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  1. Home
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  3. SETO ENGINEERING 守谷事業所
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SETO ENGINEERING 守谷事業所

EstablishmentApril 11, 2016
capital500Ten thousand
addressIbaraki/Moriya-shi/1575-1 Bandotō,
phone0297-21-3399
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last updated:Nov 26, 2020
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Roll to Roll Winding/Unwinding Device [Base Material Width: 1 to 1,200mm]

Roll-to-roll winding/unwinding equipment compatible with PET materials, copper foil, and copper-clad laminates! We can propose either winding or unwinding equipment!

In roll-to-roll web handling, we specialize in thin materials that are considered to be high in difficulty and require low-tension transport. We can propose winding/unwinding devices suitable for various materials, including thick and thin, long and short, resin films, and metal foils. We can also provide suggestions for various processing machines (laser, printing machines, sheet surface treatment devices), so please feel free to consult with us. 【Supported Materials】 ■ Material Types - Resin: PET, PI (Polyimide), PEN, etc. - Metal: Copper foil, aluminum foil, stainless steel, etc. - Others: Copper-clad laminates (CCL), aluminum composites, etc. ■ Material Width: 1mm to 1,200mm ■ Thickness: 10μm to 200μm *For more details, please refer to the PDF document or feel free to contact us.

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Tabletop Roll-to-Roll Experimental Machine that can be installed with a low budget and in a compact space.

The roll-to-roll device, which could only be realized in large sizes until now, has been achieved in a compact size of 1.3m x 0.8m! It enables a wide variety of processing.

We would like to introduce our "Tabletop Roll-to-Roll Experimental Machine." With a compact design, it can be installed on laboratory workbenches or in draft chambers, and we can offer it at a low price due to a minimal equipment configuration. Thanks to the roll-to-roll processing technology we have developed over the years, the processing unit can propose a wide variety of treatments. Additionally, by swapping out the processing units, it can accommodate various types of processing. We have a proven track record in the battery and 5G industries. 【Features】 ■ Compact design allows installation on laboratory workbenches or in draft chambers ■ Low-cost proposals possible due to minimal equipment configuration ■ A wide variety of treatments possible by exchanging processing units *For more details, please refer to the PDF document or feel free to contact us.

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  • Testing Equipment and Devices

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What is roll to roll? ~Plating Edition Part 2~

We provide an easy-to-understand explanation of the "electrolytic plating" using the roll-to-roll method!

This document introduces the plating process conducted using a roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, we explain the electrolytic plating. In the section on types of electrolytic plating, we also introduce the features, conditions, and challenges. As mentioned in "Plating Part 1," both electrolytic and electroless plating have their own characteristics, so it is necessary to choose the plating that leverages those characteristics depending on the product being made. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

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"What is roll to roll?" We will explain from the basics to the plating process!

Currently presenting 6 points of materials! Our company, a technical group specialized in roll-to-roll manufacturing equipment, will explain roll-to-roll processes!

On this page, you can download a total of six documents, including the latest one and five from the past, that explain roll-to-roll technology. 【Document Contents】 - What is roll-to-roll? ~Basic Knowledge Edition~ - What is roll-to-roll? ~Reel Shaft Edition~ - What is roll-to-roll? ~Conveying Technology Edition~ - What is roll-to-roll? ~Surface Treatment Technology Edition~ - What is roll-to-roll? ~Plating Edition Part 1~ - 【Latest Edition】What is roll-to-roll? ~Plating Edition Part 2~ If you are interested in roll-to-roll technology or are facing issues with reel shafts, conveying technology, surface treatment, or plating, please feel free to download the documents or contact us.

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What is roll to roll? ~Plating Edition Part 1~

This will explain the methods and types of plating processes conducted using the roll-to-roll method, as well as electroless plating (chemical plating)!

This document introduces the plating process conducted using the roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, this document explains electroless plating (chemical plating). It also discusses the characteristics and challenges of electroless plating, as well as suitable equipment for this process. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.

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[Case Study of Air Pipe Introduction] Film Substrate Manufacturing Company T

Energy-saving and cost-saving! Same finish with low air consumption! Case study of SETO ENG. drainage air pipe.

