dicing time ■ Yield improvement and cost reduction functions *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "7220 Series" is a space-saving fully automated device that widely offers advanced automation and process monitoring mechanisms that meet the productivity and quality required for challenging dicing. Starting with efficient wafer transport systems for streamlined operations, it enhances productivity by shortening height measurement time through rapid and accurate alignment and a blade wear prediction algorithm. In addition to automatic blade sharpening with a dedicated dress cassette, it also excels in operability with a touch panel display. 【Features】 ■ Streamlined operations with efficient wafer transport systems ■ Rapid and accurate alignment with continuous digital image magnification devices ■ Reduced height measurement time with blade wear prediction algorithms ■ Excellent process results with spray-type wafer cleaning technology ■ Quality assessment during the process with built-in inspection trays *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "7100 Series proVectus Dicing System" is a device designed with an inclined spindle function that allows for vertical cutting of optical electronic materials while also enabling adjustment for inclined dicing within a range of 0° to 15° within a few minutes thereafter. Thanks to an overall process solution specifically developed for blades, dicing parameters, and your company's components, it provides excellent adjustment of spindle angles, resulting in highly accurate inclined cuts and surface finishes. The quality of these cuts is high, significantly reducing the need for additional polishing, although it does not completely eliminate it. It is designed to meet the needs of optical electronic component manufacturers. 【Features】 ■ Quick conversion to any angle from vertical (0°) to 15° ■ Dedicated operating station with programmable angle settings for both angles ■ Field adjustment capability ■ Angle reproducibility of 0.1° ■ Resolution of 0.1° *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "ATD Model 7100 XLA" is a large panel dicing machine that accommodates sizes up to 24"×18". The chuck is customizable for user specifications and can support both clamped and unclamped options, as well as processing with or without tape. Loading and unloading are easy, and maintenance can be performed with ease. The monitor is adjustable and rotatable, and it comes with a USB hub. 【Features】 ■ Large panel size up to 24"×18" ■ Applications: Glass plates, PCBs, copper-clad FR4, QFN, etc. ■ Customizable chuck for user specifications ■ Supports clamped and unclamped options ■ Processing with or without tape *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

This document introduces the automatic dicing machines of the '7120/7130 series'. We offer the standard model "Dicing Saw 7120 Series" with a stroke of up to 8 inches, and the standard model "Dicing Saw 7130 Series" with a stroke of up to 12 inches. It includes improvements to the hardware from the "old version 7100," which has been on the market for over 10 years, as well as new software features and enhancements. [Contents] ■ Model ■ Hardware Improvements ■ Low Vibration Spindle ■ New Software Features ■ Software Enhancements *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The "7120/7130 series" is a low-vibration spindle device available in 2" and 4" sizes, providing satisfactory usability and flexibility in response to your requirements. The turntable features high torque and high precision (1 micron). It has a long travel distance on the X-axis, making loading and unloading easy. Additionally, thanks to a unique algorithm, it can predict blade wear rates based on average blade consumption time, reducing wear rates to one-third of traditional methods and increasing production per hour. 【Features】 ■ Multiple panel dicing ■ Equipped with a high-resolution camera (2000×2000 pixels) ■ Easy loading and unloading ■ Easy maintenance ■ Supports customer-specific process specifications *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

The Japanese technology industry's "Wafer Mounter" is a compact tabletop semi-automatic die-cut sheet mounting machine. It is compatible with all standard tapes and does not require pre-cut tape. Compared to manual mounting, it uses only 25% of the tape, making it economical. Despite its minimal footprint tabletop design, it boasts accurate sequencing without air bubbles. 【Features】 ■ Procedure management and hands-free operation ■ No air bubbles ■ Minimal footprint, tabletop design ■ Adjustable roller pressure ■ Compatible with all standard tapes *For more details, please refer to the PDF document or feel free to contact us.

• Sealing machine

- Easy to handle due to built-in power supply - Design life of approximately 40,000 hours

• LED fluorescent lamp
• LED Module