The company T, which manufactures film substrates, has been facing a significant challenge with the high electricity consumption of air compressors used in the air pipe for the liquid cutting process before drying in each surface treatment device, as they have been promoting eco-friendliness and energy conservation in recent years. In response, we proposed our original air pipe, which we design and manufacture. As a result, in the comparison of liquid cutting efficiency, our product achieved a flow rate of 356 L/min, while Company A's product had a flow rate of 568 L/min, resulting in a 37% reduction in usage for our product. This result is expected to lead to energy savings and cost reductions. [Effects] - In the comparison of liquid cutting efficiency, our product achieved a flow rate of 356 L/min, while Company A's product had a flow rate of 568 L/min, resulting in a 37% reduction in usage for our product. - It is expected to lead to energy savings and cost reductions. *For more details, please refer to the PDF document or feel free to contact us.

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What is Roll to Roll? - Conveying Technology Edition -

Introducing the roll-to-roll transportation method! We will guide you to the appropriate transportation method according to the processing needs!

This document introduces the transportation technology related to "roll-to-roll." There are multiple types of roll-to-roll transportation methods, and the appropriate method varies depending on the surface treatment involved. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

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What is Roll to Roll? ~Surface Treatment Technology Edition~

Introducing various treatment methods, transport methods, and materials suitable for surface treatments such as surface protection, cleaning, degreasing, surface polishing, coating, etching, stripping, and plating!

This document introduces surface treatment technologies related to "roll to roll." Surface treatments are diverse, and it is essential to select the appropriate processing methods, transportation methods, and materials accurately for each treatment. We will introduce processing methods, transportation methods, and materials suitable for various surface treatments. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

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[Case Study] Electronic Circuit Board Manufacturer, Company S

Zero occurrence of metal foreign matter! Introducing a case study of Company S, which manufactures tape-shaped electronic substrates.

Company S manufactures substrates using a roll-to-roll method. When attaching and detaching reels that hold the substrates, the existing metal reel shafts caused metal foreign matter to be generated due to friction with the reels. As metal foreign matter adhering to the substrates often leads to product defects, it was urgent to implement improvements. Therefore, we developed an air shaft that grips the reels, made of resin to prevent the generation of metal foreign matter and to prevent the reels from spinning freely. As a result, by adopting the resin air shaft, we were able to suppress the generation of metal foreign matter in this area. [Overview] ■ Background leading to the introduction - Product defects and performance degradation caused by foreign matter adhering to the substrates. ■ Solution - Developed an air shaft that grips the reels, made of resin to prevent the generation of metal foreign matter and to prevent the reels from spinning freely. *For more details, please refer to the PDF document or feel free to contact us.

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What is Roll to Roll? - Reel Shaft Edition -

We are featuring information on reel shafts for winding and unwinding, dust prevention measures, and the introduction of air shafts!

This document introduces reel shafts related to "roll to roll." The winding and unwinding reel shafts vary in shaft diameter depending on the base material, and the shape of the shafts also differs based on the chucking method and the reel core. Please take a moment to read it. [Contents] ■ Winding and unwinding reel shafts ■ Dust prevention measures ■ Introduction to air shafts *For more details, please refer to the PDF document or feel free to contact us.

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What is Roll to Roll? ~Basic Knowledge Edition~

Introducing the basics of roll-to-roll! We also cover the advantages and disadvantages of core winding and reel winding!

This document introduces basic knowledge about "roll-to-roll." "Roll-to-roll" is a transport method that enables cost reduction, high productivity, continuous processing, and stable processing compared to traditional sheet-fed methods. Please take a moment to read it. [Contents] ■ What is roll-to-roll? ■ Basic knowledge of roll-to-roll technology *For more details, please refer to the PDF document or feel free to contact us.

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Plating device

At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!

As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.

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Air Shaft (Custom Product) "RC Series"

Our unique technology allows for built-in SW! We will manufacture according to the customer's desired specifications.

We would like to introduce our custom air shafts, the "RC Series," which we handle. Thanks to our unique technology, it is possible to incorporate SW (patent obtained). We will manufacture according to the specifications requested by our customers. They can be installed on TAB, COF, FPC-related devices, exposure devices, printing machines, PR coating devices, developing devices, etching devices, peeling devices, various plating equipment, and various inspection devices. 【Features】 ■ Main body materials: SUS, Ti, SS, MC nylon, peak material, etc. ■ Tip materials: SUS, Ti, SS, MC nylon, peak material, PP, etc. ■ Lug materials: SUS, Ti, SS, MC nylon, peak material (with surface urethane, etc.) ■ Chuck width: Maximum 500mm width compatible ■ Main body surface treatment: Lathe processing, polishing, electro-polishing, Ti coating, peak coating, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Resin Air Shaft (Standard Type) "SK Series"

We offer two types: "3 inches" and "1 inch"! Successfully made everything out of resin except for the mounting flange.

The "SK Series" is a standard resin air shaft that has successfully achieved an all-resin construction except for the mounting flange. There are two types available: one with a maximum load capacity of 30 kg, suitable for harsh environments and resistant to corrosion, known as the "3-inch," and another with a maximum load capacity of 10 kg, ideal for inspection machines, known as the "1-inch." These shafts can be installed on TAB/COF related devices, exposure equipment, printing machines, PR coating devices, developing equipment, etching devices, stripping devices, various plating equipment, and various inspection devices. 【Specifications】 ■ Main body material: MC Nylon ■ Tip material: PP (Natural) ■ Lug material: MC Nylon ■ Chuck width: MAX 160mm/105mm *For more details, please refer to the PDF document or feel free to contact us.

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Roll-to-roll etching device

Introducing a device that transports thin products using our conveying technology, ensuring they are moved without scratches or wrinkles for continuous processing.

The "Roll to Roll Etching Device" is a machine that continuously processes thin products without scratches or wrinkles using our transport technology. The transport speed is typically 5.0m/min. We will propose the device configuration tailored to the resin film materials (such as aluminum, copper, stainless steel, etc.) that you are targeting. 【Features】 ■ Device size: 15000mm(L) × 2100mm(W) × 2600mm(H) ■ Base material width: MAX 310mm ■ Processing steps: Unwinding ⇒ Etching processing ⇒ Washing ⇒ Drying ⇒ Winding ■ Transport speed: Typically 5.0m/min *For more details, please refer to the PDF document or feel free to contact us.

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Non-dissolving copper plating test device

Both sides can be processed! The material width can be up to 280mm, and the material thickness ranges from 25μm to 50μm.

The device is designed to perform copper plating process tests on the product pattern section of a film foil after undergoing pre-treatment, copper plating, washing, and drying processes, using a roll-to-roll vertical transport method for both sides of the product. The transport speed ranges from 0.1 to 0.5 m/min, with a maximum material width of 280 mm and a material thickness of 25 μm to 50 μm. The device consists of the following stages: unwinding, acidic degreasing, washing 1, feeding, acid activation, copper plating, recovery, feeding, washing 2, pure water wash, squeezing, air knife, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Processing surface: Both sides ■ Utilities: Power supply (AC 200・220V / 50・60HZ), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 5m (L) × 1m (W) × 1.3m (H) *excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

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Roll-to-roll plating test equipment

It is possible to provide equipment tailored to the size of your needs! Electroplating uses vertical transport.

Our company adopts vertical transport for electroplating, which excels in plating finish and maintenance. Additionally, by transporting in a U-shape, we can make the "roll-to-roll plating device" very compact, allowing us to provide equipment tailored to the desired size. Plating options include nickel, palladium, gold, copper, etc., and we can accommodate various requests through consultation. 【Features】 ■ Vertical transport is adopted for electroplating ■ Excellent plating finish and maintenance ■ Equipment can be provided to match the desired size ■ Plating options include nickel, palladium, gold, copper, etc., with various accommodations available through consultation *For more details, please refer to the PDF materials or feel free to contact us.

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Roll-to-roll winding and unwinding device

The transfer speed is 9.0m/min, and it can accommodate material widths up to 250mm! It can process both single-sided and double-sided.

The "Roll to Roll Winding and Unwinding Device" is a machine that continuously processes thin materials without scratches or wrinkles using our transportation technology. The transport speed is 9.0 m/min, and it can accommodate material widths up to 250 mm. The material thickness ranges from 25 μm and can be processed on one or both sides. By inserting various units between the unwinding and winding sections, it becomes a roll-to-roll device. 【Specifications】 ■ Lane Configuration: 1 Lane ■ Material Thickness: 25 μm and above ■ Device Configuration: Unwinding and Winding ■ Utility: Power Supply (AC 200/220V / 50/60Hz) ■ Dimensions: 3.0 m (L) × 1.2 m (W) × 1.7 m (H) *For more details, please refer to the PDF document or feel free to contact us.

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Clean inspection machine

Further localized cleaning in the inspection room! We also have various options available.

We would like to introduce our "Clean Inspection Machine," which allows for the management of cleanliness within the booth. By using an ionizer for static electricity removal, we prevent dust adhesion. You can choose from two types of ionizers. Additionally, the air shaft is equipped with our "SK-1MNP-NN" as standard, eliminating metal friction to prevent the adhesion of metal foreign objects. 【Features】 ■ Prevention of metal dust generation with the air shaft ■ Prevention of dust adhesion due to static electricity ■ Management of cleanliness within the booth ■ Ability to check particle conditions within the booth using a particle sensor ■ The air shaft comes standard with our "SK-1MNP-NN" (custom options are also available) *For more details, please refer to the PDF document or feel free to contact us.

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Electrolytic Ni/Au plating device

The transport speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.

This product is a device for electroplating Ni + Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pretreatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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Non-electrolytic tin plating equipment

The transfer speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.

This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is for TAB/CSP/COF ranging from 35 mm to 160 mm, and for FPC from 250 mm to 300 mm. The device consists of the following processes: unwinding → pretreatment → tin plating → post-treatment/water rinse → water wash → liquid separation → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material thickness: PI 25 μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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Peeling device

The material width supports 35mm to 160mm for TAB/CSP/COF and 250mm to 300mm for FPC!

The product is a device for removing photoresist and backstop agents after etching. The transport speed is 2.0 m/min, and the material width is 35 mm to 160 mm for TAB/CSP/COF, and 250 mm to 300 mm for FPC. The device consists of unwinding, peeling, washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25 μm and above ■ Processing surface: Single side ■ Utilities: Power supply AC 200/220V 50Hz/60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 16mL × 2.5mW × 2.5mH (excluding control panel and ancillary equipment) *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Resist Device

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Etching device (2)

The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.

The device continuously performs etching on thin single-layer substrates such as FPC using a roll-to-roll transport method. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, the temperature and pressure of the chemical solutions are precisely controlled. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Etching device (1)

The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).

The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration of unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can continuously process very thin and extremely fragile materials without causing scratches or wrinkles. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Other surface treatment equipment
  • Etching Equipment

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Backstop device

Device configuration for unwinding, backstop coating, drying, and winding! Backstop device with a transport speed of 1.5m to 2.0m.

We would like to introduce our "Backstop Device" that coats the backside of TAB device holes with resist. The transport speed is 1.5m to 2.0m/min, and the material thickness ranges from PI 25μm. The device consists of unwinding, backstop coating, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material width: For TAB/CSP/COF, 35mm to 160mm (none for FPC) ■ Processing side: Single side ■ Utility: Power supply AC200V・220V / 50Hz・60Hz, heat exhaust ■ Device dimensions: 24mL × 1mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Plating Equipment

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Development device

Development process after exposure of wiring patterns! Introduction of development equipment powered by AC 200V/220V, 50Hz/60Hz.

We would like to introduce our "Developing Equipment." This equipment is capable of developing after the exposure of wiring patterns. The processing surfaces can be single-sided or double-sided. The equipment configuration includes unwinding, developing, rinsing, liquid removal, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Transport speed: 2.0 m/min ■ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ■ Material thickness: PI 25μm and above ■ Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Image Processing Equipment

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Photoresist coating device (PR coating)

Introduction to a photoresist coating device with roll coat method pre-treatment and drying!

The device can coat photoresist onto copper foil. The processing surface can be single-sided or double-sided. It includes roll coating method pre-treatment and drying. Additionally, the device configuration consists of unwinding, pre-treatment, PRC, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Transport speed: 2.0 m/min ■ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ■ Material thickness: PI 25μm and above ■ Processing surface: single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Other surface treatment equipment

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Pre-processing research device (chemical polishing device)

The material thickness is PI 25μm or more! We would like to introduce a device for surface treatment of both sides of copper foil.

The device is capable of performing surface treatment on both sides of copper foil. The lane configuration is 2 lanes, and the processing surfaces are single-sided and double-sided. The device configuration consists of unwinding, electro-degreasing, acid cleaning, chemical treatment, acid cleaning, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 lanes ■ Transport speed: 1.5m to 3.0m/min ■ Material width: For TAB/CSP/COF 35mm to 160mm (For FPC 250 to 300mm) ■ Material thickness: PI 25μm and above ■ Processing surfaces: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Other surface treatment equipment

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Non-electrolytic copper plating device

No scratches or wrinkles during transport! By adopting an UP/DOWN processing method in the processing section, it is possible to shorten the overall length of the device.

The device can perform copper plating treatment on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our transport technology. By adopting UP/DOWN processing methods in the treatment section, it is possible to shorten the overall length of the device. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m/min (Max 1.5m/min) ■ Material width: MAX 600mm ■ Material thickness: 50μm and above ■ Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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Electrolytic copper plating device (non-dissolving copper plating)

We would like to introduce a device that performs copper plating on the product pattern section using a vertical transport method.

The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out using a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.0m/min ■ Material width: MAX 300mm ■ Material thickness: 25μm to 50μm ■ Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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Dissolving copper plating device

Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.

The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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DPS device

Introducing the DPS device that generates a conductive film inside vias as a pretreatment for electroplating copper!

The device can generate a conductive coating inside vias as a pretreatment for electrolytic copper plating for blind vias and through holes. The processing surface is double-sided, and the power supply is AC 200V/220V / 50Hz/60Hz. The device configuration consists of unwinding, degreasing, micro-etching, activation, metallization, stabilization, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.0m/min (depending on specifications) ■ Material width: 70mm to 160mm (for FPC 250 to 300mm) ■ Material thickness: PI 25μm ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment

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Roll-to-roll cleaning device

Cleaning of films with ITO coatings is also possible! Introduction of equipment for rough cleaning, finishing cleaning, drying, and winding.

This product is a roll-to-roll cleaning device for film materials (film-like). After rough cleaning and finishing cleaning, it dries and rewinds the material, and it is capable of cleaning film materials with ITO films used in organic EL lighting. Additionally, the processing surface is double-sided. 【Specifications】 ■ Processing surface: Double-sided ■ Device configuration: Unwinding → UV cleaning → Brush cleaning (such as PVA) → Ultrasonic cleaning → Two-fluid cleaning → M/S cleaning → Direct water wash → Liquid draining → Drying → Rewinding ■ Utilities: Power supply (AC 200・220V / 50・60HZ), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Ultrasonic Cleaner

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Desmia device

Remove smearing after drilling holes such as blind vias and through holes with a laser drill!

SETO ENGINEERING Co., Ltd. handles the "Desmia Device." This device can remove smears after drilling blind vias and through holes using laser drills and other methods. The line configuration is single-lane, and the processing surface is double-sided. The device configuration includes unwinding, degreasing, etching, neutralization and reduction, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Line configuration: 1 lane ■ Conveying speed: 0.5–1.0 m/min (depending on specifications) ■ Material width: 70 mm–160 mm (for FPC 250–300 mm) ■ Material thickness: PI 25 μm and above ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • drill
  • Drying Equipment

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TAB/COF manufacturing equipment

It is possible to have a large effective pattern area, allowing for effective use of materials.

The "TAB・COF manufacturing device" can unwind product reels in sync with continuous transport without affecting the line transport. The tension controller maintains a constant rotation speed for the product unwind reel. The tension at the unwind section can vary depending on the product width, but for a width of 96mm, transport is possible at under 100g. Additionally, in the tact transport method, products are fed using nip rollers or a single-axis robot for chucking, and for handling fine items, positioning often employs an auto-alignment method using a camera. 【Features】 ■ Products can be continuously processed under the same conditions, flowing in units of several hundred meters at a constant speed. ■ Product quality, such as yield, is improved. ■ Continuous product flow eliminates the need for unnecessary transport fixtures. ■ It is possible to maximize the effective pattern area. ■ Effective use of materials becomes possible, which is particularly advantageous in terms of cost. *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Etching Equipment
  • Other semiconductor manufacturing equipment

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Etching device

Etching device

Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.

  • Etching Equipment

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Roll-to-roll plating test equipment

Shortening the processing time of the plating process: "Roll to Roll Plating Test"

Adoption of vertical transport for electroplating Excellent plating finish and maintenance Roll-to-roll plating test equipment 【Features】 ○ By transporting in a U-shape, the equipment is made very compact, allowing for customization to the desired size ○ Plating options include nickel, palladium, gold, copper, etc., with various options available upon consultation ○ Equipment size: 2100mm (L) × 2650mm (W) × 1950mm (H) ○ Substrate width: MAX 200mm ○ Processing steps: Unwinding, pretreatment, plating, cleaning, drying, winding We have numerous achievements with equipment that adopts roll-to-roll technology. If you have any questions about additional functions or current issues, please feel free to contact us.

  • Image Processing Equipment

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Resin air shaft

Resin air shaft

■SK Series (Standard Products) - 3 inches (Load capacity 30kg) *Max width 160mm - 1 inch (Load capacity 10kg) *Max width 105mm (for inspection machines) By using MC nylon, we have eliminated debris caused by metal powder. As a standard product, we can offer it at a low price (from 51,000). ■RC Series (Custom Products) - 3 inches (Load capacity 50kg) *Tip S/W (patent pending) - 1 inch (Load capacity 30kg) We will create products in response to customer requests. We can accommodate work widths from 35nm to 500mm. For details, please check under 'Download'.

  • Printing Machinery
  • Resin processing machine

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